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TMS320F28050PNQ

Texas Instruments

TMS320F28050PNQ by Texas Instruments

TMS320F28050PNQ by Texas Instruments is a 32-bit microcontroller with 16384 ROM words, 6144 RAM bytes, and 16-Ch 12-Bit ADC channels. Ideal for automotive applications, it offers PWM(14), TIMER(3), CAN, I2C, SCI(3), SPI connectivity options and operates at a max frequency of 20 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,655 parts In-Stock

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5,655

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Digiode

USA . 1,157 parts In-Stock

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1,157

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Distributors (Availability)

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AZTECH Wire

Italy . 424 parts In-Stock

1+ parts

$18.992

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424

$18.992

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Parana Technologies

USA . 1,336 parts In-Stock

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$22.076

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$22.659

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1,336

$22.076

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$22.659

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DigiPath Technology Company

USA . 1,315 parts In-Stock

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$24.309

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1,315

$24.309

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ChromeModa Solutions

Germany . 5,513 parts In-Stock

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$24.805

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$20.340

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5,513

$24.805

$20.340

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IDEA Electronic Components Group

UK . 461 parts In-Stock

1+ parts

$24.805

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$23.565

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$22.324

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461

$24.805

$23.565

$22.324

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One Stop Electronics

USA . 1,002 parts In-Stock

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$27.000

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$27.000

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Corphita

USA . 1,005 parts In-Stock

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Microchip USA

USA . 220 parts In-Stock

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Overview

Experience the power of innovation with the TMS320F28050PNQ microcontroller by Texas Instruments. This cutting-edge device offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. From automotive to industrial automation, this microcontroller delivers high-speed processing and efficient power consumption. Trust in Texas Instruments' legacy of excellence and take your projects to the next level with the TMS320F28050PNQ. Elevate your designs and unlock limitless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex computations and operations efficiently.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, making it suitable for industrial and automotive applications.

ADC Channels: YES

Integrated Analog to Digital Converters enable the microcontroller to interface with analog sensors and signals.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, ensuring optimal performance and functionality.

RAM Bytes: 6144

Sufficient RAM for storing data and variables, allowing for efficient multitasking and data processing.

Connectivity: CAN, I2C, SCI(3), SPI

Support for multiple communication protocols enables seamless integration with other devices and systems.

Speed: 60 rpm

Capable of handling data processing and calculations at a fast speed, ideal for real-time applications.

Technical Specifications

Microcontrollers TMS320F28050PNQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

42

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(3), SPI

Peripherals:

BOR, COMPARATOR(6), POR, PWM(14), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28050PNQ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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