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TM4C129ENCZADT3

Texas Instruments

TM4C129ENCZADT3 by Texas Instruments

TM4C129ENCZADT3 by Texas Instruments is a 32-bit microcontroller with integrated cache and 8-bit on-chip data RAM. It has a wide range of applications including industrial automation, robotics, and IoT devices.

Median Price

$17.644

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 349 parts In-Stock

1+ parts

$9.950

100+ parts

$9.750

1k+ parts

$9.550

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349

$9.950

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$9.550

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Texas Instruments

USA . 186 parts In-Stock

1+ parts

$14.967

100+ parts

$13.073

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$9.016

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186

$14.967

$13.073

$9.016

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DigiKey

USA . 198 parts In-Stock

1+ parts

$20.320

100+ parts

$15.203

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$13.179

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198

$20.320

$15.203

$13.179

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Mouser Electronics

USA . 11 parts In-Stock

1+ parts

$20.320

100+ parts

$13.710

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$13.170

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11

$20.320

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$13.170

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Distributors (In-Stock)

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Digiode

USA . 719 parts In-Stock

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$9.452

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719

$9.452

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Nova Conductors

Japan . 50 parts In-Stock

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$13.727

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50

$13.727

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Vyrian

USA . 6,421 parts In-Stock

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6,421

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Chip Stock

USA . 647 parts In-Stock

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647

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Distributors (Availability)

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Ampacity Inc.

Singapore . 236 parts In-Stock

1+ parts

$8.460

100+ parts

-

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236

$8.460

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Corphita

USA . 4,476 parts In-Stock

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$8.955

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4,476

$8.955

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Aranea Global

USA . 1,000 parts In-Stock

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$13.452

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$12.914

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1,000

$13.452

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$12.914

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Parana Technologies

USA . 2,114 parts In-Stock

1+ parts

$17.517

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$17.709

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2,114

$17.517

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$17.709

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DigiPath Technology Company

USA . 143 parts In-Stock

1+ parts

$19.288

100+ parts

$17.745

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143

$19.288

$17.745

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ChromeModa Solutions

Germany . 5,422 parts In-Stock

1+ parts

$19.682

100+ parts

$16.139

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5,422

$19.682

$16.139

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IDEA Electronic Components Group

UK . 1,311 parts In-Stock

1+ parts

$19.682

100+ parts

$18.698

1k+ parts

$17.714

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1,311

$19.682

$18.698

$17.714

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Microchip USA

USA . 2,167 parts In-Stock

1+ parts

$53.540

100+ parts

$52.770

1k+ parts

$52.390

10k+ parts

$52.010

2,167

$53.540

$52.770

$52.390

$52.010

Corohmni

South Africa . 68 parts In-Stock

1+ parts

$75.868

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68

$75.868

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Overview

Experience the next level of microcontroller technology with the TM4C129ENCZADT3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers superior quality and reliability. This microcontroller offers a range of applications, from industrial automation to IoT devices. With its integrated cache and advanced features, it provides unmatched performance and efficiency. The TM4C129ENCZADT3 stands out for its value and benefits, providing customers with seamless connectivity, powerful processing capabilities, and low power consumption. Trust Texas Instruments to enhance your projects with this innovative microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and resistance to external factors, making this microcontroller suitable for various environments.

Integrated Cache: YES

The integrated cache allows for faster data access, enhancing the overall performance and efficiency of this microcontroller.

Surface Mount: YES

Being surface mountable simplifies the assembly process, making it more convenient for manufacturers and reducing production time and costs.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage provides flexibility in power requirements, allowing compatibility with a wider range of systems and devices.

On Chip Data RAM Width: 8

The 8-bit data RAM width facilitates efficient data storage and manipulation, enabling smoother and faster operations.

Address Bus Width: 28

With a 28-bit address bus width, this microcontroller can access a large memory space, accommodating extensive data storage and processing needs.

Package Shape: SQUARE

The square package shape offers better space utilization, making it easier to integrate this microcontroller into compact electronic designs.

Bit Size: 32

The 32-bit architecture enhances processing capabilities, allowing for more complex tasks and calculations to be performed quickly and accurately.

No. of Terminals: 212

The abundance of terminals provides versatile connectivity options, enabling seamless integration with a wide range of external devices and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch offers high density packaging, enabling miniaturization of electronic systems and maximizing space efficiency.

Minimum Supply Voltage: 1.14 V

The lower minimum supply voltage allows for reduced power consumption and increased energy efficiency, making the microcontroller suitable for battery-powered applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures the microcontroller's reliability and functionality in demanding industrial environments.

CPU Family: CORTEX-M4F

belonging to the Cortex-M4F CPU family ensures excellent performance, advanced features, and extensive hardware and software support in this microcontroller.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range guarantees the microcontroller's reliable operation even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The tin silver copper terminal finish provides excellent solderability, corrosion resistance, and electrical conductivity, enhancing the microcontroller's longevity and reliability.

ADC Channels: YES

The presence of analog-to-digital converter channels enables the microcontroller to interface with analog sensors and signals, expanding its application possibilities.

DMA Channels: YES

Having direct memory access (DMA) channels allows for efficient data transfer between peripherals and memory, optimizing system performance and freeing up the CPU from data handling tasks.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB layout and streamlined assembly processes, contributing to smoother and more cost-effective production.

