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TPA6139A2RGTT

Texas Instruments

TPA6139A2RGTT by Texas Instruments

TPA6139A2RGTT by Texas Instruments is a Class AB audio amplifier with 16 terminals in a square chip carrier package. Operating b/w -40 to 150°C, it supports power supplies of 3.3V and nominal output power of 0.025W. Ideal for automotive applications due to its compact size and high-temperature tolerance.

Median Price

$0.835

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,485 parts In-Stock

1+ parts

$1.096

100+ parts

$0.745

1k+ parts

$0.382

10k+ parts

-

6,485

$1.096

$0.745

$0.382

-

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.574

10k+ parts

-

1,000

-

-

$0.574

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,893 parts In-Stock

1+ parts

$1.041

100+ parts

-

1k+ parts

-

10k+ parts

-

1,893

$1.041

-

-

-

Vyrian

USA . 2,616 parts In-Stock

1+ parts

$1.096

100+ parts

-

1k+ parts

-

10k+ parts

-

2,616

$1.096

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,491 parts In-Stock

1+ parts

$0.986

100+ parts

-

1k+ parts

-

10k+ parts

-

3,491

$0.986

-

-

-

Parana Technologies

USA . 430 parts In-Stock

1+ parts

$3.338

100+ parts

$309.938

1k+ parts

$3.004

10k+ parts

-

430

$3.338

$309.938

$3.004

-

DigiPath Technology Company

USA . 309 parts In-Stock

1+ parts

$3.675

100+ parts

$3.381

1k+ parts

-

10k+ parts

-

309

$3.675

$3.381

-

-

ChromeModa Solutions

Germany . 3,555 parts In-Stock

1+ parts

$3.750

100+ parts

$3.075

1k+ parts

-

10k+ parts

-

3,555

$3.750

$3.075

-

-

IDEA Electronic Components Group

UK . 785 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

$3.375

10k+ parts

-

785

$3.750

-

$3.375

-

Lixinc

USA . 3,833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,833

-

-

-

-

Authorized Procurement Solutions

USA . 200 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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200

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Overview

Experience superior audio quality with the TPA6139A2RGTT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments offers top-of-the-line products that deliver exceptional performance. This Class AB audio amplifier is perfect for a wide range of applications in the Audio & Video Amplifiers category. With its compact design and high-quality materials, this chip carrier package ensures reliability and durability. Enhance your audio experience with the TPA6139A2RGTT and enjoy the benefits of clear sound and seamless integration.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mount allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape provides uniformity in design and allows for easy integration into electronic circuits.

General IC Type: CLASS AB AUDIO AMPLIFIER

The Class AB audio amplifier type ensures high-quality audio output with low distortion, making it ideal for audio applications.

Power Supplies (V): 3.3

The 3.3V power supply is commonly used in many electronic devices, making this product compatible with a wide range of applications.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options and the ability to interface with various other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles enhances heat dissipation and overall performance of the amplifier.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures the amplifier can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation even in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position offers multiple connection points for increased flexibility in circuit design and layout.

Nominal Output Power: 0.025 W

The nominal output power of 0.025W is suitable for low-power audio applications, making it energy-efficient.

Maximum Seated Height: 1 mm

The low maximum seated height helps reduce the overall size of the amplifier, making it suitable for compact electronic devices.

Width: 3 mm

The narrow width of 3mm allows for easy integration into tight spaces and compact circuit designs.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement of 3V ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature allows for efficient soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and component reliability during assembly.

Length: 3 mm

The compact length of 3mm contributes to the overall small footprint of the amplifier, making it suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means the amplifier meets stringent quality and reliability standards required for automotive applications.

Terminal Form: NO LEAD

The no lead terminal form simplifies the assembly process and ensures a secure connection without the need for additional solder.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting on PCBs, saving space and enabling compact designs.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates the level of protection against moisture, ensuring the amplifier's performance and reliability in varying environmental conditions.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides a safety margin for voltage spikes or fluctuations, protecting the amplifier from damage.

Technical Specifications

Audio & Video Amplifiers TPA6139A2RGTT attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.025 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TPA6139A2RGTT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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