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TMX320C6474ZUN

Texas Instruments

TMX320C6474ZUN by Texas Instruments

TMX320C6474ZUN by Texas Instruments is a consumer IC with 561 terminals in a grid array package. It operates on CMOS technology with supply voltage ranging from 0.9V to 1.1V, suitable for various consumer circuit applications requiring compact design and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,197 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,197

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Digiode

USA . 3,347 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,347

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

1+ parts

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,050 parts In-Stock

1+ parts

$0.537

100+ parts

-

1k+ parts

$1.644

10k+ parts

-

2,050

$0.537

-

$1.644

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DigiPath Technology Company

USA . 646 parts In-Stock

1+ parts

$0.591

100+ parts

$0.544

1k+ parts

-

10k+ parts

-

646

$0.591

$0.544

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ChromeModa Solutions

Germany . 4,124 parts In-Stock

1+ parts

$0.603

100+ parts

$0.494

1k+ parts

-

10k+ parts

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4,124

$0.603

$0.494

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IDEA Electronic Components Group

UK . 2,292 parts In-Stock

1+ parts

$0.603

100+ parts

-

1k+ parts

$0.543

10k+ parts

-

2,292

$0.603

-

$0.543

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One Stop Electronics

USA . 686 parts In-Stock

1+ parts

$6.800

100+ parts

-

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-

10k+ parts

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686

$6.800

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AZTECH Wire

Italy . 327 parts In-Stock

1+ parts

$14.107

100+ parts

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327

$14.107

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Corphita

USA . 1,771 parts In-Stock

1+ parts

-

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1,771

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Microchip USA

USA . 356 parts In-Stock

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356

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Overview

Elevate your consumer electronic designs with the TMX320C6474ZUN by Texas Instruments, a cutting-edge IC offering unparalleled quality and reliability. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this product provides unmatched performance in various applications. From sleek smartphones to smart home devices, this versatile IC maximizes functionality and efficiency, delivering exceptional value to customers. Experience the innovative technology and superior benefits of the TMX320C6474ZUN today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides a sturdy and durable casing for the IC, enhancing its overall reliability.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: SQUARE

The square package shape maximizes space efficiency on the PCB, making it easier to fit into tight spaces within electronic devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable in various operating conditions.

Maximum Supply Voltage (Vsup): 1.1 V

The maximum supply voltage of 1.1 V helps in protecting the IC from potential overvoltage situations, ensuring its longevity and performance stability.

Technical Specifications

Other Function Consumer ICs TMX320C6474ZUN attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B561

Length:

23 mm

No. of Functions:

1

No. of Terminals:

561

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage (Vsup):

1.1 V

Minimum Supply Voltage (Vsup):

.9 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Trade Compliance

TMX320C6474ZUN General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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