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TPS3306-25DGKR

Texas Instruments

TPS3306-25DGKR by Texas Instruments

TPS3306-25DGKR by Texas Instruments is a power management IC with a nominal voltage of 3.3V and power supplies of 3/5V. It is a small outline, thin profile package with a max operating temperature of 85°C. This IC is commonly used in industrial applications for power supply management circuits.

Median Price

$2.034

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 24,939 parts In-Stock

1+ parts

$2.034

100+ parts

$1.782

1k+ parts

$1.007

10k+ parts

-

24,939

$2.034

$1.782

$1.007

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.007

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.007

-

-

-

Digiode

USA . 2,816 parts In-Stock

1+ parts

$1.932

100+ parts

-

1k+ parts

-

10k+ parts

-

2,816

$1.932

-

-

-

Vyrian

USA . 8,606 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,606

-

-

-

-

ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,895 parts In-Stock

1+ parts

$1.007

100+ parts

-

1k+ parts

-

10k+ parts

$0.987

2,895

$1.007

-

-

$0.987

Argo Parts USA

USA . 2,154 parts In-Stock

1+ parts

$1.007

100+ parts

-

1k+ parts

-

10k+ parts

-

2,154

$1.007

-

-

-

Semicontronic

India . 24,897 parts In-Stock

1+ parts

$1.730

100+ parts

$1.687

1k+ parts

$1.678

10k+ parts

-

24,897

$1.730

$1.687

$1.678

-

Ampacity Inc.

Singapore . 24,604 parts In-Stock

1+ parts

$1.730

100+ parts

-

1k+ parts

-

10k+ parts

-

24,604

$1.730

-

-

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Corphita

USA . 4,657 parts In-Stock

1+ parts

$1.831

100+ parts

-

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4,657

$1.831

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Parana Technologies

USA . 1,947 parts In-Stock

1+ parts

$6.398

100+ parts

-

1k+ parts

$7.147

10k+ parts

-

1,947

$6.398

-

$7.147

-

DigiPath Technology Company

USA . 50 parts In-Stock

1+ parts

$7.045

100+ parts

$6.482

1k+ parts

-

10k+ parts

-

50

$7.045

$6.482

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-

ChromeModa Solutions

Germany . 3,784 parts In-Stock

1+ parts

$7.189

100+ parts

$5.895

1k+ parts

-

10k+ parts

-

3,784

$7.189

$5.895

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IDEA Electronic Components Group

UK . 222 parts In-Stock

1+ parts

$7.189

100+ parts

-

1k+ parts

$6.470

10k+ parts

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222

$7.189

-

$6.470

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AZTECH Wire

Italy . 668 parts In-Stock

1+ parts

$11.470

100+ parts

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668

$11.470

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A-Z Elektronik GmbH

Germany . 6,690 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,690

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-

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Kepictronics

USA . 1,470 parts In-Stock

1+ parts

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1,470

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Overview

Experience the power of quality with the TPS3306-25DGKR by Texas Instruments. As a leading manufacturer in Power Management ICs, Texas Instruments delivers exceptional products that prioritize reliability and performance. The TPS3306-25DGKR offers a wide range of applications, making it versatile for various industries. With its small outline, thin profile, and shrink pitch package style, this product provides convenient integration and space-saving solutions. Benefit from its nominal supply voltage of 3.3V, ensuring efficient power management. Whether you're designing for industrial or consumer electronics, the TPS3306-25DGKR guarantees maximum reliability and performance without compromise. Trust Texas Instruments for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to moisture, making the product suitable for various environments.

Surface Mount: YES

The ability to be surface mounted allows for easy assembly and integration into electronic devices.

Package Shape: SQUARE

The square shape enables efficient utilization of board space, making it ideal for applications with limited area.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage ensures compatibility with a wide range of electronic components and devices.

Power Supplies (V): 3/5

The dual power supply options of 3V and 5V provide flexibility to meet different system requirements.

No. of Terminals: 8

With 8 terminals, this power management IC offers sufficient connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enhance space efficiency and ease of integration.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can reliably function in high-temperature environments.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on the terminals provides excellent conductivity and corrosion resistance, enhancing the IC's lifespan.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options, facilitating integration with various circuit layouts.

Maximum Seated Height: 1.1 mm

With a low height of 1.1mm, this IC can be used in slim electronic devices without compromising space constraints.

Width (mm): 3 mm

The product's compact width of 3mm further contributes to space-saving designs.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

This IC provides efficient power supply management, enhancing the overall performance and reliability of the system.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V ensures compatibility with low-power applications, offering greater versatility.

Maximum Time At Peak Reflow Temperature (s): 30

The IC can withstand a maximum reflow temperature for up to 30 seconds during manufacturing processes, ensuring its robustness.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliable connections.

Length: 3 mm

With a compact length of 3mm, this IC is suitable for space-constrained applications.

Nominal Threshold Voltage (V): +2.93, 2.25V

The nominal threshold voltage of +2.93V and 2.25V facilitates precise voltage regulation and protection in power management applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC operates reliably under harsh temperature conditions, making it a robust choice.

Maximum Supply Current (Isup): 0.04 mA

The low maximum supply current of 0.04mA ensures minimal power consumption and efficient energy management.

No. of Channels: 2

With two channels, this IC provides multiple independent outputs or inputs, enabling versatile power management capabilities.

Terminal Form: GULL WING

The gull wing terminal form simplifies PCB assembly, ensuring secure and reliable solder joints.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65mm allows for proper spacing and alignment during PCB mounting.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6V enables compatibility with higher voltage systems, providing versatility in various applications.

Technical Specifications

Power Management ICs TPS3306-25DGKR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93,2.25V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS3306-25DGKR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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