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TPA3100D2PHPG4

Texas Instruments

TPA3100D2PHPG4 by Texas Instruments

TPA3100D2PHPG4 by Texas Instruments is a 20W audio amplifier IC with 2 channels, operating at temperatures from -40 to 85°C. It features a CMOS technology, gain of 36dB, and nominal noise figure of 102dB. Ideal for industrial applications requiring high-quality audio amplification in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,574 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,574

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Vyrian

USA . 4,220 parts In-Stock

1+ parts

-

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-

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10k+ parts

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4,220

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 550 parts In-Stock

1+ parts

$1.099

100+ parts

-

1k+ parts

$1.937

10k+ parts

-

550

$1.099

-

$1.937

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DigiPath Technology Company

USA . 245 parts In-Stock

1+ parts

$1.210

100+ parts

-

1k+ parts

-

10k+ parts

-

245

$1.210

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-

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ChromeModa Solutions

Germany . 1,221 parts In-Stock

1+ parts

$1.235

100+ parts

$1.013

1k+ parts

-

10k+ parts

-

1,221

$1.235

$1.013

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IDEA Electronic Components Group

UK . 1,167 parts In-Stock

1+ parts

$1.235

100+ parts

-

1k+ parts

$1.112

10k+ parts

-

1,167

$1.235

-

$1.112

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One Stop Electronics

USA . 1,268 parts In-Stock

1+ parts

$4.800

100+ parts

-

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10k+ parts

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1,268

$4.800

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AZTECH Wire

Italy . 323 parts In-Stock

1+ parts

$12.173

100+ parts

-

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323

$12.173

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Corphita

USA . 2,085 parts In-Stock

1+ parts

-

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2,085

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Microchip USA

USA . 918 parts In-Stock

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918

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Overview

Enhance your audio experience with the TPA3100D2PHPG4 by Texas Instruments. Designed with precision and excellence, this audio amplifier delivers powerful sound quality for a variety of applications in the audio and video industry. With Texas Instruments' reputation for innovation and reliability, you can trust that this product will exceed your expectations. Enjoy the benefits of clear, crisp sound and seamless performance, making it the perfect choice for all your audio amplification needs. Elevate your audio game with the TPA3100D2PHPG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the amplifier.

Power Supplies (V): 12/24

Versatile power supply options allow for flexibility in different audio setups and configurations.

Nominal Output Power: 20 W

Delivers a high power output for clear and crisp audio amplification.

Nominal Noise Figure: 102 dB

Low noise figure ensures minimal interference and distortion in the amplified audio signal.

No. of Channels: 2

Dual channels provide stereo sound output, enhancing the listening experience.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with a wide temperature range.

Technology: CMOS

Utilization of CMOS technology offers energy-efficient operation and reduced power consumption.

Technical Specifications

Audio & Video Amplifiers TPA3100D2PHPG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

36 dB

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

Nominal Noise Figure:

102 dB

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

20 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12/24

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

26 mA

Maximum Supply Voltage (Vsup):

26 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TPA3100D2PHPG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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