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TMP461AIRUNT

Texas Instruments

TMP461AIRUNT by Texas Instruments

TMP461AIRUNT by Texas Instruments is a 10-terminal chip carrier with a supply voltage range of 1.7V to 3.6V, operating b/w -40°C to 125°C. This analog circuit IC has a square package shape, surface mountable, and suitable for automotive applications due to its nickel palladium gold finish and low profile design.

Median Price

$1.530

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 982 parts In-Stock

1+ parts

$1.530

100+ parts

$0.899

1k+ parts

$0.692

10k+ parts

$0.651

982

$1.530

$0.899

$0.692

$0.651

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 28,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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28,500

-

-

-

-

Vyrian

USA . 7,493 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,493

-

-

-

-

Digiode

USA . 2,502 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,502

-

-

-

-

SPM Sales

USA . 31 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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31

-

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 199 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

199

$2.500

-

-

-

Parana Technologies

USA . 2,222 parts In-Stock

1+ parts

$3.123

100+ parts

-

1k+ parts

$3.642

10k+ parts

-

2,222

$3.123

-

$3.642

-

DigiPath Technology Company

USA . 232 parts In-Stock

1+ parts

$3.439

100+ parts

$3.164

1k+ parts

-

10k+ parts

-

232

$3.439

$3.164

-

-

IDEA Electronic Components Group

UK . 1,413 parts In-Stock

1+ parts

$3.509

100+ parts

-

1k+ parts

$3.158

10k+ parts

-

1,413

$3.509

-

$3.158

-

ChromeModa Solutions

Germany . 48 parts In-Stock

1+ parts

$3.509

100+ parts

$2.877

1k+ parts

-

10k+ parts

-

48

$3.509

$2.877

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-

AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$12.908

100+ parts

-

1k+ parts

-

10k+ parts

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386

$12.908

-

-

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A-Z Elektronik GmbH

Germany . 7,016 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,016

-

-

-

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iodParts Technologies Inc.

India . 500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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500

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-

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Corphita

USA . 407 parts In-Stock

1+ parts

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407

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Overview

Experience superior quality and performance with the TMP461AIRUNT by Texas Instruments. As a leading manufacturer in the semiconductor industry, Texas Instruments delivers top-notch products like this analog circuit chip carrier with very thin profile. Ideal for automotive applications, this innovative solution offers reliability and precision with its nickel palladium gold terminal finish, ensuring optimal functionality even in extreme temperatures. Trust Texas Instruments to provide cutting-edge technology that meets your needs effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material helps protect the internal components of the chip carrier and provides durability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is a common standard in many electronic systems, making this product compatible with a wide range of applications.

No. of Terminals: 10

Having 10 terminals allows for multiple connections and functionalities, providing versatility in circuit design.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product is suitable for applications that require extended periods of high temperature operation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Maximum Seated Height: 0.8 mm

The very thin profile of 0.8mm allows for space-saving installation in compact electronic devices or systems.

Other IC type: ANALOG CIRCUIT

Being an analog circuit type, this product is ideal for applications that require continuous variable signal processing, such as audio or sensor applications.

Moisture Sensitivity Level (MSL): 2

With MSL 2 rating, this product is suitable for environments with moderate humidity levels, ensuring reliability in various conditions.

Technical Specifications

Other Function Semiconductors TMP461AIRUNT attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N10

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

TMP461AIRUNT Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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