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TM4C1297NCZADI3R

Texas Instruments

TM4C1297NCZADI3R by Texas Instruments

TM4C1297NCZADI3R by Texas Instruments is a 32-bit microcontroller with a max clock frequency of 25 MHz. It features 8 timers, 32 DMA channels, and connectivity options such as CAN, I2C, SPI, UART, and USB. This microcontroller is commonly used in industrial applications due to its low power mode and wide temperature range (-40°C to +85°C).

Median Price

$14.095

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,806 parts In-Stock

1+ parts

$14.095

100+ parts

$12.312

1k+ parts

$8.491

10k+ parts

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4,806

$14.095

$12.312

$8.491

-

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Digiode

USA . 2,196 parts In-Stock

1+ parts

$13.390

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$13.390

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Chip Stock

USA . 2,510 parts In-Stock

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Vyrian

USA . 2,094 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Ampacity Inc.

Singapore . 4,357 parts In-Stock

1+ parts

$11.980

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4,357

$11.980

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Corphita

USA . 3,886 parts In-Stock

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$12.686

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3,886

$12.686

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AZTECH Wire

Italy . 1,063 parts In-Stock

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$17.110

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$17.110

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Microchip USA

USA . 1,995 parts In-Stock

1+ parts

$31.940

100+ parts

$31.480

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$31.250

10k+ parts

$31.020

1,995

$31.940

$31.480

$31.250

$31.020

Corohmni

South Africa . 152 parts In-Stock

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$46.622

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$46.622

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Parana Technologies

USA . 2,310 parts In-Stock

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$68.038

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$68.038

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DigiPath Technology Company

USA . 270 parts In-Stock

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$74.918

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$68.925

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270

$74.918

$68.925

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ChromeModa Solutions

Germany . 2,821 parts In-Stock

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$76.447

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$62.687

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$76.447

$62.687

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IDEA Electronic Components Group

UK . 2,360 parts In-Stock

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$76.447

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$72.625

1k+ parts

$68.802

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$76.447

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QUARKTWIN TECHNOLOGY LTD

USA . 11,838 parts In-Stock

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Argo Parts USA

USA . 2,497 parts In-Stock

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Continental Prestige Electronics

USA . 750 parts In-Stock

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750

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Discover the TM4C1297NCZADI3R by Texas Instruments, a high-quality microcontroller designed for various applications. With its state-of-the-art technology and advanced features, this product offers incredible value and benefits to customers. Perfect for industrial use, this microcontroller provides reliable performance even in extreme temperatures. Its extensive connectivity options, multiple peripherals, and low power mode make it versatile and efficient. Trust in Texas Instruments, a renowned manufacturer known for delivering top-notch products. Upgrade your projects with the TM4C1297NCZADI3R and experience unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and enhances the product's resistance to environmental factors, making it a reliable choice.

Surface Mount: YES

The surface mount capability simplifies the assembly process and offers increased space efficiency, making it easier to integrate into compact designs.

Maximum Supply Voltage: 1.32 V

With a higher maximum supply voltage, this microcontroller can handle a wider range of power sources, providing flexibility in various applications.

On Chip Data RAM Width: 8

The generous 8-bit width of the on-chip data RAM allows for efficient data processing and storage, enhancing the microcontroller's performance.

Address Bus Width: 28

An ample 28-bit address bus width enables the microcontroller to access and manage larger amounts of memory, increasing its overall capabilities.

Package Shape: SQUARE

The square package shape facilitates easier mounting and ensures compatibility with standard board layouts, simplifying the integration process.

Bit Size: 32

The 32-bit architecture allows for faster computations and more complex operations, making this microcontroller suitable for demanding applications.

No. of Terminals: 212

With 212 terminals, this microcontroller offers a wide range of options for connecting external devices, expanding its connectivity capabilities.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array, very thin profile, and fine pitch package style provides a compact footprint, ideal for space-constrained designs.

Minimum Supply Voltage: 1.14 V

The lower minimum supply voltage ensures compatibility with lower power sources, allowing for greater flexibility in power supply options.

Maximum Operating Temperature: 85 °C

The microcontroller's ability to operate at a maximum temperature of 85°C makes it suitable for various industrial applications.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers advanced features such as DSP extensions and floating-point processing, contributing to improved performance and versatility.

Minimum Operating Temperature: -40 °C

The microcontroller's ability to operate at temperatures as low as -40°C makes it suitable for use in extreme environments.

Terminal Finish: TIN SILVER COPPER

The use of tin silver copper as the terminal finish contributes to excellent solderability and long-lasting connections, ensuring the reliability of the microcontroller.

ADC Channels: YES

The presence of analog-to-digital converter channels allows for the direct conversion of analog signals into digital data, enabling precise measurement and control in various applications.

DMA Channels: YES

The inclusion of DMA channels enables efficient and direct data transfer between peripherals and memory, enhancing overall system performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly processes, providing ease of integration into new or existing designs.

