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TMS370C768AFNT

Texas Instruments

TMS370C768AFNT by Texas Instruments

TMS370C768AFNT by Texas Instruments is an 8-bit microcontroller with 16-bit address bus, operating at max 20 MHz. Ideal for industrial applications, it features 1024 bytes of RAM, OTPROM ROM programmability, and ADC channels for data acquisition.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,323 parts In-Stock

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7,323

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Digiode

USA . 3,734 parts In-Stock

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3,734

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Distributors (Availability)

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AZTECH Wire

Italy . 701 parts In-Stock

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$13.034

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701

$13.034

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One Stop Electronics

USA . 498 parts In-Stock

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$30.000

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498

$30.000

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Parana Technologies

USA . 270 parts In-Stock

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$43.157

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270

$43.157

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ChromeModa Solutions

Germany . 1,672 parts In-Stock

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$48.491

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$39.763

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1,672

$48.491

$39.763

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IDEA Electronic Components Group

UK . 108 parts In-Stock

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$48.491

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$46.066

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$43.642

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108

$48.491

$46.066

$43.642

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DigiPath Technology Company

USA . 1,812 parts In-Stock

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$43.719

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$43.719

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Corphita

USA . 1,014 parts In-Stock

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Microchip USA

USA . 134 parts In-Stock

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Overview

Unlock the power of innovation with the TMS370C768AFNT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality microcontrollers that deliver unmatched performance and reliability. Ideal for a wide range of applications, this advanced microcontroller offers customers value, benefits, and advantages that set it apart from the competition. Trust Texas Instruments for cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material choice for packaging, ensuring product longevity and affordability.

Surface Mount: YES

Easy to mount onto circuit boards, saving time during manufacturing and assembly processes.

Maximum Supply Voltage: 5.5 V

Wide operating voltage range allows for flexibility in power supply options.

Address Bus Width: 16

Wide address bus width allows for access to a large memory address space, enabling complex program execution.

Package Shape: SQUARE

Square package shape facilitates efficient space utilization on a circuit board.

Bit Size: 8

8-bit architecture offers a balance between cost and performance for various applications.

No. of Terminals: 68

Sufficient number of terminals for connecting to external devices and peripherals, enhancing product versatility.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in both extreme cold and hot conditions.

Peripheral IC Type: MICROCONTROLLER

Inclusion of various peripherals enhances the functionality of the microcontroller for a wide range of applications.

Technical Specifications

Microcontrollers TMS370C768AFNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

CPU Family:

TMS370

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.23 mm

No. of I/O Lines:

55

No. of Terminals:

68

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

5 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

56 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.23 mm

Peripheral IC Type:

Trade Compliance

TMS370C768AFNT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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