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TM4C129LNCZADI3R

Texas Instruments

TM4C129LNCZADI3R by Texas Instruments

TM4C129LNCZADI3R by Texas Instruments is a 32-bit microcontroller with integrated cache and a max clock frequency of 25 MHz. It is commonly used in industrial applications, offering connectivity options such as CAN, Ethernet, I2C, SPI, UART, and USB.

Median Price

$16.783

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Texas Instruments

USA . 37,319 parts In-Stock

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$16.783

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$14.660

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$10.110

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$16.783

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Nova Conductors

Japan . 15 parts In-Stock

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$14.154

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Digiode

USA . 1,686 parts In-Stock

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$15.944

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1,686

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Chip Stock

USA . 6,205 parts In-Stock

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Vyrian

USA . 2,605 parts In-Stock

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Cyclops Electronics Ltd

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Continental Prestige Electronics

USA . 1,354 parts In-Stock

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$12.941

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$12.682

1,354

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$12.682

Advanced Electronics

New Zealand . 150 parts In-Stock

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$13.200

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$13.200

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$13.200

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150

$13.200

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Netroflash

USA . 2,000 parts In-Stock

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$14.154

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$13.871

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$14.154

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Ampacity Inc.

Singapore . 37,189 parts In-Stock

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$14.270

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AZTECH Wire

Italy . 1,057 parts In-Stock

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$15.080

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Corphita

USA . 935 parts In-Stock

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Microchip USA

USA . 2,598 parts In-Stock

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$37.170

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$36.640

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$36.370

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$36.110

2,598

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$36.640

$36.370

$36.110

Corohmni

South Africa . 85 parts In-Stock

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$45.282

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Parana Technologies

USA . 1,630 parts In-Stock

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$69.623

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DigiPath Technology Company

USA . 540 parts In-Stock

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$76.663

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$70.530

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ChromeModa Solutions

Germany . 5,425 parts In-Stock

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$78.228

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$64.147

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IDEA Electronic Components Group

UK . 864 parts In-Stock

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$78.228

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$74.317

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$70.405

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Lixinc

USA . 5,979 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,709 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Overview

Discover the TM4C129LNCZADI3R, a high-quality microcontroller by Texas Instruments. With its advanced technology and reliable performance, this microcontroller offers numerous advantages for a wide range of applications. Whether you're working on industrial automation, consumer electronics, or IoT projects, this versatile device provides exceptional value and benefits. Experience seamless connectivity with its multiple serial I/Os, USB, and Ethernet options. Enjoy efficient power management with its low-power mode. Unlock endless possibilities with the TM4C129LNCZADI3R and take your projects to new heights.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This package body material provides durability and versatility, making it suitable for various applications.

Integrated Cache

YES - The integrated cache enhances the performance and efficiency of the microcontroller, making it a reliable choice for high-speed data processing.

Surface Mount

YES - The surface mount feature allows for easy installation, saving time and effort during assembly.

Maximum Supply Voltage

1.32 V - With a high maximum supply voltage, the microcontroller can handle demanding power requirements, ensuring stable and efficient operation.

On Chip Data RAM Width

8 - The wide on-chip data RAM width allows for simultaneous access and storage of large amounts of data, enabling faster and more efficient processing.

Address Bus Width

28 - The wide address bus width enables the microcontroller to access a large memory space, accommodating complex and data-intensive programs.

Package Shape

SQUARE - The square package shape facilitates easier integration into various circuit designs, offering flexibility and compatibility.

Bit Size

32 - The 32-bit size of this microcontroller allows for enhanced data manipulation and processing capabilities, providing versatility for a wide range of applications.

No. of Terminals

212 - The high number of terminals ensures sufficient connectivity options, enabling seamless integration with other components and peripherals.

Package Style (Meter)

GRID ARRAY, VERY THIN PROFILE, FINE PITCH - The grid array package style offers a compact and space-saving design, suitable for applications with limited space availability.

Minimum Supply Voltage

1.14 V - The low minimum supply voltage enables energy-efficient operation, making it an ideal choice for battery-powered devices.

Maximum Operating Temperature

85 °C - With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, ensuring reliability and durability.

CPU Family

CORTEX-M4F - The Cortex-M4F CPU family provides advanced processing capabilities, enabling the microcontroller to handle complex calculations and tasks efficiently.

Minimum Operating Temperature

40 °C - The low minimum operating temperature allows this microcontroller to be used in extreme temperature environments, expanding its suitability for various applications.

Terminal Finish

TIN SILVER COPPER - The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring reliable and long-lasting connections.

ADC Channels

YES - The built-in ADC channels allow for direct analog signal input, facilitating accurate and precise data acquisition in applications that require analog sensing.

DMA Channels

YES - The availability of DMA channels enables efficient data transfer between peripherals and memory, reducing the CPU load and improving overall system performance.