ROM Words: 1048576

With a large capacity of 1048576 ROM words, this microcontroller can store a vast amount of program code, enabling complex functionalities in diverse applications.

Maximum Seated Height: 1 mm

The microcontroller's low seated height of 1 mm allows for easy integration in slim and compact designs, optimizing space utilization.

RAM Words: 256

The microcontroller's 256 RAM words provide sufficient memory for storing temporary data during operation, facilitating efficient data processing.

Width: 10 mm

The microcontroller's compact width of 10 mm allows for easy integration into space-limited designs, offering flexibility in various applications.

Data EEPROM Size: 6K

With 6K of data EEPROM size, this microcontroller provides non-volatile memory for storing critical data, ensuring data integrity even during power loss.

Boundary Scan: YES

The presence of boundary scan capability simplifies testing and debugging processes, enhancing product reliability and manufacturing efficiency.

External Data Bus Width: 32

The wide 32-bit external data bus width allows for high-speed data transfer between the microcontroller and external memory, improving overall system performance.

Peripherals: BOD, COMPARATOR(3), DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

The wide range of peripherals, including comparators, timers, PWM channels, and more, enhances the microcontroller's versatility for diverse applications.

Maximum Clock Frequency: 25 MHz

With a maximum clock frequency of 25 MHz, this microcontroller can execute instructions at a high speed, enabling rapid data processing and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller's ability to withstand peak reflow temperature for up to 30 seconds ensures reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The microcontroller's ability to handle peak reflow temperatures of 260°C ensures robust solder joint formation during assembly processes.

Length: 10 mm

The microcontroller's compact length of 10 mm enables easy integration into space-constrained designs while providing excellent functionality.

Temperature Grade: INDUSTRIAL

The microcontroller's industrial temperature grade ensures its reliability and performance in demanding environments with wide temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller's RISC architecture provides efficient instruction execution, contributing to high performance and power efficiency.

No. of Timers: 8

The microcontroller's 8 timers offer versatile timing capabilities for various applications, providing precise control and synchronization.

RAM Bytes: 262144

With a generous 262,144 bytes of RAM, this microcontroller facilitates efficient data storage and manipulation, enhancing overall system performance.

Technology: CMOS

The use of CMOS technology in this microcontroller ensures low power consumption, high noise immunity, and excellent reliability.

Terminal Form: BALL

The ball terminal form simplifies the microcontroller's integration onto a printed circuit board, allowing for secure and reliable solder connections.

Analog To Digital Convertors: 24-Ch 12-Bit

The presence of 24-channel 12-bit analog-to-digital converters enables accurate conversion of analog signals into digital values, ensuring precision measurement and control.

Maximum Supply Current: 64 mA

With a maximum supply current of 64 mA, this microcontroller provides sufficient power for connected peripherals and ensures stable operation.

Nominal Supply Voltage: 1.2 V

The microcontroller's nominal supply voltage of 1.2 V ensures compatibility with common power sources, offering flexibility and ease of use.

No. of DMA Channels: 32

The presence of 32 DMA channels enables efficient data transfer and reduces CPU load, improving overall system performance.

No. of Serial I/Os: 8

The microcontroller's 8 serial I/Os provide versatile communication options, facilitating connectivity with various external devices and protocols.

PWM Channels: YES

The inclusion of PWM channels allows for precise control of pulse-width modulation signals, enabling accurate motor control and other applications.

Connectivity: CAN(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

The microcontroller's connectivity options, including CAN, I2C, IRDA, SPI, UART, and USB, facilitate seamless integration into existing communication networks and protocols.

ROM Programmability: FLASH

The flash programmability of the ROM allows for flexible and convenient updating of the microcontroller's firmware, ensuring adaptability and ease of maintenance.

Terminal Pitch: 0.5 mm

The microcontroller's small terminal pitch of 0.5 mm allows for compact PCB layout and provides compatibility with industry-standard manufacturing processes.

Format: FLOATING POINT

The presence of floating-point format support enables precise and accurate mathematical calculations, making this microcontroller suitable for applications requiring high computational accuracy.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures proper handling and storage requirements, reducing the risk of damage during manufacturing and assembly processes.

Speed: 120 rpm

The microcontroller's speed of 120 rpm allows for precise motor control and synchronization, making it suitable for various motion control applications.

Low Power Mode: YES

The availability of a low-power mode allows the microcontroller to operate with reduced power consumption, enhancing energy efficiency and prolonging battery life.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM enables efficient storage and execution of program code, enhancing the microcontroller's performance.

No. of I/O Lines: 140

With 140 I/O lines, this microcontroller offers ample options for interfacing with peripheral devices and external components, providing great flexibility in system design.

Technical Specifications

Microcontrollers TM4C1297NCZADI3R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

8

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Current:

64 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C1297NCZADI3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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