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TM4C129XNCZADT3R

Texas Instruments

TM4C129XNCZADT3R by Texas Instruments

TM4C129XNCZADT3R by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 24-Ch 12-Bit ADC channels and 32 DMA channels. It features a max clock frequency of 25 MHz, connectivity options like CAN, Ethernet, and USB, and operates in industrial temperature grades. Ideal for applications requiring high-speed data processing and multiple peripherals.

Median Price

$17.162

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,594 parts In-Stock

1+ parts

$17.785

100+ parts

$15.535

1k+ parts

$10.714

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4,594

$17.785

$15.535

$10.714

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DigiKey

USA . 1,000 parts In-Stock

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$16.538

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$16.538

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Digiode

USA . 2,848 parts In-Stock

1+ parts

$16.896

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2,848

$16.896

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Vyrian

USA . 8,009 parts In-Stock

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SPM Sales

USA . 765 parts In-Stock

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765

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,455 parts In-Stock

1+ parts

$15.120

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4,455

$15.120

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Corphita

USA . 3,491 parts In-Stock

1+ parts

$16.006

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3,491

$16.006

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Microchip USA

USA . 2,354 parts In-Stock

1+ parts

$39.390

100+ parts

$38.830

1k+ parts

$38.540

10k+ parts

$38.260

2,354

$39.390

$38.830

$38.540

$38.260

Corohmni

South Africa . 55 parts In-Stock

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$47.656

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55

$47.656

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Parana Technologies

USA . 1,627 parts In-Stock

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$49.074

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DigiPath Technology Company

USA . 638 parts In-Stock

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$54.036

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638

$54.036

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ChromeModa Solutions

Germany . 3,697 parts In-Stock

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$55.139

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$45.214

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3,697

$55.139

$45.214

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IDEA Electronic Components Group

UK . 2,012 parts In-Stock

1+ parts

$55.139

100+ parts

$52.382

1k+ parts

$49.625

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2,012

$55.139

$52.382

$49.625

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Continental Prestige Electronics

USA . 4,440 parts In-Stock

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Argo Parts USA

USA . 2,912 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TM4C129XNCZADT3R microcontroller by Texas Instruments. Designed with precision and reliability in mind, this high-quality product offers unparalleled performance in a wide range of applications. With advanced features like integrated cache and low power mode, this microcontroller provides customers with exceptional value and benefits. Whether you're working on IoT devices, industrial automation, or robotics, the TM4C129XNCZADT3R is the perfect choice for your next project. Trust Texas Instruments to deliver innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Integrated Cache: YES

The integrated cache helps in improving the overall performance of the microcontroller by providing faster access to frequently used instructions and data.

Maximum Supply Voltage: 1.32 V

This moderate supply voltage allows for efficient power consumption while still providing enough voltage for the operation of the microcontroller.

RAM Words: 256

With a decent amount of RAM available, the microcontroller can handle complex tasks and data processing effectively.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data, expanding its capability to interface with various sensors and devices.

Maximum Clock Frequency: 25 MHz

The high clock frequency allows for fast processing speed, making it suitable for applications that require quick response times.

Connectivity: 1-WIRE, CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

The diverse connectivity options make this microcontroller versatile and compatible with a wide range of communication protocols and interfaces.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient processing and reduced instruction execution time, enhancing overall performance.

Technical Specifications

Microcontrollers TM4C129XNCZADT3R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

3

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Current:

144.6 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

1-WIRE, CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C129XNCZADT3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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