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TMS2604JC

Texas Instruments

TMS2604JC by Texas Instruments

TMS2604JC by Texas Instruments is a 24-terminal digital arithmetic circuit with MOS technology. It operates b/w -25°C to 85°C, featuring a ceramic rectangular package style. Ideal for applications requiring precise calculations in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,406 parts In-Stock

1+ parts

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5,406

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Digiode

USA . 4,414 parts In-Stock

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4,414

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 323 parts In-Stock

1+ parts

$11.028

100+ parts

-

1k+ parts

$10.587

10k+ parts

$10.587

323

$11.028

-

$10.587

$10.587

AZTECH Wire

Italy . 420 parts In-Stock

1+ parts

$14.903

100+ parts

-

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420

$14.903

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One Stop Electronics

USA . 1,444 parts In-Stock

1+ parts

$15.000

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-

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1,444

$15.000

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Parana Technologies

USA . 1,362 parts In-Stock

1+ parts

$24.029

100+ parts

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1k+ parts

$24.688

10k+ parts

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1,362

$24.029

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$24.688

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DigiPath Technology Company

USA . 1,337 parts In-Stock

1+ parts

$26.459

100+ parts

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1,337

$26.459

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ChromeModa Solutions

Germany . 5,191 parts In-Stock

1+ parts

$26.999

100+ parts

$22.139

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5,191

$26.999

$22.139

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IDEA Electronic Components Group

UK . 1,138 parts In-Stock

1+ parts

$26.999

100+ parts

$25.649

1k+ parts

$24.299

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1,138

$26.999

$25.649

$24.299

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Corphita

USA . 704 parts In-Stock

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704

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Overview

Elevate your digital arithmetic circuits with the TMS2604JC by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers innovative solutions for a wide range of applications. The TMS2604JC offers customers unmatched value and benefits, providing seamless integration and optimized performance. Whether you're in need of precision calculations or efficient data processing, this advanced product is sure to exceed your expectations. Elevate your projects to new heights with the TMS2604JC from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a high-quality material known for its durability and resistance to extreme temperatures, making this product suitable for use in harsh environments.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement and installation of the product in various electronic systems.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for integrating the product into complex circuit designs.

Package Style (Meter): IN-LINE

In-line package style makes it easy to integrate this product into existing circuit configurations without taking up too much space.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature conditions without compromising performance.

Minimum Operating Temperature: -25 °C

The ability to operate at temperatures as low as -25°C ensures this product's reliability in a wide range of environments.

Terminal Position: DUAL

Dual terminal positions offer flexibility in connecting the product to other components, allowing for versatile circuit configurations.

Technology: MOS

MOS technology ensures high-speed and low-power operation, making this product efficient and suitable for digital arithmetic applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure connections and ease of soldering, enhancing the product's reliability in electronic systems.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch offers compatibility with standard PCB designs, simplifying the integration of this product into various electronic applications.

Technical Specifications

Digital Arithmetic Circuits TMS2604JC attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS2604JC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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