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TM4C129XNCZADT3

Texas Instruments

TM4C129XNCZADT3 by Texas Instruments

TM4C129XNCZADT3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 1048576 ROM words, and 256 RAM words. It features 24-Ch 12-Bit ADCs, 32 DMA channels, and peripherals like PWM(8) and UART(8). Ideal for industrial applications requiring low power mode and connectivity options such as CAN(2) and USB.

Median Price

$20.417

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,688 parts In-Stock

1+ parts

$20.654

100+ parts

$18.041

1k+ parts

$12.442

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3,688

$20.654

$18.041

$12.442

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Mouser Electronics

USA . 184 parts In-Stock

1+ parts

-

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$20.180

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184

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$20.180

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Distributors (In-Stock)

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Digiode

USA . 2,174 parts In-Stock

1+ parts

$19.621

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2,174

$19.621

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Vyrian

USA . 4,756 parts In-Stock

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4,756

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Chip Stock

USA . 1,040 parts In-Stock

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Bristol Electronics

USA . 380 parts In-Stock

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380

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,660 parts In-Stock

1+ parts

$14.980

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1,660

$14.980

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Corphita

USA . 4,763 parts In-Stock

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$18.589

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4,763

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Parana Technologies

USA . 780 parts In-Stock

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$37.826

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780

$37.826

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IDEA Electronic Components Group

UK . 627 parts In-Stock

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$42.501

100+ parts

$40.376

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$38.251

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627

$42.501

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$38.251

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ChromeModa Solutions

Germany . 236 parts In-Stock

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$42.501

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$34.851

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236

$42.501

$34.851

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Microchip USA

USA . 2,980 parts In-Stock

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$53.480

100+ parts

$52.720

1k+ parts

$52.340

10k+ parts

$51.950

2,980

$53.480

$52.720

$52.340

$51.950

Corohmni

South Africa . 227 parts In-Stock

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$85.512

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227

$85.512

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,856 parts In-Stock

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Argo Parts USA

USA . 2,373 parts In-Stock

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DigiPath Technology Company

USA . 1,098 parts In-Stock

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$38.319

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1,098

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$38.319

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A-Z Elektronik GmbH

Germany . 184 parts In-Stock

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184

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Elevate your projects with the TM4C129XNCZADT3 microcontroller by Texas Instruments. Renowned for quality and innovation, Texas Instruments delivers top-notch solutions in the microcontroller category. This powerful device boasts integrated cache, multiple ADC channels, DMA channels, and a wide range of peripherals for enhanced functionality. With a low power mode and high clock frequency, this microcontroller offers exceptional performance and efficiency. Whether you're working on IoT devices, industrial automation, or consumer electronics, the TM4C129XNCZADT3 provides unmatched value and reliability for your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides a good balance of durability and cost-effectiveness.

Integrated Cache: YES

Having an integrated cache helps improve the processing speed and efficiency of the microcontroller.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage allows for flexibility in power supply options.

On Chip Data RAM Width: 8

A wider data RAM width enables faster data processing and storage capabilities.

Address Bus Width: 28

A wider address bus width allows for accessing a larger memory space, enhancing overall performance.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the circuit board.

Bit Size: 32

A 32-bit microcontroller allows for processing larger chunks of data at a time, increasing efficiency.

No. of Terminals: 212

Having a higher number of terminals allows for more connectivity options and functionality in the system design.

Minimum Supply Voltage: 1.14 V

The lower minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions.

CPU Family: CORTEX-M4F

Being part of the Cortex-M4F family ensures advanced features and performance capabilities.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for use in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion for sensor interfacing and data acquisition.

DMA Channels: YES

Having DMA channels helps in efficient data transfer between peripherals, reducing CPU workload.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and routing.

ROM Words: 1048576

With a large ROM capacity, this microcontroller can store a significant amount of program data.

Maximum Seated Height: 1 mm

The low seated height saves space in the system design, especially in compact applications.

RAM Words: 256

Having sufficient RAM words enables efficient data processing and multitasking capabilities.

Width: 10 mm

A compact width dimension helps in space-constrained designs and PCB layouts.

Data EEPROM Size: 6K

The EEPROM size of 6K allows for non-volatile data storage, essential for user settings and configuration data.

Boundary Scan: YES

Boundary scan support aids in debugging and testing the microcontroller during development and production.

External Data Bus Width: 32

A wider external data bus width facilitates faster data transfer speeds and enhanced system performance.

Peripherals: BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

The wide range of peripherals offers flexibility in designing various applications and interfaces.

Maximum Clock Frequency: 25 MHz

A high maximum clock frequency allows for fast data processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for 30 seconds ensures robust soldering during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability meets industry standards for soldering processes.

Length: 10 mm

A compact length dimension aids in space-saving design implementations.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller offers high performance and power efficiency for embedded applications.

No. of Timers: 8

Having multiple timers enables precise timing control for various tasks and operations.

RAM Bytes: 262144

With a large RAM capacity in bytes, the microcontroller can handle complex data processing and storage requirements.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and enhances PCB assembly reliability.

Analog To Digital Converters: 24-Ch 12-Bit

Having 24 ADC channels with 12-bit resolution allows for precise analog signal conversion and data acquisition.

Maximum Supply Current: 144.6 mA

The moderate supply current ensures efficient power usage and prolongs battery life in portable devices.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage provides consistent performance and reliable operation.

No. of DMA Channels: 32

The high number of DMA channels enables efficient data transfer and peripheral communications.

No. of Serial I/Os: 3

Having multiple serial I/Os allows for versatile communication interfaces with external devices.

PWM Channels: YES

The availability of PWM channels enables precise control of motor drivers, LED dimming, and analog signal generation.

Connectivity: 1-WIRE, CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

The diverse connectivity options support a wide range of communication protocols and interfaces for seamless integration.

ROM Programmability: FLASH

Programmability via FLASH memory allows for easy firmware updates and customization of software algorithms.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting and compact PCB designs.

Format: FLOATING POINT

Support for floating-point operations enhances mathematical accuracy and computation capabilities in applications.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage precautions.

Speed: 120 rpm

With a speed of 120 rpm, the microcontroller can efficiently handle tasks requiring precise timing and control.

Low Power Mode: YES

The low power mode option helps in conserving energy and prolonging battery life in power-sensitive applications.

On Chip Program ROM Width: 8

Having a wide on-chip ROM width allows for storing a large program code for efficient execution.

No. of I/O Lines: 140

A high number of I/O lines provide extensive connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers TM4C129XNCZADT3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

3

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Current:

144.6 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

1-WIRE, CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C129XNCZADT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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