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TPIC82000FFE

Texas Instruments

TPIC82000FFE by Texas Instruments

TPIC82000FFE by Texas Instruments is a telecom IC with 16 terminals, operating temperature range of -40 to 125°C. It features a ceramic-metal sealed co-fired package suitable for automotive applications. With a nominal voltage of 3V, it is designed for telecom circuits in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,834 parts In-Stock

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4,834

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Vyrian

USA . 3,425 parts In-Stock

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3,425

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Parana Technologies

USA . 1,976 parts In-Stock

1+ parts

$6.094

100+ parts

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1k+ parts

$6.869

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1,976

$6.094

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$6.869

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ChromeModa Solutions

Germany . 5,796 parts In-Stock

1+ parts

$6.847

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$5.615

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5,796

$6.847

$5.615

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IDEA Electronic Components Group

UK . 120 parts In-Stock

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$6.847

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$6.162

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120

$6.847

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$6.162

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AZTECH Wire

Italy . 315 parts In-Stock

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$12.184

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315

$12.184

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Semicontronic

India . 786 parts In-Stock

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$123.000

100+ parts

$119.925

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$119.310

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786

$123.000

$119.925

$119.310

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One Stop Electronics

USA . 1,607 parts In-Stock

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$613.000

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1,607

$613.000

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Ampacity Inc.

Singapore . 479 parts In-Stock

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$968.000

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479

$968.000

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Corphita

USA . 3,063 parts In-Stock

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3,063

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Corohmni

South Africa . 445 parts In-Stock

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445

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DigiPath Technology Company

USA . 291 parts In-Stock

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$6.173

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291

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$6.173

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Overview

Enhance your telecom interface with the TPIC82000FFE by Texas Instruments, a high-quality IC designed to deliver superior performance and reliability. With a focus on automotive applications, this product boasts a rugged package body material for durability in challenging environments. Its innovative design and advanced features make it an ideal choice for various telecom functions, offering customers unmatched value and benefits. Upgrade your systems today with the TPIC82000FFE and experience the difference Texas Instruments can make in your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent heat dissipation and durability, ensuring reliable performance in a variety of operating conditions.

Surface Mount: YES

Surface mount capability allows for easy installation and saves space on the circuit board, making it ideal for compact designs.

No. of Terminals: 16

With 16 terminals, this product offers versatile connectivity options for various interfaces, enhancing its compatibility with different systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures that this product can withstand high heat levels, making it suitable for demanding industrial or automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this product to function effectively in extremely cold environments, expanding its usability in diverse settings.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets stringent temperature requirements and reliability standards, making it a trusted choice for automotive systems.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V, this product offers energy-efficient performance and is compatible with a wide range of power sources, enhancing its versatility in different setups.

Technical Specifications

Other Function Telecom Interface ICs TPIC82000FFE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

X-CUUC-N16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

TPIC82000FFE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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