Terminal Position

BOTTOM - The bottom terminal position allows for convenient and straightforward soldering or mounting, simplifying the assembly process.

ROM Words

1048576 - The large ROM word size enables the storage of extensive program code, accommodating complex applications and ensuring sufficient memory capacity.

Maximum Seated Height

1 mm - The microcontroller's low seated height allows for compact device designs, making it suitable for applications with limited vertical space.

RAM Words

256 - The generous RAM word size provides ample space for temporary data storage, enhancing the microcontroller's processing capabilities and efficiency.

Width

10 mm - The compact width dimensions make this microcontroller suitable for space-constrained applications, enabling flexible integration.

Data EEPROM Size

6K - The significant data EEPROM size allows for non-volatile storage of critical data, ensuring data retention even when power is lost.

Boundary Scan

YES - The availability of boundary scan facilitates efficient testing and fault detection during manufacturing, ensuring better quality control of the microcontroller.

External Data Bus Width

32 - The wide external data bus width enables high-speed data transfer between the microcontroller and external devices, enhancing overall system performance.

Peripherals

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2) - The abundance of peripherals offers versatile functionality, allowing the microcontroller to support various tasks and applications.

Maximum Clock Frequency

25 MHz - The high maximum clock frequency enables fast execution of instructions, enhancing the microcontroller's processing speed and overall performance.

Maximum Time At Peak Reflow Temperature (s)

30 - The microcontroller's short time at peak reflow temperature ensures its reliability in the manufacturing process, preventing potential damage.

Peak Reflow Temperature °C

260 - The high peak reflow temperature allows for effective soldering, ensuring secure and robust connections during the manufacturing process.

Length

10 mm - The compact length dimensions make this microcontroller suitable for space-constrained applications, enabling flexible integration.

Temperature Grade

INDUSTRIAL - The industrial temperature grade ensures the microcontroller's suitability for harsh operating conditions, making it a reliable choice for industrial applications.

Peripheral IC Type

MICROCONTROLLER, RISC - The microcontroller's RISC architecture, combined with its integrated peripheral functionality, provides efficient and streamlined operation, suitable for various embedded applications.

No. of Timers

8 - The availability of multiple timers allows for precise timing and event management, enhancing the microcontroller's versatility and functionality.

RAM Bytes

262144 - The generous RAM capacity in bytes provides ample space for temporary data storage, enhancing the microcontroller's processing capabilities and efficiency.

Technology

CMOS - The use of CMOS technology ensures low power consumption and high operational efficiency, making this microcontroller suitable for energy-conscious applications.

Terminal Form

BALL - The ball terminal form enables reliable connections and efficient heat dissipation, ensuring the microcontroller's long-term stability and performance.

Analog To Digital Converters

24-Ch 12-Bit - The presence of 24-channel 12-bit analog-to-digital converters allows for precise analog signal conversion, supporting accurate sensing and measurement applications.

Nominal Supply Voltage

1.2 V - The microcontroller's nominal supply voltage ensures stable and reliable operation, making it suitable for a wide range of applications.

No. of DMA Channels

32 - The availability of 32 DMA channels enables efficient data transfer and handling, reducing the CPU load and improving overall system performance.

No. of Serial I/Os

5 - The presence of multiple serial I/Os allows for flexible communication with external devices, expanding the microcontroller's connectivity options.

PWM Channels

YES - The availability of PWM channels enables precise control of analog signals, making this microcontroller suitable for applications requiring accurate signal modulation and motor control.

Connectivity

CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB - The wide range of connectivity options enables seamless integration with various communication protocols, expanding the microcontroller's compatibility and versatility.

ROM Programmability

FLASH - The microcontroller's flash programmability allows for easy and convenient code updates, ensuring flexibility and adaptability in changing application requirements.

Terminal Pitch

0.5 mm - The small terminal pitch facilitates high-density mounting, enabling compact PCB designs and saving valuable space in applications with limited board space.

Format

FLOATING POINT - The microcontroller's floating-point format enables precise and efficient handling of decimal calculations, making it a suitable choice for applications requiring high mathematical accuracy.

Moisture Sensitivity Level (MSL)

3 - The moisture sensitivity level protects the microcontroller during storage and handling, ensuring reliability and preventing potential damage.

Speed

120 rpm - The microcontroller's speed of 120 rpm makes it suitable for applications requiring precise rotational control, such as motor control or robotics.

Low Power Mode

YES - The availability of a low power mode allows for energy-saving operation, prolonging battery life and making this microcontroller suitable for power-constrained applications.

On Chip Program ROM Width

8 - The wide on-chip program ROM width enables the storage of extensive firmware or bootloader code, ensuring flexibility and adaptability for firmware updates.

No. of I/O Lines

140 - The ample number of I/O lines provides extensive connectivity options, allowing for versatile system integration and peripheral connectivity.

Technical Specifications

Microcontrollers TM4C129LNCZADI3R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

5

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C129LNCZADI3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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