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TMS320F28051PNQ

Texas Instruments

TMS320F28051PNQ by Texas Instruments

TMS320F28051PNQ by Texas Instruments is a 32-bit microcontroller with 80 terminals, operating at up to 20 MHz. Ideal for automotive applications, it features 16-Ch 12-Bit ADCs, Flash ROM programmability, and various peripherals like PWM and timers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,952 parts In-Stock

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Digiode

USA . 1,821 parts In-Stock

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1,821

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Distributors (Availability)

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AZTECH Wire

Italy . 710 parts In-Stock

1+ parts

$10.524

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710

$10.524

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One Stop Electronics

USA . 684 parts In-Stock

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$12.000

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684

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Parana Technologies

USA . 1,672 parts In-Stock

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$31.646

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$85.700

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$31.646

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$85.700

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ChromeModa Solutions

Germany . 873 parts In-Stock

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$35.557

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$29.157

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873

$35.557

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IDEA Electronic Components Group

UK . 48 parts In-Stock

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$35.557

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$33.779

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$32.001

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48

$35.557

$33.779

$32.001

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DigiPath Technology Company

USA . 1,319 parts In-Stock

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$32.058

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1,319

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$32.058

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Corphita

USA . 766 parts In-Stock

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Microchip USA

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Overview

Unlock the power of innovation with the TMS320F28051PNQ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are designed to excel in various applications. This product offers unparalleled value, benefits, and advantages to customers looking for reliability and efficiency. With advanced features and cutting-edge technology, the TMS320F28051PNQ is the perfect choice for those seeking superior performance and seamless connectivity. Elevate your projects with this exceptional microcontroller and experience the difference that Texas Instruments can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 1.995 V

Offers a wide supply voltage range for flexibility in power supply selection.

Bit Size: 32

Higher bit size allows for processing of larger data sets and complex algorithms efficiently.

Power Supplies (V): 1.8,3.3

Supports multiple power supply options for compatibility with different systems.

No. of Terminals: 80

Provides plenty of I/O options for connecting to external devices and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of styles offers versatility in mounting options for different PCB layouts.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage allows for operation in power-constrained environments.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for industrial and automotive applications.

CPU Family: TMS320

Belonging to the TMS320 family ensures compatibility with existing software and development tools.

ADC Channels: YES

Built-in ADC channels enable analog signal processing without the need for external components.

ROM Words: 32768

Ample ROM capacity for storing program code and data.

Width: 12 mm

Compact width for space-constrained applications.

Peripherals: BOR, COMPARATOR(7), POR, PWM(14), TIMER(3), WDT

A wide range of peripherals enhances the microcontroller's capabilities for various tasks and functions.

Maximum Clock Frequency: 20 MHz

High clock frequency enables fast processing and response times.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microcontroller can withstand a moderate level of moisture exposure during handling and storage.

Technical Specifications

Microcontrollers TMS320F28051PNQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

42

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(3), SPI

Peripherals:

BOR, COMPARATOR(7), POR, PWM(14), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28051PNQ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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