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TMS3477NL

Texas Instruments

TMS3477NL by Texas Instruments

TMS3477NL by Texas Instruments is a Speech Synthesizer IC with 28 terminals, operating at temperatures from -10°C to 80°C. It requires a 5V power supply and has a max supply current of 5mA. This IC is commonly used in music and sound synthesizers for commercial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Electronic Expediters

USA . 4,128 parts In-Stock

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Vyrian

USA . 2,549 parts In-Stock

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Digiode

USA . 2,447 parts In-Stock

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Sogenti Electronics

Canada . 245 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 131 parts In-Stock

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Huijzer Components

Netherlands . 117 parts In-Stock

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Maverick Electronics, Inc.

USA . 105 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 69 parts In-Stock

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ECAB

Sweden . 67 parts In-Stock

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Mentor Electronics Marketing, LLC

USA . 10 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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Parana Technologies

USA . 2,360 parts In-Stock

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$1.566

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$2.208

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DigiPath Technology Company

USA . 703 parts In-Stock

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$1.724

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$1.586

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ChromeModa Solutions

Germany . 4,373 parts In-Stock

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$1.759

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$1.442

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IDEA Electronic Components Group

UK . 2,249 parts In-Stock

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$1.583

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One Stop Electronics

USA . 269 parts In-Stock

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$3.800

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AZTECH Wire

Italy . 596 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,054 parts In-Stock

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Corphita

USA . 4,800 parts In-Stock

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Emar International I/E

Canada . 1,000 parts In-Stock

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Kepictronics

USA . 607 parts In-Stock

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Infinite Electronics LLP (Excess)

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Assy Fe

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Overview

Experience the unparalleled quality and innovation of Texas Instruments with the TMS3477NL Music & Sound Synthesizer IC. This cutting-edge speech synthesizer offers a seamless blend of technology and creativity, providing endless possibilities for your audio projects. From musical instruments to voice recognition systems, this versatile IC is designed to enhance your sound experience with its reliable performance and user-friendly interface. Trust Texas Instruments to deliver top-of-the-line solutions that exceed your expectations and elevate your audio creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ensuring longevity and ease of handling.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various electronic devices, making it versatile and compatible with different designs.

General IC Type: SPEECH SYNTHESIZER WITH RCDG

The speech synthesizer with RCDG feature enables high-quality audio output and advanced sound synthesis capabilities, making it suitable for applications requiring complex sound generation.

Power Supplies (V): 5

The 5V power supply requirement makes the product energy-efficient and compatible with common power sources, enhancing its usability in a wide range of electronic setups.

No. of Terminals: 28

The large number of terminals provides ample connectivity options, allowing for versatile integration and customization in electronic circuits.

Maximum Operating Temperature: 80 °C

The high maximum operating temperature tolerance of 80°C ensures reliable performance even in challenging environmental conditions, enhancing the product's durability.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature limit of -10°C ensures the product can function efficiently in a wide range of temperature settings, making it suitable for diverse applications.

Terminal Position: DUAL

The dual terminal position design offers flexibility in installation and connection, allowing for easy integration into different circuit layouts and configurations.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade indicates that the product is designed to meet the performance requirements of commercial applications across a wide temperature range, ensuring reliability in various settings.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption, high speed, and reliable operation, making it an efficient and stable choice for audio synthesis tasks.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the installation process and provides secure connections, making it easier to integrate the product into electronic circuits without the risk of faulty connections.

Maximum Supply Current: 5 mA

The low maximum supply current requirement of 5 mA indicates the product's energy efficiency, allowing for minimal power consumption and reduced operational costs in electronic setups.

Terminal Pitch: 1.78 mm

The precise terminal pitch of 1.78 mm enables accurate connections and positioning, ensuring reliable performance and stability in electronic circuits where precision is crucial.

Technical Specifications

Music & Sound Synthesizer ICs TMS3477NL attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP28,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Maximum Supply Current:

5 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS3477NL General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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