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SN76488NP3

Texas Instruments

SN76488NP3 by Texas Instruments

Texas Instruments SN76488NP3 is a 28-terminal sound synthesizer IC with bipolar technology. Operating temp range: 0-70°C. Widely used in music applications due to its rectangular package shape and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,613 parts In-Stock

1+ parts

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7,613

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Digiode

USA . 530 parts In-Stock

1+ parts

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530

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,576 parts In-Stock

1+ parts

$3.350

100+ parts

-

1k+ parts

$3.875

10k+ parts

-

1,576

$3.350

-

$3.875

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DigiPath Technology Company

USA . 1,705 parts In-Stock

1+ parts

$3.689

100+ parts

-

1k+ parts

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1,705

$3.689

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ChromeModa Solutions

Germany . 6,495 parts In-Stock

1+ parts

$3.764

100+ parts

$3.086

1k+ parts

-

10k+ parts

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6,495

$3.764

$3.086

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IDEA Electronic Components Group

UK . 859 parts In-Stock

1+ parts

$3.764

100+ parts

-

1k+ parts

$3.388

10k+ parts

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859

$3.764

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$3.388

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One Stop Electronics

USA . 1,386 parts In-Stock

1+ parts

$3.800

100+ parts

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1,386

$3.800

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AZTECH Wire

Italy . 612 parts In-Stock

1+ parts

$16.807

100+ parts

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612

$16.807

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Corphita

USA . 2,061 parts In-Stock

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2,061

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Overview

Experience unparalleled sound quality and innovation with the Texas Instruments SN76488NP3 Music & Sound Synthesizer IC. Known for their exceptional craftsmanship and cutting-edge technology, Texas Instruments delivers a product that exceeds expectations in the music industry. This versatile IC is perfect for a wide range of applications, from musical instruments to gaming devices, offering customers unmatched value and performance. Elevate your sound experience with the SN76488NP3 and discover a whole new world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good thermal conductivity and electrical insulation, ensuring reliable performance and durability.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic circuits and systems, optimizing space utilization.

No. of Terminals: 28

High number of terminals enable versatile connectivity options with other components, enhancing the functionality and flexibility of the synthesizer IC.

Package Style (Meter): IN-LINE

In-line package style simplifies the overall design and layout of the circuit board, making installation and maintenance easier.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stability and performance even under demanding temperature conditions, suitable for various applications.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for reliable operation in colder environments without risking damage to the IC.

Terminal Position: DUAL

Dual terminal position enables secure and stable connections, reducing the risk of signal loss or interference in the circuit.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures consistent performance in typical operating conditions, making it suitable for general commercial applications.

Technology: BIPOLAR

Bipolar technology offers high speed and precision in signal processing, delivering high-quality sound synthesis and performance.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy soldering and secure mounting on the circuit board, ensuring reliable connections and overall stability.

Terminal Pitch: 2.54 mm

Standard 2.54mm terminal pitch facilitates easy assembly and compatibility with common PCB designs, simplifying integration into electronic systems.

Technical Specifications

Music & Sound Synthesizer ICs SN76488NP3 attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Audio Synthesizer ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN76488NP3 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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