ROM Words: 1048576

With 1048576 ROM words, this microcontroller provides ample space for program storage, accommodating complex software algorithms and functionality.

Maximum Seated Height: 1 mm

The microcontroller's low seated height allows for compact and space-saving designs, particularly valuable in weight- and size-constrained applications.

RAM Words: 256

The microcontroller's 256 RAM words offer sufficient working memory for data storage and efficient execution of operations.

Width: 10 mm

The microcontroller's compact width of 10 mm contributes to flexibility and ease of integration in various electronic systems and devices.

Data EEPROM Size: 6K

With a 6K data EEPROM size, this microcontroller allows for reliable and non-volatile data storage, essential for retaining critical information during power loss or system shutdown.

Boundary Scan: YES

The presence of a boundary scan feature simplifies debugging and testing during production, improving overall product quality and facilitating efficient manufacturing processes.

External Data Bus Width: 32

The wide 32-bit external data bus width enables high-speed data transfers and efficient communication with external devices, enhancing overall system performance.

Peripherals: BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

The inclusion of a wide range of peripherals, such as brownout detector (BOD), comparators, DMA channels, LCD interface, timers, and more, enhances the microcontroller's versatility and functionality for diverse applications.

Maximum Clock Frequency: 25 MHz

The microcontroller's high maximum clock frequency of 25 MHz allows for fast and responsive processing, suitable for real-time applications and demanding tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can endure the peak reflow temperature for up to 30 seconds, enabling efficient and reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

The microcontroller's peak reflow temperature tolerance of 260°C ensures proper soldering and connectivity during the manufacturing process.

Length: 10 mm

The microcontroller's compact length of 10 mm facilitates space-efficient designs, particularly beneficial in small form-factor devices and systems.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this microcontroller can withstand harsh environmental conditions, temperature fluctuations, and rigorous operating demands.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller of the RISC (Reduced Instruction Set Computer) architecture type ensures high performance, power efficiency, and streamlined instruction execution in this IC.

No. of Timers: 8

The microcontroller's 8 timers provide versatile timing and scheduling capabilities, enabling precise control and coordination of operations in various applications.

RAM Bytes: 262144

With 262144 RAM bytes, this microcontroller offers extensive working memory, capable of storing and accessing large data sets for complex computations and operations.

Technology: CMOS

Utilizing CMOS (Complementary Metal-Oxide-Semiconductor) technology ensures efficient power consumption, reduced heat generation, and increased operational reliability in this microcontroller.

Terminal Form: BALL

The ball terminal form facilitates reliable soldering connections, simplifying the assembly process and contributing to durable product construction.

Analog To Digital Convertors: 24-Ch 12-Bit

With 24-channel 12-bit analog-to-digital converters, this microcontroller can accurately convert analog signals into digital data, enabling precise measurement and control in analog applications.

Maximum Supply Current: 140 mA

The microcontroller's maximum supply current of 140 mA provides flexibility in power management and enables it to operate with different power sources and systems.

Nominal Supply Voltage: 1.2 V

The microcontroller's nominal supply voltage of 1.2 V ensures compatibility with low-voltage power sources, enhancing energy efficiency and reducing power consumption.

No. of DMA Channels: 32

The microcontroller's 32 DMA channels enable efficient data transfer between different modules and peripherals, optimizing system performance and reducing CPU overhead.

No. of Serial I/Os: 5

With 5 serial input/output interfaces, this microcontroller offers versatile connectivity options, allowing for communication with various external devices and systems.

PWM Channels: YES

The microcontroller's support for pulse width modulation (PWM) channels enables precise control of power output and analog signal generation for applications such as motor control and LED dimming.

Connectivity: CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

With multiple connectivity options such as CAN, Ethernet, I2C, IRDA, SPI, SSI, UART, and USB, this microcontroller allows for seamless integration with diverse networks and devices, expanding its application versatility.

ROM Programmability: FLASH

The microcontroller's programmability through flash memory allows for flexible and convenient firmware updating, facilitating product maintenance and future enhancements.

Terminal Pitch: 0.5 mm

The microcontroller's small terminal pitch of 0.5 mm enables high-density PCB layouts, allowing for compact electronic designs and efficient use of board space.

Format: FLOATING POINT

Supporting floating-point format enhances the microcontroller's mathematical capabilities, enabling precise calculations and complex algorithms required in scientific and numerical applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this microcontroller ensures safe handling and storage during manufacturing, reducing the risk of moisture-related damage.

Speed: 120 rpm

The microcontroller's speed of 120 revolutions per minute signifies its suitability for controlling motors and rotational devices, enabling precise speed and position control.

Low Power Mode: YES

The availability of a low-power mode enhances the microcontroller's energy efficiency, enabling extended battery life and reducing power consumption in power-sensitive applications.

On Chip Program ROM Width: 8

The microcontroller's 8-bit on-chip program ROM width allows for efficient storage and execution of program code, supporting seamless operation and rapid system response.

No. of I/O Lines: 140

With 140 I/O lines, this microcontroller offers extensive connectivity options, providing versatile interfaces for external devices, sensors, and other peripherals.

Technical Specifications

Microcontrollers TM4C129ENCZADT3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

5

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C129ENCZADT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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