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TMP461AIRUNR-S

Texas Instruments

TMP461AIRUNR-S by Texas Instruments

TMP461AIRUNR-S by Texas Instruments is a 10-terminal chip carrier with a supply voltage range of 1.7V to 3.6V, ideal for automotive applications. It operates b/w -40°C to 125°C, has a low supply current of 0.375mA, and features nickel/palladium/gold terminal finish. The surface-mount square package is only 0.8mm in height, making it suitable for compact designs.

Median Price

$1.148

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 225,223 parts In-Stock

1+ parts

$1.146

100+ parts

$0.882

1k+ parts

$0.464

10k+ parts

-

225,223

$1.146

$0.882

$0.464

-

Chip1Stop

Japan . 1,671 parts In-Stock

1+ parts

$1.150

100+ parts

$0.824

1k+ parts

$0.695

10k+ parts

$0.580

1,671

$1.150

$0.824

$0.695

$0.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,871 parts In-Stock

1+ parts

$0.735

100+ parts

-

1k+ parts

-

10k+ parts

-

3,871

$0.735

-

-

-

Digiode

USA . 1,573 parts In-Stock

1+ parts

$0.790

100+ parts

-

1k+ parts

-

10k+ parts

-

1,573

$0.790

-

-

-

Chip Stock

USA . 23,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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23,500

-

-

-

-

Cyclops Electronics Ltd

UK . 4,334 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,334

-

-

-

-

Component Sense

UK . 2,538 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,538

-

-

-

-

Nova Conductors

Japan . 42 parts In-Stock

1+ parts

-

100+ parts

-

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42

-

-

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ComSIT Distribution GmbH

Germany . 17 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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17

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,510 parts In-Stock

1+ parts

$0.749

100+ parts

-

1k+ parts

-

10k+ parts

-

3,510

$0.749

-

-

-

Parana Technologies

USA . 2,238 parts In-Stock

1+ parts

$8.090

100+ parts

-

1k+ parts

$8.678

10k+ parts

-

2,238

$8.090

-

$8.678

-

DigiPath Technology Company

USA . 794 parts In-Stock

1+ parts

$8.908

100+ parts

-

1k+ parts

-

10k+ parts

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794

$8.908

-

-

-

ChromeModa Solutions

Germany . 5,802 parts In-Stock

1+ parts

$9.090

100+ parts

$7.454

1k+ parts

-

10k+ parts

-

5,802

$9.090

$7.454

-

-

IDEA Electronic Components Group

UK . 531 parts In-Stock

1+ parts

$9.090

100+ parts

$8.636

1k+ parts

$8.181

10k+ parts

-

531

$9.090

$8.636

$8.181

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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25,000

-

-

-

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GreenTree Electronics

Israel . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10,000

-

-

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A-Z Elektronik GmbH

Germany . 9,224 parts In-Stock

1+ parts

-

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9,224

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-

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Lixinc

USA . 7,152 parts In-Stock

1+ parts

-

100+ parts

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7,152

-

-

-

-

Glotronic Ltd.

UK . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,700

-

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,000

-

-

-

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Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,000

-

-

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Overview

Upgrade your electronic designs with the TMP461AIRUNR-S from Texas Instruments, a top-quality manufacturer known for reliable and innovative semiconductor solutions. This chip carrier package is perfect for a wide range of applications in automotive environments, offering precise temperature monitoring and control. Experience the benefits of a trusted brand, high-quality materials, and superior performance with this cutting-edge analog circuit. Trust in Texas Instruments to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good mechanical strength and protection for the internal components of the semiconductor, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for efficient and easy assembly onto circuit boards, saving space and making the product suitable for compact designs.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a commonly used supply voltage of 3.3 V makes this product compatible with a wide range of electronic applications.

No. of Terminals: 10

Having a sufficient number of terminals allows for versatile connectivity options and integration within diverse circuit configurations.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions or extended periods of usage without performance degradation.

Minimum Operating Temperature: -40 °C

Being able to operate at low temperatures makes this product suitable for applications that require functionality in cold environments or during temperature fluctuations.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish materials enhances the product's conductivity, corrosion resistance, and solderability, ensuring stable electrical connections.

Width (mm): 2 mm

Having a compact width enables space-saving installation and integration in electronic devices with limited board space.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets industry standards for performance, reliability, and durability in demanding automotive environments.

Maximum Supply Current (Isup): 0.375 mA

Low supply current consumption is ideal for energy-efficient designs and prolonging battery life in portable electronic devices.

Technical Specifications

Other Function Semiconductors TMP461AIRUNR-S attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N10

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

.375 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2 mm

Trade Compliance

TMP461AIRUNR-S Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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