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TM4C129DNCZADT3

Texas Instruments

TM4C129DNCZADT3 by Texas Instruments

TM4C129DNCZADT3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 1048576 ROM words, and 256 RAM words. It features 24-Ch 12-Bit ADCs, 32 DMA channels, and peripherals like CAN, ETHERNET, and USB. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$13.768

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,785 parts In-Stock

1+ parts

$13.768

100+ parts

$12.026

1k+ parts

$8.294

10k+ parts

-

1,785

$13.768

$12.026

$8.294

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,327 parts In-Stock

1+ parts

$13.080

100+ parts

-

1k+ parts

-

10k+ parts

-

3,327

$13.080

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-

-

Vyrian

USA . 6,659 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,659

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,958 parts In-Stock

1+ parts

$12.391

100+ parts

-

1k+ parts

-

10k+ parts

-

1,958

$12.391

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-

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Parana Technologies

USA . 1,388 parts In-Stock

1+ parts

$17.685

100+ parts

-

1k+ parts

$17.873

10k+ parts

-

1,388

$17.685

-

$17.873

-

DigiPath Technology Company

USA . 1,236 parts In-Stock

1+ parts

$19.474

100+ parts

$17.916

1k+ parts

-

10k+ parts

-

1,236

$19.474

$17.916

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IDEA Electronic Components Group

UK . 938 parts In-Stock

1+ parts

$19.871

100+ parts

$18.877

1k+ parts

$17.884

10k+ parts

-

938

$19.871

$18.877

$17.884

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ChromeModa Solutions

Germany . 796 parts In-Stock

1+ parts

$19.871

100+ parts

$16.294

1k+ parts

-

10k+ parts

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796

$19.871

$16.294

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AZTECH Wire

Italy . 793 parts In-Stock

1+ parts

$19.880

100+ parts

-

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10k+ parts

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793

$19.880

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Microchip USA

USA . 1,252 parts In-Stock

1+ parts

$140.500

100+ parts

$138.050

1k+ parts

$136.830

10k+ parts

$135.610

1,252

$140.500

$138.050

$136.830

$135.610

QUARKTWIN TECHNOLOGY LTD

USA . 24,354 parts In-Stock

1+ parts

-

100+ parts

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24,354

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Overview

Unleash the power of innovation with the Texas Instruments TM4C129DNCZADT3 microcontroller. Built with precision and quality in mind, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, from IoT to industrial automation, this microcontroller is designed to meet your every need. With advanced features like integrated cache memory and multiple ADC channels, this product provides value and efficiency to customers looking to push the boundaries of technology. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the microcontroller chip and ensures durability.

Integrated Cache: YES

The presence of cache helps in improving the performance of the microcontroller by reducing memory access time.

Maximum Supply Voltage: 1.32 V

This voltage level allows for efficient power usage while providing enough power for the microcontroller to operate effectively.

Address Bus Width: 28

With a wider address bus, the microcontroller can access and communicate with a larger range of memory locations, increasing its functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style provides a compact and space-saving design, making it suitable for applications where size is a constraint.

ADC Channels: YES

The presence of multiple ADC channels allows the microcontroller to efficiently convert analog signals to digital data for processing.

Maximum Clock Frequency: 25 MHz

With a high clock frequency, the microcontroller can process instructions at a faster rate, leading to improved performance.

Connectivity: CAN(2), ETHERNET, I2C(10), IRDA, SPI, SSI(4), UART(8), USB

The numerous connectivity options enable seamless integration with various devices and communication protocols, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers TM4C129DNCZADT3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

5

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Current:

113 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET, I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C129DNCZADT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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