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TMDSEVM355

Texas Instruments

TMDSEVM355 by Texas Instruments

TMDSEVM355 by Texas Instruments is an ARM9-based DSP evaluation board from the DaVinci™ series. It features the TMS320DM355 IC, runs on Linux OS, and is designed for digital video applications. The package includes board(s), cable(s), power supply, and accessories, making it a comprehensive evaluation platform for developers.

Median Price

$524.010

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1 parts In-Stock

1+ parts

$524.010

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1

$524.010

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 683 parts In-Stock

1+ parts

$517.465

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683

$517.465

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Vyrian

USA . 8,760 parts In-Stock

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8,760

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1 parts In-Stock

1+ parts

$463.000

100+ parts

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1

$463.000

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Semicontronic

India . 1 parts In-Stock

1+ parts

$463.000

100+ parts

$451.425

1k+ parts

$449.110

10k+ parts

-

1

$463.000

$451.425

$449.110

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Corphita

USA . 4,682 parts In-Stock

1+ parts

$490.230

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4,682

$490.230

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Component Stockers USA

USA . 1 parts In-Stock

1+ parts

$540.680

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1

$540.680

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Corohmni

South Africa . 277 parts In-Stock

1+ parts

$544.700

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277

$544.700

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ChromeModa Solutions

Germany . 5,761 parts In-Stock

1+ parts

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5,761

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Parana Technologies

USA . 2,109 parts In-Stock

1+ parts

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$0.969

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2,109

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$0.969

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DigiPath Technology Company

USA . 1,089 parts In-Stock

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1,089

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IDEA Electronic Components Group

UK . 62 parts In-Stock

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62

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Overview

Discover the endless possibilities with the TMDSEVM355 by Texas Instruments, a top-quality evaluation board from the renowned DaVinci™ series. Perfect for developing embedded MCU and DSP applications in the digital video realm, this board comes complete with everything you need to get started right out of the box. With its ARM9 core processor and Linux operating system, you'll experience unmatched performance and flexibility. Whether you're a seasoned developer or just starting out, this board offers value, benefits, and advantages that will take your projects to the next level. Upgrade your development toolkit today with the TMDSEVM355.

Feature Benefit Bullets

Series: DaVinci™

The DaVinci series is well-known for its features and capabilities in the domain of digital video processing, making this evaluation board a good choice for projects related to digital video applications.

Core Processor: ARM9

The ARM9 core processor provides a good balance between performance and power efficiency, making it suitable for a wide range of applications where digital video processing is required.

Operating System: Linux

The Linux operating system offers flexibility and customization options for developers, allowing them to tailor the software environment to their specific requirements for digital video processing.

Technical Specifications

Additional Parts TMDSEVM355 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Core Processor:

ARM9

Category:

Development Boards, Kits, Programmers
Evaluation Boards Embedded MCU, DSP Evaluation Boards

Platform:

Digital Video

Mounting Type:

Fixed

Standard Package:

1

Series:

DaVinci™

Type:

DSP

Contents:

Board(s), Cable(s), Power Supply, Accessories

Board Type:

Evaluation Platform

Utilized IC / Part:

TMS320DM355

Operating System:

Linux

Package:

Box

Base Product Number:

TMDS

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TMDSEVM355 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

3A991A2

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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