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TPS3307-33DRG4

Texas Instruments

TPS3307-33DRG4 by Texas Instruments

TPS3307-33DRG4 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 8 terminals, and 1.75mm seated height. It is used in industrial applications for power supply support circuits due to its adjustable threshold feature and CMOS technology.

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Bristol Electronics

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Dark Horse Electronics

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One Stop Electronics

USA . 325 parts In-Stock

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Ampacity Inc.

Singapore . 1,430 parts In-Stock

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Semicontronic

India . 1,468 parts In-Stock

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AZTECH Wire

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Corohmni

South Africa . 51 parts In-Stock

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Parana Technologies

USA . 2,020 parts In-Stock

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DigiPath Technology Company

USA . 1,456 parts In-Stock

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ChromeModa Solutions

Germany . 792 parts In-Stock

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IDEA Electronic Components Group

UK . 671 parts In-Stock

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Overview

Elevate your power management capabilities with the TPS3307-33DRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This Power Management IC is versatile and perfect for a wide range of applications. With a nominal supply voltage of 3.3V and adjustable threshold, this small-outline package offers outstanding performance. Trust in Texas Instruments for cutting-edge technology that provides value, benefits, and advantages to customers looking for superior power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the IC, making it a reliable choice for power management.

Surface Mount: YES

The ability to be surface mounted allows for easy integration onto circuit boards, saving time and effort during the manufacturing process.

Nominal Supply Voltage (Vsup): 3.3 V

With a stable nominal supply voltage, this IC can efficiently regulate power within a specific range, ensuring consistent performance.

Power Supplies (V): 2/6

This IC can handle a range of power supplies, making it versatile and adaptable to different applications.

No. of Terminals: 8

The ample number of terminals allows for multiple connections, enhancing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making this IC ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures that the IC can withstand harsh environmental conditions, increasing its reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of environments, making this IC versatile.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections over time.

Maximum Seated Height: 1.75 mm

The low seated height allows for a more compact design, ideal for space-constrained applications.

Width (mm): 3.9 mm

The narrow width of the IC allows for efficient use of PCB real estate, making it suitable for densely populated circuit boards.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC's power supply support circuitry enhances the stability and efficiency of power management systems.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage requirement allows for use in low-power applications, increasing its versatility.

Maximum Time At Peak Reflow Temperature (s): 30

The IC can withstand peak reflow temperatures for extended periods during manufacturing, ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this IC can be used in lead-free soldering processes, meeting modern manufacturing standards.

Length: 4.9 mm

The compact length of the IC makes it suitable for small form factor devices, where space is limited.

Nominal Threshold Voltage (V): +1.25,2.93,4.55V

The multiple nominal threshold voltages offer flexibility in power management applications, accommodating different voltage requirements.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures the IC can operate reliably in demanding industrial environments.

Maximum Supply Current (Isup): 0.04 mA

With a low supply current, this IC consumes minimal power, making it energy-efficient.

No. of Channels: 3

The multiple channels allow for independent power management functions, enhancing the IC's functionality.

Technology: CMOS

The CMOS technology used in this IC provides low power consumption and high noise immunity, improving overall performance.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto the PCB, simplifying the assembly process.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for compatibility with commonly used PCB layouts, ensuring easy integration.

Maximum Supply Voltage (Vsup): 6 V

With a high maximum supply voltage, this IC can accommodate a wide range of power supply inputs, increasing its versatility.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization of voltage thresholds, enabling precise power management control.

Technical Specifications

Power Management ICs TPS3307-33DRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.55V; MANUAL RESET INPUT; POWER-ON RESET GENERATOR

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.25,2.93,4.55V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS3307-33DRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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