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TPS3619-33MDGKREP

Texas Instruments

TPS3619-33MDGKREP by Texas Instruments

TPS3619-33MDGKREP by Texas Instruments is a Power Management IC with 3.3V nominal voltage, suitable for military applications. It features a small outline package style, dual terminal position, and nickel palladium gold finish. With a wide operating temperature range of -55 to 125 °C, it offers power supply support for various systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 9,500 parts In-Stock

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Vyrian

USA . 7,600 parts In-Stock

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7,600

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Digiode

USA . 143 parts In-Stock

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143

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Nova Conductors

Japan . 15 parts In-Stock

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One Stop Electronics

USA . 1,384 parts In-Stock

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$0.500

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1,384

$0.500

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Semicontronic

India . 172 parts In-Stock

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$1.500

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$1.462

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$1.455

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172

$1.500

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$1.455

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Corohmni

South Africa . 169 parts In-Stock

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$1.573

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169

$1.573

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Parana Technologies

USA . 1,131 parts In-Stock

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$4.960

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$5.502

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$4.960

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DigiPath Technology Company

USA . 1,238 parts In-Stock

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$5.462

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$5.025

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ChromeModa Solutions

Germany . 4,489 parts In-Stock

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$5.573

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$4.570

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IDEA Electronic Components Group

UK . 403 parts In-Stock

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$5.573

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$5.016

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Ampacity Inc.

Singapore . 1,027 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 811 parts In-Stock

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$14.344

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$18.328

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$16.678

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$15.029

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A-Z Elektronik GmbH

Germany . 7,173 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 3,517 parts In-Stock

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Kepictronics

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Perfect Parts

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Argo Parts USA

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Overview

Unleash the power of Texas Instruments with the TPS3619-33MDGKREP Power Management IC. Crafted with precision and expertise, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, this small outline, thin profile IC delivers a nominal supply voltage of 3.3V with a terminal finish of nickel palladium gold. Experience the military-grade performance and efficiency of this power supply support circuit, providing customers with unmatched value and benefits. Embrace innovation and take your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is suitable for a wide range of applications, providing a stable power source.

No. of Terminals: 8

With 8 terminals, the product can support multiple connections and functionalities.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures reliable performance even in challenging environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent conductivity and corrosion resistance.

Width (mm): 3 mm

The compact 3mm width allows for easy integration into compact electronic devices.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage ensures the product can operate efficiently even with low power sources.

Maximum Time at Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds reduces the risk of component damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures thorough soldering for a reliable connection.

Temperature Grade: MILITARY

The military-grade temperature rating ensures durability and performance in harsh conditions.

Maximum Supply Current (Isup): 0.04 mA

The low supply current consumption makes the product energy-efficient.

Terminal Pitch: 0.65 mm

The small terminal pitch provides high-density mounting for space-constrained applications.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage allows for compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs TPS3619-33MDGKREP attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

MANUAL RESET; POWER ON RESET GENERATOR; VOLTAGE MONITOR FOR POWER-FAIL OR LOW-BATTERY MONITORING

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

2.93

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS3619-33MDGKREP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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