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TMS5200NL

Texas Instruments

TMS5200NL by Texas Instruments

TMS5200NL by Texas Instruments is a speech synthesizer IC with 28 terminals in an in-line package. Operating temperature range of 0-70°C, suitable for commercial applications. Utilizes MOS technology for sound and music synthesis.

Median Price

$1.859

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$1.859

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Vyrian

USA . 5,569 parts In-Stock

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Digiode

USA . 843 parts In-Stock

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Bristol Electronics

USA . 32 parts In-Stock

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Electronic Expediters

USA . 1 parts In-Stock

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Parana Technologies

USA . 1,788 parts In-Stock

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$2.259

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$2.759

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DigiPath Technology Company

USA . 1,835 parts In-Stock

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$2.487

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$2.288

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ChromeModa Solutions

Germany . 5,505 parts In-Stock

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$2.538

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$2.081

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$2.538

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IDEA Electronic Components Group

UK . 1,797 parts In-Stock

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$2.538

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$2.284

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AZTECH Wire

Italy . 314 parts In-Stock

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$19.476

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One Stop Electronics

USA . 1,411 parts In-Stock

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Corphita

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Overview

Enhance your audio projects with the TMS5200NL by Texas Instruments, a top-quality Speech Synthesizer IC that offers exceptional sound synthesis capabilities. Manufactured by the renowned Texas Instruments, this product guarantees reliability and performance. Ideal for music and sound applications, this rectangular-shaped IC features 28 terminals and operates within a wide temperature range. Unlock endless possibilities in audio design with the TMS5200NL, providing unmatched value, benefits, and advantages to customers seeking high-quality, innovative solutions in the field of speech synthesis.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body helps in keeping the overall weight of the IC light, making it easier to handle and install in electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit boards, optimizing space utilization in electronic devices.

General IC Type: SPEECH SYNTHESIZER

Being a speech synthesizer IC, this product enables the generation of human-like speech and voice signals, making it ideal for applications requiring audio output.

No. of Terminals: 28

The higher number of terminals allows for more connectivity options, enabling versatile usage in various electronic systems and configurations.

Package Style: IN-LINE

The in-line package style facilitates easy placement on PCBs and ensures efficient signal flow within the circuit, enhancing overall system performance.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand high temperature environments, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable performance even in cold environments, expanding the range of applications for this IC.

Terminal Position: DUAL

The dual terminal position provides redundancy in connectivity, reducing the risk of signal loss and ensuring robust performance in demanding operating conditions.

Technology: MOS

Utilizing MOS technology offers advantages such as low power consumption, high speed operation, and compatibility with a wide range of electronic systems, making this IC energy-efficient and versatile.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering process and enhances the mechanical stability of connections, ensuring reliable performance and durability in harsh environments.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm allows for easy integration with common PCB layouts and components, enabling seamless assembly and maintenance of electronic devices.

Technical Specifications

Music & Sound Synthesizer ICs TMS5200NL attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS5200NL General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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