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TM4C1299NCZADT3

Texas Instruments

TM4C1299NCZADT3 by Texas Instruments

TM4C1299NCZADT3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, offering 24-Ch 12-Bit ADC channels and 8 PWM channels. Ideal for industrial applications, it features CAN(2), ETHERNET(2), I2C(10), SPI connectivity options and operates at up to 25 MHz clock frequency.

Median Price

$24.608

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,114 parts In-Stock

1+ parts

$18.985

100+ parts

$16.584

1k+ parts

$11.437

10k+ parts

-

2,114

$18.985

$16.584

$11.437

-

Mouser Electronics

USA . 85 parts In-Stock

1+ parts

$30.230

100+ parts

$18.610

1k+ parts

$18.600

10k+ parts

-

85

$30.230

$18.610

$18.600

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,072 parts In-Stock

1+ parts

$18.036

100+ parts

-

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2,072

$18.036

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Vyrian

USA . 4,974 parts In-Stock

1+ parts

-

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-

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4,974

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-

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

-

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-

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700

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 954 parts In-Stock

1+ parts

$16.140

100+ parts

-

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-

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954

$16.140

-

-

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Corphita

USA . 4,437 parts In-Stock

1+ parts

$17.086

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-

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4,437

$17.086

-

-

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Corohmni

South Africa . 353 parts In-Stock

1+ parts

$18.356

100+ parts

-

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353

$18.356

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-

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Microchip USA

USA . 1,839 parts In-Stock

1+ parts

$49.160

100+ parts

$48.460

1k+ parts

$48.110

10k+ parts

$47.760

1,839

$49.160

$48.460

$48.110

$47.760

Parana Technologies

USA . 2,199 parts In-Stock

1+ parts

$55.540

100+ parts

-

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2,199

$55.540

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DigiPath Technology Company

USA . 360 parts In-Stock

1+ parts

$61.156

100+ parts

-

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360

$61.156

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ChromeModa Solutions

Germany . 1,693 parts In-Stock

1+ parts

$62.404

100+ parts

$51.171

1k+ parts

-

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1,693

$62.404

$51.171

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IDEA Electronic Components Group

UK . 293 parts In-Stock

1+ parts

$62.404

100+ parts

$59.284

1k+ parts

$56.164

10k+ parts

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293

$62.404

$59.284

$56.164

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Argo Parts USA

USA . 2,854 parts In-Stock

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2,854

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Continental Prestige Electronics

USA . 1,687 parts In-Stock

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1,687

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the TM4C1299NCZADT3 microcontroller. This versatile component offers a wide range of applications, from industrial automation to consumer electronics, thanks to its advanced features and high-performance capabilities. With integrated cache, ample RAM, and a variety of peripherals, this microcontroller provides exceptional value and flexibility for your projects. Trust Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

The integrated cache helps improve the processing speed of the microcontroller by storing frequently accessed data for quicker retrieval.

ADC Channels: YES

Having Analog to Digital Convertors allows the microcontroller to interface with analog sensors and signals, making it suitable for a wide range of applications.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency enables fast and efficient operation of the microcontroller, making it suitable for real-time applications.

Connectivity: CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

The wide range of connectivity options makes the microcontroller versatile and capable of interfacing with various devices and communication protocols.

Technical Specifications

Microcontrollers TM4C1299NCZADT3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

3

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C1299NCZADT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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