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TMS3478NL

Texas Instruments

TMS3478NL by Texas Instruments

TMS3478NL by Texas Instruments is a Speech Synthesizer IC with 28 terminals, operating at 5V. It features CMOS technology, with a max supply current of 7mA. Ideal for applications in music and sound synthesis due to its commercial temperature grade and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,528 parts In-Stock

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4,528

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Digiode

USA . 3,586 parts In-Stock

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3,586

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Distributors (Availability)

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Parana Technologies

USA . 2,171 parts In-Stock

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$2.100

100+ parts

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$2.617

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2,171

$2.100

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$2.617

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DigiPath Technology Company

USA . 451 parts In-Stock

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$2.313

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$2.128

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451

$2.313

$2.128

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ChromeModa Solutions

Germany . 1,730 parts In-Stock

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$2.360

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$1.935

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$2.360

$1.935

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IDEA Electronic Components Group

UK . 116 parts In-Stock

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$2.360

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$2.124

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116

$2.360

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$2.124

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AZTECH Wire

Italy . 625 parts In-Stock

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$10.364

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625

$10.364

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One Stop Electronics

USA . 754 parts In-Stock

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$12.800

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754

$12.800

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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Corphita

USA . 1,654 parts In-Stock

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Infinite Electronics LLP (Excess)

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587

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A-Z Elektronik GmbH

Germany . 183 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Unleash the power of sound with the TMS3478NL by Texas Instruments. This Music & Sound Synthesizer IC is a game-changer, offering high-quality performance and reliability that only a trusted brand like Texas Instruments can deliver. Perfect for applications in speech synthesis, this innovative product provides value and benefits that will exceed your expectations. With its advanced technology and user-friendly design, the TMS3478NL is set to elevate your audio projects to new heights. Embrace the future of sound with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good durability and protection for the IC, making it suitable for long-term use.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit designs and PCB layouts.

General IC Type: SPEECH SYNTHESIZER WITH RCDG

The speech synthesizer with RCDG functionality offers advanced capabilities for speech synthesis applications.

Power Supplies (V): 5

The 5V power supply requirement is common and easily attainable, making the IC compatible with a wide range of systems.

No. of Terminals: 28

The high number of terminals allows for more connectivity options and flexibility in circuit design.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line package style with shrink pitch offers space-saving benefits and easy installation on PCBs.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in warm environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions.

Terminal Position: DUAL

The dual terminal position provides redundancy and improves reliability in connecting external components.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the IC is suitable for standard commercial applications.

Technology: CMOS

The CMOS technology used in the IC offers low power consumption and high noise immunity.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy soldering and strong connections on PCBs.

Maximum Supply Current: 7 mA

The low maximum supply current requirement helps to minimize power consumption and heat generation.

Terminal Pitch: 1.78 mm

The small terminal pitch enables compact design and efficient use of space on the PCB.

Technical Specifications

Music & Sound Synthesizer ICs TMS3478NL attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP28,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Maximum Supply Current:

7 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

TMS3478NL General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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