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SN76493N

Texas Instruments

SN76493N by Texas Instruments

SN76493N by Texas Instruments is a 16-terminal music & sound synthesizer IC with a rectangular package style. Operating temperature range of 0-70°C, commercial grade technology, and through-hole terminal form make it ideal for audio applications in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,280 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,280

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-

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Digiode

USA . 257 parts In-Stock

1+ parts

-

100+ parts

-

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257

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,178 parts In-Stock

1+ parts

$1.242

100+ parts

-

1k+ parts

$2.019

10k+ parts

-

1,178

$1.242

-

$2.019

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ChromeModa Solutions

Germany . 5,263 parts In-Stock

1+ parts

$1.395

100+ parts

$1.144

1k+ parts

-

10k+ parts

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5,263

$1.395

$1.144

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IDEA Electronic Components Group

UK . 1,107 parts In-Stock

1+ parts

$1.395

100+ parts

-

1k+ parts

$1.256

10k+ parts

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1,107

$1.395

-

$1.256

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AZTECH Wire

Italy . 628 parts In-Stock

1+ parts

$8.097

100+ parts

-

1k+ parts

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10k+ parts

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628

$8.097

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One Stop Electronics

USA . 1,210 parts In-Stock

1+ parts

$10.800

100+ parts

-

1k+ parts

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1,210

$10.800

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Corphita

USA . 4,252 parts In-Stock

1+ parts

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4,252

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DigiPath Technology Company

USA . 1,412 parts In-Stock

1+ parts

-

100+ parts

$1.258

1k+ parts

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10k+ parts

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1,412

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$1.258

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Overview

Elevate your audio experience with the SN76493N by Texas Instruments, a top-quality Music & Sound Synthesizer IC that promises unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this rectangular package IC boasts 16 terminals and a commercial-grade temperature grade for optimal functionality in any setting. Whether you're a music enthusiast or a professional sound engineer, the SN76493N offers exceptional value, benefits, and advantages that will take your audio projects to the next level. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good durability and reliability, making this product suitable for long-term use.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of PCB space and easy integration into electronic designs.

No. of Terminals: 16

Higher number of terminals provide more connectivity options and flexibility in the circuit design.

Package Style (Meter): IN-LINE

In-line package style simplifies PCB layout and allows for easy installation and maintenance.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in a wide range of environments without risk of damage.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal integrity, ensuring reliable connectivity.

Temperature Grade: COMMERCIAL

Commercial temperature grade is suitable for standard electronic applications, offering a balance between performance and cost.

Technology: BIPOLAR

Bipolar technology ensures accurate signal processing and low noise, making this product ideal for music and sound synthesizer applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy and secure soldering onto the PCB, enhancing the product's reliability and robustness.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm makes it compatible with commonly available components and facilitates easy circuit assembly.

Technical Specifications

Music & Sound Synthesizer ICs SN76493N attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN76493N General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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