Loading...

TPA2050D4YZKT

Texas Instruments

TPA2050D4YZKT by Texas Instruments

TPA2050D4YZKT by Texas Instruments is a square-shaped audio amplifier IC with 1% harmonic distortion, operating at -40 to 85°C. It features 2 channels, 0.94W output power, and supports supply voltages from 2.5V to 5.5V. Ideal for applications requiring high-quality audio amplification in industrial settings.

Median Price

$1.550

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 989 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.600

10k+ parts

-

989

-

-

$1.600

-

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

$1.240

10k+ parts

$1.170

500

-

$1.390

$1.240

$1.170

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.550

10k+ parts

$1.462

500

-

-

$1.550

$1.462

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,932 parts In-Stock

1+ parts

$1.463

100+ parts

-

1k+ parts

-

10k+ parts

-

2,932

$1.463

-

-

-

Vyrian

USA . 8,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,117

-

-

-

-

DigiKey Marketplace

USA . 989 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

989

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,233 parts In-Stock

1+ parts

$1.249

100+ parts

-

1k+ parts

$2.022

10k+ parts

-

1,233

$1.249

-

$2.022

-

Corphita

USA . 4,373 parts In-Stock

1+ parts

$1.386

100+ parts

-

1k+ parts

-

10k+ parts

-

4,373

$1.386

-

-

-

ChromeModa Solutions

Germany . 3,741 parts In-Stock

1+ parts

$1.403

100+ parts

$1.150

1k+ parts

-

10k+ parts

-

3,741

$1.403

$1.150

-

-

IDEA Electronic Components Group

UK . 180 parts In-Stock

1+ parts

$1.403

100+ parts

-

1k+ parts

$1.263

10k+ parts

-

180

$1.403

-

$1.263

-

Andel Nordic

Denmark . 3,287 parts In-Stock

1+ parts

$10.782

100+ parts

-

1k+ parts

$10.351

10k+ parts

$10.351

3,287

$10.782

-

$10.351

$10.351

Microchip USA

USA . 5,714 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,714

-

-

-

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

DigiPath Technology Company

USA . 799 parts In-Stock

1+ parts

-

100+ parts

$1.265

1k+ parts

-

10k+ parts

-

799

-

$1.265

-

-

Overview

Unlock the full potential of your audio and video systems with the TPA2050D4YZKT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees high-quality products that deliver exceptional performance. Ideal for a wide range of applications, this square-shaped audio amplifier offers clear sound and minimal distortion, making it perfect for enhancing your listening experience. With a compact design and easy surface mount installation, this amplifier provides convenience without compromising on quality. Upgrade your audio setup today and enjoy superior sound like never before with the TPA2050D4YZKT.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and compact installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape offers efficient use of board space and easy placement in a layout.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio amplification, ensuring high-quality sound output.

Harmonic Distortion: 1%

Low harmonic distortion ensures clear and accurate audio reproduction without interference or distortion.

Power Supplies (V): 1.8,3/5

Supports multiple power supply voltages, providing flexibility and compatibility with various systems.

No. of Terminals: 25

Ample terminals for connectivity options and signal routing, enabling versatile use in audio systems.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array packaging with a thin profile and fine pitch allows for high-density mounting and improved signal integrity.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range support enables operation in extreme cold conditions, increasing product versatility.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides excellent conductivity and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, allowing for easier integration into audio systems.

Nominal Output Power: 0.94 W

Decent output power rating for driving speakers and delivering audio with adequate volume and clarity.

Maximum Seated Height: 0.625 mm

Low seated height enables a compact design and minimizes space requirements in electronic devices.

Width: 2.79 mm

Narrow width facilitates efficient board layout and saves space in audio amplifier circuits.

Minimum Supply Voltage (Vsup): 2.5 V

Low minimum supply voltage requirement allows operation in energy-efficient devices with lower power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables robust solder joints and long-term durability in electronic manufacturing.

Length: 2.79 mm

Compact length contributes to a space-saving design and easy integration into audio amplifier modules.

Temperature Grade: INDUSTRIAL

Industrial temperature grade provides reliable operation in harsh industrial environments with temperature fluctuations.

No. of Channels: 2

Dual-channel configuration supports stereo audio output, enhancing audio performance and spatial separation.

Terminal Form: BALL

Ball terminal form offers reliable contact and soldering connections for secure attachment to PCBs.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and precise component placement on circuit boards.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage compatibility ensures versatility and support for different power sources in audio systems.

Technical Specifications

Audio & Video Amplifiers TPA2050D4YZKT attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

Harmonic Distortion:

1 %

JESD-30 Code:

S-XBGA-B25

JESD-609 Code:

e1

Length:

2.79 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.94 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA25,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3/5

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.79 mm

Trade Compliance

TPA2050D4YZKT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20