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TPS3125G15DBVTG4

Texas Instruments

TPS3125G15DBVTG4 by Texas Instruments

TPS3125G15DBVTG4 by Texas Instruments is a Power Management IC with 1.5V nominal voltage, suitable for industrial applications. It features a small outline package with dual terminals and operates b/w -40 to 85°C temperature range. With a max supply current of 0.025mA, it supports power supply circuits efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,465 parts In-Stock

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Digiode

USA . 1,926 parts In-Stock

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1,926

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Nova Conductors

Japan . 700 parts In-Stock

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700

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One Stop Electronics

USA . 1,104 parts In-Stock

1+ parts

$0.500

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1,104

$0.500

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Ampacity Inc.

Singapore . 775 parts In-Stock

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$2.500

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775

$2.500

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AZTECH Wire

Italy . 508 parts In-Stock

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$12.046

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508

$12.046

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Parana Technologies

USA . 2,029 parts In-Stock

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$17.553

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$17.749

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2,029

$17.553

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$17.749

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DigiPath Technology Company

USA . 495 parts In-Stock

1+ parts

$19.329

100+ parts

$17.782

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495

$19.329

$17.782

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ChromeModa Solutions

Germany . 3,968 parts In-Stock

1+ parts

$19.723

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$16.173

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3,968

$19.723

$16.173

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IDEA Electronic Components Group

UK . 2,120 parts In-Stock

1+ parts

$19.723

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$18.737

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$17.751

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2,120

$19.723

$18.737

$17.751

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Microchip USA

USA . 1,860 parts In-Stock

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Corphita

USA . 688 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Discover the TPS3125G15DBVTG4 by Texas Instruments, a top-quality Power Management IC that offers unparalleled performance and reliability. Manufactured by the trusted brand Texas Instruments, this product is perfect for a wide range of applications in various industries. With its small outline, low profile package style and dual terminal position, this IC is incredibly versatile and easy to use. Experience the benefits of this high-quality power supply support circuit, from its wide operating temperature range to its nickel/palladium/gold terminal finish. Trust Texas Instruments to deliver exceptional value and efficiency with the TPS3125G15DBVTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good durability and protection for the internal components of the Power Management IC.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and resources during manufacturing.

Nominal Supply Voltage (Vsup): 1.5 V

The nominal supply voltage of 1.5V provides a stable power source for the Power Management IC to operate efficiently.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this Power Management IC can withstand high temperature environments, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliable performance in cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall reliability of the Power Management IC.

Width (mm): 1.6 mm

With a compact width of 1.6mm, this Power Management IC can be easily integrated into space-constrained electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this Power Management IC can function reliably in harsh industrial environments with varying temperature conditions.

Technical Specifications

Power Management ICs TPS3125G15DBVTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

MANUAL RESET INPUT; POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

.75 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.40V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TPS3125G15DBVTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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