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TM4C1297NCZADT3

Texas Instruments

TM4C1297NCZADT3 by Texas Instruments

TM4C1297NCZADT3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, offering 24-Ch 12-Bit ADC channels and 32 DMA channels. Ideal for industrial applications, it features a max clock frequency of 25 MHz, operates in temperatures ranging from -40 to 105 °C, and supports various connectivity options such as CAN, I2C, SPI, UART, and USB.

Median Price

$14.659

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,968 parts In-Stock

1+ parts

$14.659

100+ parts

$12.805

1k+ parts

$8.831

10k+ parts

-

4,968

$14.659

$12.805

$8.831

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,617 parts In-Stock

1+ parts

$13.926

100+ parts

-

1k+ parts

-

10k+ parts

-

3,617

$13.926

-

-

-

Vyrian

USA . 7,531 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,531

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,864 parts In-Stock

1+ parts

$12.460

100+ parts

-

1k+ parts

-

10k+ parts

-

4,864

$12.460

-

-

-

Corphita

USA . 2,777 parts In-Stock

1+ parts

$13.193

100+ parts

-

1k+ parts

-

10k+ parts

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2,777

$13.193

-

-

-

AZTECH Wire

Italy . 1,065 parts In-Stock

1+ parts

$14.920

100+ parts

-

1k+ parts

-

10k+ parts

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1,065

$14.920

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-

-

Parana Technologies

USA . 663 parts In-Stock

1+ parts

$36.529

100+ parts

-

1k+ parts

-

10k+ parts

-

663

$36.529

-

-

-

DigiPath Technology Company

USA . 2,173 parts In-Stock

1+ parts

$40.223

100+ parts

-

1k+ parts

-

10k+ parts

-

2,173

$40.223

-

-

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Microchip USA

USA . 2,880 parts In-Stock

1+ parts

$40.710

100+ parts

$40.130

1k+ parts

$39.840

10k+ parts

$39.540

2,880

$40.710

$40.130

$39.840

$39.540

IDEA Electronic Components Group

UK . 2,188 parts In-Stock

1+ parts

$41.044

100+ parts

$38.992

1k+ parts

$36.940

10k+ parts

-

2,188

$41.044

$38.992

$36.940

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ChromeModa Solutions

Germany . 1,531 parts In-Stock

1+ parts

$41.044

100+ parts

$33.656

1k+ parts

-

10k+ parts

-

1,531

$41.044

$33.656

-

-

Component Stockers USA

USA . 243 parts In-Stock

1+ parts

$201.550

100+ parts

-

1k+ parts

-

10k+ parts

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243

$201.550

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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3,000

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Overview

Experience the next level of innovation with the TM4C1297NCZADT3 microcontroller from Texas Instruments. Renowned for their superior quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds industry standards. Ideal for a wide range of applications, this microcontroller offers unparalleled performance, efficiency, and versatility. Stay ahead of the curve with seamless connectivity, advanced peripherals, and low power consumption. Elevate your projects with the TM4C1297NCZADT3 and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for improved portability and handling.

Maximum Supply Voltage: 1.32 V

Efficient power consumption for longer battery life.

CPU Family: CORTEX-M4F

High-performance Cortex-M4F architecture for advanced processing capabilities.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller design for fast and efficient operations.

Connectivity: CAN(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Versatile connectivity options for seamless integration with external devices.

Technical Specifications

Microcontrollers TM4C1297NCZADT3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

8

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Current:

64 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C1297NCZADT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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