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TPS3106E09DBVTG4

Texas Instruments

TPS3106E09DBVTG4 by Texas Instruments

TPS3106E09DBVTG4 by Texas Instruments is a Power Management IC with Vsup of 0.9V, Isup of 0.022mA, and Vmax of 3.6V. It is used in industrial applications for power supply support circuits due to its compact size and CMOS technology.

Median Price

$1.180

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20 parts In-Stock

1+ parts

$1.180

100+ parts

$1.160

1k+ parts

$1.130

10k+ parts

-

20

$1.180

$1.160

$1.130

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,748 parts In-Stock

1+ parts

$1.606

100+ parts

-

1k+ parts

-

10k+ parts

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1,748

$1.606

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-

-

Vyrian

USA . 3,484 parts In-Stock

1+ parts

-

100+ parts

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3,484

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-

-

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Sea View Technologies

USA . 707 parts In-Stock

1+ parts

-

100+ parts

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707

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Bristol Electronics

USA . 707 parts In-Stock

1+ parts

-

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1k+ parts

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10k+ parts

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707

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 20 parts In-Stock

1+ parts

$1.440

100+ parts

-

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-

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20

$1.440

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Corphita

USA . 2,389 parts In-Stock

1+ parts

$1.521

100+ parts

-

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2,389

$1.521

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AZTECH Wire

Italy . 293 parts In-Stock

1+ parts

$11.450

100+ parts

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293

$11.450

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Parana Technologies

USA . 2,345 parts In-Stock

1+ parts

$15.710

100+ parts

-

1k+ parts

$16.075

10k+ parts

-

2,345

$15.710

-

$16.075

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DigiPath Technology Company

USA . 1,538 parts In-Stock

1+ parts

$17.299

100+ parts

$15.915

1k+ parts

-

10k+ parts

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1,538

$17.299

$15.915

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ChromeModa Solutions

Germany . 4,385 parts In-Stock

1+ parts

$17.652

100+ parts

$14.475

1k+ parts

-

10k+ parts

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4,385

$17.652

$14.475

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IDEA Electronic Components Group

UK . 50 parts In-Stock

1+ parts

$17.652

100+ parts

$16.769

1k+ parts

$15.887

10k+ parts

-

50

$17.652

$16.769

$15.887

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QUARKTWIN TECHNOLOGY LTD

USA . 12,167 parts In-Stock

1+ parts

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12,167

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Microchip USA

USA . 4,215 parts In-Stock

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4,215

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Overview

Enhance the efficiency of your power management system with the TPS3106E09DBVTG4 by Texas Instruments. Designed with top-quality materials and cutting-edge technology, this Power Management IC offers reliability and performance like no other. Perfect for a wide range of applications, this product provides customers with value, benefits, and advantages that are unparalleled. Upgrade your system today with the TPS3106E09DBVTG4 and experience the difference in quality and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the power management IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and making it suitable for compact electronic devices.

Package Shape: RECTANGULAR

Simplifies the design and layout of the PCB, making it easier to integrate into electronic systems.

Nominal Supply Voltage (Vsup): 0.9 V

Efficiently operates at a low voltage, reducing power consumption and heat generation.

Power Supplies (V): 0.4/3.3

Provides a wide range of power supply options, making it versatile for different applications.

No. of Terminals: 6

Offers multiple connection points for voltage input and output, enhancing flexibility in system design.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial settings or environments with elevated heat levels.

Minimum Operating Temperature: -40 °C

Functions reliably in cold temperatures, ensuring consistent performance in various operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, enhancing the reliability and longevity of the IC.

Maximum Seated Height: 1.45 mm

Has a low profile design, allowing for compact installations in space-constrained devices.

Technology: CMOS

Utilizes CMOS technology for efficient power management and low power consumption, ideal for extending battery life in portable electronics.

Technical Specifications

Power Management ICs TPS3106E09DBVTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 0.86V; POWER ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.4/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.022 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage (Vsup):

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+0.86V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TPS3106E09DBVTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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