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TMS320F28064PZT

Texas Instruments

TMS320F28064PZT by Texas Instruments

TMS320F28064PZT by Texas Instruments is a 32-bit microcontroller with 16-Ch 12-Bit ADC, 102400 RAM Bytes, and 80 MHz clock frequency. Ideal for industrial applications requiring CAN, I2C, SPI connectivity and low power mode.

Median Price

$11.421

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 530 parts In-Stock

1+ parts

$11.421

100+ parts

$9.976

1k+ parts

$6.880

10k+ parts

-

530

$11.421

$9.976

$6.880

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,371 parts In-Stock

1+ parts

$10.850

100+ parts

-

1k+ parts

-

10k+ parts

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1,371

$10.850

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Vyrian

USA . 5,783 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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5,783

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,690 parts In-Stock

1+ parts

$10.279

100+ parts

-

1k+ parts

-

10k+ parts

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2,690

$10.279

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-

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AZTECH Wire

Italy . 221 parts In-Stock

1+ parts

$20.130

100+ parts

-

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221

$20.130

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Parana Technologies

USA . 383 parts In-Stock

1+ parts

$22.764

100+ parts

-

1k+ parts

$23.429

10k+ parts

-

383

$22.764

-

$23.429

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DigiPath Technology Company

USA . 1,938 parts In-Stock

1+ parts

$25.066

100+ parts

-

1k+ parts

-

10k+ parts

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1,938

$25.066

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ChromeModa Solutions

Germany . 6,462 parts In-Stock

1+ parts

$25.578

100+ parts

$20.974

1k+ parts

-

10k+ parts

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6,462

$25.578

$20.974

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IDEA Electronic Components Group

UK . 494 parts In-Stock

1+ parts

$25.578

100+ parts

$24.299

1k+ parts

$23.020

10k+ parts

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494

$25.578

$24.299

$23.020

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Overview

Enhance your next project with the TMS320F28064PZT microcontroller by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. Ideal for a wide range of applications, this microcontroller offers unmatched value and benefits to customers. With advanced features like 32-bit processing, 16-channel ADC, and 102400 bytes of RAM, it provides reliable performance and flexibility. Whether you're working on industrial automation, automotive systems, or power control applications, the TMS320F28064PZT is sure to exceed your expectations. Experience the advantages of cutting-edge technology and seamless connectivity with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material helps in reducing the overall weight of the microcontroller, making it suitable for applications where weight is a concern.

Maximum Supply Voltage: 1.995 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating various voltage levels in different applications.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures that the microcontroller can operate efficiently even in low power scenarios, making it energy-efficient.

No. of External Interrupts: 3

Having multiple external interrupts allows the microcontroller to respond to multiple external events simultaneously, enhancing its real-time response capabilities.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is designed to integrate various peripherals and IO capabilities into a single chip, reducing external component count and complexity in embedded system designs.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications in data acquisition and processing.

DMA Channels: YES

Having DMA channels allows for efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance and freeing up CPU resources.

Connectivity: CAN, I2C, SCI(2), SPI(2), UART(2), USB

Support for a wide range of communication interfaces ensures compatibility with various devices and peripherals, making it versatile for different connectivity requirements in embedded systems.

Speed: 80 rpm

With a maximum clock frequency of 80 MHz, this microcontroller offers high-speed processing capabilities, suitable for applications that require fast data processing and response times.

RAM Bytes: 102400

The large RAM size provides ample memory for temporary data storage and processing, enabling the microcontroller to handle complex algorithms and tasks efficiently.

Technical Specifications

Microcontrollers TMS320F28064PZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

2KB OF OTP ROM

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

3

No. of I/O Lines:

54

No. of Terminals:

100

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

102400

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

245 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(2), SPI(2), UART(2), USB

Peripherals:

BOR, COMPARATOR(3), DMA, POR, PWM(16), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28064PZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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