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TPS3600D50PWG4

Texas Instruments

TPS3600D50PWG4 by Texas Instruments

TPS3600D50PWG4 by Texas Instruments is a Power Management IC with 5V nominal voltage, suitable for industrial applications. It features a small outline package with 14 terminals and operates b/w -40 to 85°C. With surface mount capability and dual terminal position, it offers efficient power supply management in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,896 parts In-Stock

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Digiode

USA . 2,017 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 900 parts In-Stock

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$5.500

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900

$5.500

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Semicontronic

India . 344 parts In-Stock

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$6.500

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$6.338

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$6.305

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344

$6.500

$6.338

$6.305

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Ampacity Inc.

Singapore . 1,308 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 375 parts In-Stock

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$10.220

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$10.220

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Parana Technologies

USA . 653 parts In-Stock

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$21.276

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$21.585

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653

$21.276

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$21.585

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ChromeModa Solutions

Germany . 2,459 parts In-Stock

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$23.906

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$19.603

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$23.906

$19.603

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IDEA Electronic Components Group

UK . 116 parts In-Stock

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$23.906

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$22.711

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$21.515

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$21.515

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Corphita

USA . 3,146 parts In-Stock

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Microchip USA

USA . 2,485 parts In-Stock

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Corohmni

South Africa . 485 parts In-Stock

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DigiPath Technology Company

USA . 62 parts In-Stock

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$21.554

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Overview

Unlock the power of efficient power management with the TPS3600D50PWG4 by Texas Instruments. Designed with precision and reliability in mind, this Power Management IC offers unparalleled performance for a wide range of applications. From industrial settings to consumer electronics, this product is a game-changer in maximizing energy efficiency and optimizing power supplies. Trust in Texas Instruments' reputation for quality and innovation, and experience the superior benefits and value that the TPS3600D50PWG4 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ensuring reliable performance.

Surface Mount

Being surface mountable allows for easy and efficient PCB assembly, saving valuable space on the board.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5V is commonly used in many electronic systems, making this product compatible with a wide range of applications.

No. of Terminals: 14

Having 14 terminals provides flexibility in connecting to other components or peripherals, enhancing the versatility of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand demanding environmental conditions without sacrificing performance.

Minimum Operating Temperature: -40 °C

The product is designed to operate reliably even in extreme cold temperatures as low as -40°C, ensuring consistent performance in a variety of environments.

Width (mm): 4.4 mm

The compact width of 4.4mm enables space-saving design and integration into compact electronic devices.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage of 1.65V allows the product to be used in energy-efficient applications that require lower power consumption.

Maximum Supply Current (Isup): 0.04 mA

The low maximum supply current of 0.04mA indicates energy efficiency and helps in reducing power consumption, making it an eco-friendly choice.

Technical Specifications

Power Management ICs TPS3600D50PWG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.4V; MANUAL RESET, POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.4V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

TPS3600D50PWG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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