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TPS3613-01DGSRG4

Texas Instruments

TPS3613-01DGSRG4 by Texas Instruments

TPS3613-01DGSRG4 by Texas Instruments is a Power Management IC with 1.8V nominal voltage, suitable for industrial applications. It features dual terminals, CMOS technology, and adjustable threshold voltage. The IC has a small outline package style with a max operating temperature of 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,153 parts In-Stock

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7,153

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Digiode

USA . 3,330 parts In-Stock

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3,330

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Distributors (Availability)

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Ampacity Inc.

Singapore . 336 parts In-Stock

1+ parts

$1.500

100+ parts

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336

$1.500

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Semicontronic

India . 1,284 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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1,284

$3.500

$3.412

$3.395

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Parana Technologies

USA . 790 parts In-Stock

1+ parts

$4.854

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-

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$5.376

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790

$4.854

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$5.376

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DigiPath Technology Company

USA . 2,194 parts In-Stock

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$5.345

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2,194

$5.345

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ChromeModa Solutions

Germany . 6,296 parts In-Stock

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$5.454

100+ parts

$4.472

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6,296

$5.454

$4.472

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IDEA Electronic Components Group

UK . 411 parts In-Stock

1+ parts

$5.454

100+ parts

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$4.909

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411

$5.454

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$4.909

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One Stop Electronics

USA . 1,408 parts In-Stock

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$5.500

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1,408

$5.500

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AZTECH Wire

Italy . 296 parts In-Stock

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$10.749

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296

$10.749

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A-Z Elektronik GmbH

Germany . 6,182 parts In-Stock

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Perfect Parts

USA . 5,600 parts In-Stock

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Corphita

USA . 4,213 parts In-Stock

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Microchip USA

USA . 2,404 parts In-Stock

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Corohmni

South Africa . 498 parts In-Stock

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498

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Overview

Enhance your power management solutions with the TPS3613-01DGSRG4 by Texas Instruments. A top-tier manufacturer in the industry, Texas Instruments delivers unmatched quality and reliability. Ideal for a wide range of applications, this Power Management IC offers exceptional value with its small outline, thin profile package and adjustable threshold voltage feature. Experience the benefits of precise power supply support circuitry, dual terminal position, and industrial grade temperature range. Trust Texas Instruments to provide innovative solutions for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate into circuit boards, simplifying the assembly process.

Nominal Supply Voltage (Vsup): 1.8 V

Operates at a stable supply voltage of 1.8V, providing consistent performance.

No. of Terminals: 10

Having 10 terminals allows for versatile connectivity options and integration with other components in a circuit.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial applications where heat may be a concern.

Technology: CMOS

Uses CMOS technology which offers low power consumption and high noise immunity, making it efficient in power management tasks.

Technical Specifications

Power Management ICs TPS3613-01DGSRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.15V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS3613-01DGSRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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