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TM4C1290NCZADI3

Texas Instruments

TM4C1290NCZADI3 by Texas Instruments

TM4C1290NCZADI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 24-Ch 12-Bit ADC channels and 32 DMA channels. It features a max clock frequency of 25 MHz, suitable for industrial applications requiring low power mode and extensive connectivity options such as CAN, I2C, SPI, UART, and USB. With a package style of grid array and very thin profile, this microcontroller is ideal for applications demanding high performance in a compact form factor.

Median Price

$16.186

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,299 parts In-Stock

1+ parts

$12.923

100+ parts

$11.288

1k+ parts

$7.785

10k+ parts

-

1,299

$12.923

$11.288

$7.785

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Mouser Electronics

USA . 317 parts In-Stock

1+ parts

$19.450

100+ parts

$13.160

1k+ parts

$11.910

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-

317

$19.450

$13.160

$11.910

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 932 parts In-Stock

1+ parts

$12.277

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932

$12.277

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Nova Conductors

Japan . 550 parts In-Stock

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$13.546

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550

$13.546

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Chip Stock

USA . 4,400 parts In-Stock

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4,400

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Vyrian

USA . 4,276 parts In-Stock

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4,276

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 670 parts In-Stock

1+ parts

$10.980

100+ parts

-

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-

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670

$10.980

-

-

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Semicontronic

India . 427 parts In-Stock

1+ parts

$10.980

100+ parts

$10.706

1k+ parts

$10.651

10k+ parts

-

427

$10.980

$10.706

$10.651

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Corphita

USA . 2,472 parts In-Stock

1+ parts

$11.631

100+ parts

-

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-

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2,472

$11.631

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Continental Prestige Electronics

USA . 896 parts In-Stock

1+ parts

$13.546

100+ parts

-

1k+ parts

-

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$13.275

896

$13.546

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-

$13.275

Netroflash

USA . 50 parts In-Stock

1+ parts

$13.546

100+ parts

$13.275

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-

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50

$13.546

$13.275

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$16.301

100+ parts

$15.486

1k+ parts

$15.486

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5,000

$16.301

$15.486

$15.486

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Parana Technologies

USA . 1,433 parts In-Stock

1+ parts

$22.011

100+ parts

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$22.553

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1,433

$22.011

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$22.553

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DigiPath Technology Company

USA . 611 parts In-Stock

1+ parts

$24.236

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611

$24.236

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ChromeModa Solutions

Germany . 3,236 parts In-Stock

1+ parts

$24.731

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$20.279

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3,236

$24.731

$20.279

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IDEA Electronic Components Group

UK . 1,871 parts In-Stock

1+ parts

$24.731

100+ parts

$23.494

1k+ parts

$22.258

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1,871

$24.731

$23.494

$22.258

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Microchip USA

USA . 2,692 parts In-Stock

1+ parts

$52.860

100+ parts

$52.110

1k+ parts

$51.730

10k+ parts

$51.350

2,692

$52.860

$52.110

$51.730

$51.350

Corohmni

South Africa . 931 parts In-Stock

1+ parts

$59.482

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931

$59.482

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iodParts Technologies Inc.

India . 20,000 parts In-Stock

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Lixinc

USA . 19,667 parts In-Stock

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19,667

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 358 parts In-Stock

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358

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Overview

Experience the powerful performance and reliability of the TM4C1290NCZADI3 microcontroller from industry leader Texas Instruments. This cutting-edge device is designed for a wide range of applications, offering customers unparalleled value and benefits. With features like 24-channel ADC, 8 PWM channels, and 32 DMA channels, this microcontroller delivers top-notch performance for your projects. Trust in Texas Instruments for quality and innovation in every application. Elevate your designs with the TM4C1290NCZADI3 microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller durable and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy integration into various electronic devices.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage ensures reliable performance in different power supply setups.

On Chip Data RAM Width: 8

With an 8-bit data RAM width, this microcontroller can efficiently handle data processing tasks.

Address Bus Width: 28

The 28-bit address bus width enables this microcontroller to access a large memory space.

Package Shape: SQUARE

The square package shape provides efficient use of space on a PCB.

Bit Size: 32

The 32-bit architecture allows for fast and efficient processing of instructions and data.

No. of Terminals: 212

The high number of terminals provides ample connectivity options for peripheral devices.

Package Style: GRID ARRAY...

The grid array package style offers a compact design with a low profile, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures efficient power usage and extends battery life.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand high-temperature environments.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers high performance and energy efficiency for a wide range of applications.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40°C makes this microcontroller suitable for harsh environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance.

ADC Channels: YES

The presence of analog-to-digital converter channels allows for easy interfacing with analog sensors and signals.

DMA Channels: YES

The availability of DMA channels enhances data transfer speed and efficiency.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and routing.

ROM Words: 1048576

With a large ROM size, this microcontroller can store a significant amount of program data.

Maximum Seated Height: 1 mm

The low profile of 1mm makes this microcontroller suitable for compact device designs.

RAM Words: 256

The 256 RAM words provide sufficient memory for storing variables and intermediate data.

Width: 10 mm

The compact width of 10mm makes this microcontroller suitable for space-constrained applications.

Data EEPROM Size: 6K

The 6K data EEPROM size allows for non-volatile data storage.

Boundary Scan: YES

The presence of boundary scan capability simplifies testing and debugging during the manufacturing process.

Technical Specifications

Microcontrollers TM4C1290NCZADI3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

0

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Current:

100.1 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C1290NCZADI3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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