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TM4C1299KCZADI3R

Texas Instruments

TM4C1299KCZADI3R by Texas Instruments

TM4C1299KCZADI3R by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 24-Ch 12-Bit ADC, and 8 PWM channels. Ideal for industrial applications requiring CAN, Ethernet, I2C, SPI connectivity and low power mode. Features include 256 RAM words, 524288 ROM words, and max clock frequency of 25 MHz.

Median Price

$13.214

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,991 parts In-Stock

1+ parts

$13.214

100+ parts

$11.542

1k+ parts

$7.960

10k+ parts

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6,991

$13.214

$11.542

$7.960

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,666 parts In-Stock

1+ parts

$12.553

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1,666

$12.553

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Vyrian

USA . 8,474 parts In-Stock

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8,474

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Cyclops Electronics Ltd

UK . 1,091 parts In-Stock

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TME

Poland . 1,000 parts In-Stock

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$14.927

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1,000

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$14.927

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Distributors (Availability)

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Corphita

USA . 1,283 parts In-Stock

1+ parts

$11.893

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-

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1,283

$11.893

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AZTECH Wire

Italy . 582 parts In-Stock

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$18.980

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582

$18.980

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Microchip USA

USA . 2,332 parts In-Stock

1+ parts

$29.940

100+ parts

$29.510

1k+ parts

$29.300

10k+ parts

$29.080

2,332

$29.940

$29.510

$29.300

$29.080

Parana Technologies

USA . 1,587 parts In-Stock

1+ parts

$75.809

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-

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1,587

$75.809

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ChromeModa Solutions

Germany . 5,171 parts In-Stock

1+ parts

$85.179

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$69.847

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5,171

$85.179

$69.847

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IDEA Electronic Components Group

UK . 1,112 parts In-Stock

1+ parts

$85.179

100+ parts

$80.920

1k+ parts

$76.661

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1,112

$85.179

$80.920

$76.661

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A-Z Elektronik GmbH

Germany . 7,314 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Formix International (Excess)

India . 3,114 parts In-Stock

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Lixinc

USA . 3,013 parts In-Stock

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DigiPath Technology Company

USA . 1,979 parts In-Stock

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$76.797

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1,979

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$76.797

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Kepictronics

USA . 124 parts In-Stock

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Overview

Elevate your projects with the TM4C1299KCZADI3R by Texas Instruments, a top-of-the-line microcontroller that delivers unmatched quality and performance. With a wide range of applications in various industries, this product boasts advanced features such as integrated cache, boundary scan, and peripherals like timers, UART, and USB connectivity. Experience the value of reliability and efficiency that Texas Instruments is known for, as you unleash the full potential of your designs with the TM4C1299KCZADI3R. Elevate your projects with the TM4C1299KCZADI3R by Texas Instruments, a top-of-the-line microcontroller that delivers unmatched quality and performance. With a wide range of applications in various industries, this product boasts advanced features such as integrated cache, boundary scan, and peripherals like timers, UART, and USB connectivity. Experience the value of reliability and efficiency that Texas Instruments is known for, as you unleash the full potential of your designs with the TM4C1299KCZADI3R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring long-term reliability.

Integrated Cache: YES

Integrated cache helps in faster data access and processing, enhancing overall performance of the microcontroller.

Maximum Supply Voltage: 1.32V

Higher maximum supply voltage allows for flexibility in power input, accommodating various power sources.

Address Bus Width: 28

Wide address bus width enables efficient handling of memory addresses, enhancing the microcontroller's capabilities in data processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it offers efficient and fast instruction execution, making it suitable for high-performance applications.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for speedy operations and real-time processing, making this microcontroller ideal for applications requiring fast response times.

Connectivity: CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Versatile connectivity options ensure compatibility with various communication protocols, expanding the range of potential applications for the microcontroller.

Technical Specifications

Microcontrollers TM4C1299KCZADI3R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

9

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Current:

133.4 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C1299KCZADI3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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