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TMS3477

Texas Instruments

TMS3477 by Texas Instruments

TMS3477 by Texas Instruments is a Speech Synthesizer IC with 28 terminals, operating at 5V. It features CMOS technology, operates b/w 0-85°C, and draws a max current of 5mA. Ideal for applications requiring sound synthesis in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,303 parts In-Stock

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8,303

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Digiode

USA . 2,226 parts In-Stock

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2,226

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Distributors (Availability)

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Parana Technologies

USA . 1,898 parts In-Stock

1+ parts

$1.802

100+ parts

-

1k+ parts

$2.360

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1,898

$1.802

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$2.360

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DigiPath Technology Company

USA . 311 parts In-Stock

1+ parts

$1.984

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311

$1.984

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ChromeModa Solutions

Germany . 3,289 parts In-Stock

1+ parts

$2.025

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$1.660

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3,289

$2.025

$1.660

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IDEA Electronic Components Group

UK . 1,819 parts In-Stock

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$2.025

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$1.822

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1,819

$2.025

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$1.822

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AZTECH Wire

Italy . 518 parts In-Stock

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$7.723

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518

$7.723

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One Stop Electronics

USA . 768 parts In-Stock

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$12.800

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768

$12.800

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Corphita

USA . 2,606 parts In-Stock

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2,606

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Overview

Unleash the power of sound with the TMS3477 by Texas Instruments, a top-quality Music & Sound Synthesizer IC designed to elevate your audio projects to new heights. Manufactured by the industry leader in semiconductor technology, this Speech Synthesizer with RCDG is a game-changer in the world of sound engineering. Whether you're creating music, speech recordings, or any other audio application, the TMS3477 delivers unparalleled performance and reliability. With precise terminal positioning, low power consumption, and a wide operating temperature range, this innovative IC is the perfect choice for professionals and hobbyists alike who demand excellence in their audio projects. Elevate your sound creations with the TMS3477 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the synthesizer IC, ensuring a longer lifespan.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into electronic circuit designs, making it a versatile option for various applications.

General IC Type: SPEECH SYNTHESIZER WITH RCDG

Speech synthesizer with RCDG feature enables the IC to generate high-quality and natural-sounding speech, making it ideal for voice-based applications.

Power Supplies (V): 5

Operating at 5V allows for compatibility with standard power sources, making it easy to power the synthesizer IC in different setups.

No. of Terminals: 28

Having 28 terminals provides flexibility for connecting the IC to external components and interfaces, enabling customization and control over the synthesizer's functions.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch package style allows for efficient PCB layout and space-saving design, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the synthesizer IC can withstand high temperature environments without performance degradation, ensuring reliability.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C allows for use in a wide range of environments, making the synthesizer IC versatile and adaptable.

Terminal Position: DUAL

Dual terminal position provides redundancy and reliability in connection, minimizing the risk of signal loss or interruption for consistent performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, optimizing the efficiency and reliability of the synthesizer IC in various applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy soldering and secure connections, ensuring stable operation and durability of the IC in electronic circuits.

Maximum Supply Current: 5 mA

Operating at a maximum supply current of 5 mA indicates low power consumption, making the synthesizer IC energy-efficient and suitable for battery-operated devices.

Terminal Pitch: 1.78 mm

With a terminal pitch of 1.78 mm, the synthesizer IC offers compatibility with standard PCB designs and assembly processes, simplifying integration into electronic systems.

Technical Specifications

Music & Sound Synthesizer ICs TMS3477 attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP28,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Maximum Supply Current:

5 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS3477 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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