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TPS2095DG4

Texas Instruments

TPS2095DG4 by Texas Instruments

TPS2095DG4 by Texas Instruments is a 16-terminal MOS driver with built-in protections for over current, thermal, and under voltage. It operates b/w 2.7-5.5V with a max output current of 0.25A, making it ideal for buffer or inverter based peripheral driver applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,159 parts In-Stock

1+ parts

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3,159

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Digiode

USA . 559 parts In-Stock

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559

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 610 parts In-Stock

1+ parts

$2.439

100+ parts

-

1k+ parts

$2.934

10k+ parts

-

610

$2.439

-

$2.934

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DigiPath Technology Company

USA . 1,280 parts In-Stock

1+ parts

$2.685

100+ parts

$2.470

1k+ parts

-

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1,280

$2.685

$2.470

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ChromeModa Solutions

Germany . 3,251 parts In-Stock

1+ parts

$2.740

100+ parts

$2.247

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3,251

$2.740

$2.247

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IDEA Electronic Components Group

UK . 408 parts In-Stock

1+ parts

$2.740

100+ parts

-

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$2.466

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408

$2.740

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$2.466

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One Stop Electronics

USA . 395 parts In-Stock

1+ parts

$11.500

100+ parts

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395

$11.500

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$11.753

100+ parts

$10.695

1k+ parts

$9.637

10k+ parts

-

40

$11.753

$10.695

$9.637

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AZTECH Wire

Italy . 808 parts In-Stock

1+ parts

$12.796

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808

$12.796

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Corphita

USA . 4,293 parts In-Stock

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4,293

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Microchip USA

USA . 2,325 parts In-Stock

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2,325

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Cyclops Electronics Ltd (Excess)

UK . 135 parts In-Stock

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135

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Perfect Parts

USA . 90 parts In-Stock

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90

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Overview

Elevate your electronics projects with the TPS2095DG4 by Texas Instruments, a top-of-the-line peripheral driver that promises unmatched quality and reliability. With built-in protections against overcurrent, thermal issues, and undervoltage situations, this compact device ensures seamless operation for a wide range of applications. Whether you're designing consumer gadgets or industrial machinery, this versatile product offers unparalleled value, benefits, and advantages to customers looking for high-performance solutions. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for compatibility with a wide range of systems and devices.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and longevity of the peripheral driver by preventing damage from over current, thermal issues, and under voltage conditions.

Technology: MOS

The MOS technology provides efficient and reliable performance for the peripheral driver.

Maximum Output Current: 0.25 A

The high maximum output current allows the peripheral driver to drive various components and devices effectively.

Technical Specifications

Peripheral Drivers TPS2095DG4 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.25 A

Nominal Output Peak Current Limit:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Current:

.11 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

40000 us

Turn-on Time:

20000 us

Width:

3.9 mm

Trade Compliance

TPS2095DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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