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TM4C123GH6ZRBT7

Texas Instruments

TM4C123GH6ZRBT7 by Texas Instruments

TM4C123GH6ZRBT7 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 24-Ch 12-Bit ADC, and 32 DMA channels. Ideal for industrial applications, it features a max clock frequency of 25 MHz, ROM size of 262144 words, and connectivity options like CAN, I2C, SPI, UART.

Median Price

-

Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 5,154 parts In-Stock

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Chip Stock

USA . 2,900 parts In-Stock

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Digiode

USA . 1,167 parts In-Stock

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Prism Electronics

USA . 2 parts In-Stock

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One Stop Electronics

USA . 1,358 parts In-Stock

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$4.000

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AZTECH Wire

Italy . 379 parts In-Stock

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$17.706

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Microchip USA

USA . 398 parts In-Stock

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$42.760

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$42.150

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$41.840

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$41.530

398

$42.760

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$41.530

Parana Technologies

USA . 554 parts In-Stock

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$61.742

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$61.742

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DigiPath Technology Company

USA . 2,122 parts In-Stock

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$67.986

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ChromeModa Solutions

Germany . 3,090 parts In-Stock

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$69.373

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$56.886

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IDEA Electronic Components Group

UK . 2,032 parts In-Stock

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$69.373

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$65.904

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$62.436

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Lixinc

USA . 3,411 parts In-Stock

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Corphita

USA . 1,613 parts In-Stock

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Overview

Unlock endless possibilities with the TM4C123GH6ZRBT7 microcontroller by Texas Instruments. This powerful device boasts top-notch quality and reliability, backed by the reputable manufacturer. Ideal for a wide range of applications, this microcontroller offers unmatched value with its integrated cache, low power mode, and versatile connectivity options. Experience seamless performance and innovation like never before with the TM4C123GH6ZRBT7 microcontroller.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Durable and lightweight material for easy handling and protection against damage.

Integrated Cache YES

Improves processing speed by storing frequently accessed data for quick retrieval.

Surface Mount YES

Enables easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage 1.32 V

Allows for efficient power consumption and compatibility with lower voltage systems.

On Chip Data RAM Width 8

Provides enough space for storing and accessing data quickly for smooth operation.

Package Shape SQUARE

Facilitates uniform and stable placement on PCBs for reliable performance.

Bit Size 32

Offers high processing capability and supports complex operations with larger data sets.

No. of Terminals 157

Provides plenty of connection options for various external components, expanding functionality.

Package Style (Meter) GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Suitable for compact designs with high density interconnections, enhancing signal integrity.

Minimum Supply Voltage 1.08 V

Allows for operation in low power scenarios while maintaining stable performance.

Maximum Operating Temperature 105 °C

Ensures reliable operation in high temperature environments for extended periods.

CPU Family CORTEX-M4F

Utilizes a powerful and efficient processor architecture for advanced computing tasks.

Minimum Operating Temperature -40 °C

Capable of functioning in extreme cold conditions without performance degradation.

Terminal Finish TIN SILVER COPPER

Enhances conductivity and reliability of connections for stable signal transmission.

ADC Channels YES

Enables analog-to-digital conversion for interfacing with sensors and other analog peripherals.

DMA Channels YES

Facilitates efficient data transfer between peripherals and memory, optimizing performance.

Terminal Position BOTTOM

Simplifies board layout and routing, making it easier to integrate into existing designs.

ROM Words 262144

Ample storage space for program instructions, ensuring versatile functionality and application support.

Maximum Seated Height 1 mm

Low profile design for compact form factor and ease of integration in space-constrained applications.

RAM Words 32

Sufficient memory for temporary data storage and efficient multitasking capabilities.

Width 9 mm

Compact size for versatile placement in a wide range of electronic systems.

Data EEPROM Size 2K

Non-volatile memory for storing critical data even when power is disconnected.

Boundary Scan YES

Facilitates system debugging and testing for improved reliability during development and production.

Peripherals BOD, COMPARATOR(3), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Wide array of onboard peripherals for versatile functionality and compatibility with various applications.

Maximum Clock Frequency 25 MHz

High clock speed for rapid data processing and efficient execution of instructions.

Maximum Time At Peak Reflow Temperature (s) 30

Allows for reliable soldering during manufacturing processes without damage to the component.

Peak Reflow Temperature °C 260

Meets industry standards for soldering processes to ensure proper component mounting.

Length 9 mm

Compact dimensions for flexible placement in various electronic devices.

Temperature Grade INDUSTRIAL

Designed to withstand harsh industrial environments with consistent performance and durability.

Peripheral IC Type MICROCONTROLLER, RISC

Uses an efficient RISC architecture for streamlined execution of instructions and improved performance.

No. of Timers 12

Provides multiple timing functions for scheduling tasks and event management in complex applications.

RAM Bytes 32768

Generous memory capacity for data storage and efficient multitasking capabilities.

Technology CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Terminal Form BALL

Enhances connectivity and soldering reliability for secure component mounting.

Analog To Digital Convertors 24-Ch 12-Bit

Supports a wide range of analog sensors and inputs for versatile data acquisition capabilities.

Maximum Supply Current 58.7 mA

Efficient power consumption for extended battery life and reduced operating costs.

Nominal Supply Voltage 1.2 V

Standard voltage level for compatibility with a wide range of electronic systems.

No. of DMA Channels 32

Multiple DMA channels for efficient data transfer and communication between peripherals.

No. of Serial I/Os 21

Provides a versatile interface for serial communication with external devices and peripherals.

PWM Channels YES

Supports pulse width modulation for precise control of motor speed and other applications.

Connectivity CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Versatile connectivity options for interfacing with a wide range of external devices and networks.

ROM Programmability FLASH

Utilizes flash memory for flexible program storage and easy firmware updates.

Terminal Pitch 0.65 mm

Fine pitch for high-density interconnections with precise component placement on PCBs.

Format FLOATING POINT

Supports floating-point arithmetic for accurate mathematical calculations in diverse applications.

Moisture Sensitivity Level (MSL) 3

Designed for reliable operation in moderate humidity environments to prevent damage.

Speed 80 rpm

Suitable for controlling motor speed and other timing applications with precision.

Low Power Mode YES

Enables power-saving features for extended battery life and energy-efficient operation.

On Chip Program ROM Width 8

Sufficient space for storing program instructions for efficient execution and operation.

No. of I/O Lines 120

Generous number of input/output lines for versatile connectivity and expansion options.

Technical Specifications

Microcontrollers TM4C123GH6ZRBT7 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B157

JESD-609 Code:

e1

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

120

No. of Serial I/Os:

21

No. of Terminals:

157

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

80 rpm

Maximum Supply Current:

58.7 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C123GH6ZRBT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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