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TMS320F28065UPNT

Texas Instruments

TMS320F28065UPNT by Texas Instruments

TMS320F28065UPNT by Texas Instruments is a 32-bit microcontroller with 80 terminals, operating at max 90 MHz. It features 12 ADC channels, 6 DMA channels, and peripherals like PWM(14) and UART(2). Ideal for industrial applications requiring high-speed processing and connectivity via CAN, I2C, SPI(2), and USB interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,855 parts In-Stock

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Digiode

USA . 1,438 parts In-Stock

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1,438

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Distributors (Availability)

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AZTECH Wire

Italy . 723 parts In-Stock

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$10.531

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723

$10.531

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One Stop Electronics

USA . 848 parts In-Stock

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$27.000

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848

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Parana Technologies

USA . 388 parts In-Stock

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$54.195

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388

$54.195

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DigiPath Technology Company

USA . 1,069 parts In-Stock

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$59.675

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$54.901

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1,069

$59.675

$54.901

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ChromeModa Solutions

Germany . 3,066 parts In-Stock

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$60.893

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$49.932

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3,066

$60.893

$49.932

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IDEA Electronic Components Group

UK . 1,372 parts In-Stock

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$60.893

100+ parts

$57.848

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$54.804

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1,372

$60.893

$57.848

$54.804

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QUARKTWIN TECHNOLOGY LTD

USA . 20,871 parts In-Stock

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Corphita

USA . 4,121 parts In-Stock

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Microchip USA

USA . 3,932 parts In-Stock

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Overview

Unlock the full potential of your projects with the TMS320F28065UPNT microcontroller by Texas Instruments. With a reputation for high-quality products, Texas Instruments delivers superior performance and reliability in the field of microcontrollers. Ideal for a wide range of applications, this microcontroller offers advanced features such as multiple ADC and PWM channels, connectivity options like CAN and UART, and on-chip program ROM. Experience the value and benefits of Texas Instruments' cutting-edge technology with the TMS320F28065UPNT, providing you with the tools you need to bring your creations to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.995 V

Can operate efficiently with a relatively low maximum supply voltage, which can be beneficial for power savings.

Package Shape: SQUARE

Square package shape provides a more compact design, saving space on the PCB.

Bit Size: 32

32-bit architecture allows for higher processing speeds and more memory addressing capabilities.

Power Supplies (V): 1.8, 3.3

Supports multiple power supply voltages, offering flexibility in different applications.

No. of Terminals: 80

A high number of terminals provide ample connectivity options and peripheral interfaces.

Minimum Operating Temperature: -40 °C

Operates in a wide temperature range, making it suitable for industrial and harsh environments.

ADC Channels: YES

Built-in Analog to Digital Convertors allow for accurate and reliable data conversion.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and efficiency.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program and data storage.

Maximum Clock Frequency: 90 MHz

High clock frequency enables fast data processing and real-time operations.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates various peripherals and functions into a single chip, reducing external components and board space.

RAM Bytes: 51200

Generous RAM capacity for storing and processing data during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall performance.

Analog To Digital Convertors: 12-Ch 12-Bit

Multiple ADC channels with 12-bit resolution provide accurate analog signal conversion capabilities.

Connectivity: CAN, I2C, SPI(2), UART(2), USB

Supports a variety of communication interfaces for connecting to external devices and networks.

ROM Programmability: FLASH

Flash ROM allows for easy and flexible reprogramming of the memory contents.

No. of I/O Lines: 40

Plenty of I/O lines for interfacing with external peripherals, sensors, and devices.

Technical Specifications

Microcontrollers TMS320F28065UPNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT HAS OTPROM OF 1K

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

90 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

51200

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

90 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SPI(2), UART(2), USB

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, PWM(14), TEMPERATURE SENSOR, TIMER(3), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TMS320F28065UPNT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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