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TM4C123GE6PZTR

Texas Instruments

TM4C123GE6PZTR by Texas Instruments

TM4C123GE6PZTR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 22-Ch 12-Bit ADC, 2K Data EEPROM, and 32768 Bytes RAM. Ideal for industrial applications requiring CAN, I2C, SPI connectivity and up to 25 MHz clock frequency.

Median Price

$9.690

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 950 parts In-Stock

1+ parts

$9.690

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950

$9.690

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,495 parts In-Stock

1+ parts

$9.206

100+ parts

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3,495

$9.206

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Vyrian

USA . 4,074 parts In-Stock

1+ parts

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4,074

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 623 parts In-Stock

1+ parts

$8.721

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623

$8.721

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AZTECH Wire

Italy . 919 parts In-Stock

1+ parts

$16.050

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919

$16.050

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Microchip USA

USA . 2,437 parts In-Stock

1+ parts

$20.640

100+ parts

$20.340

1k+ parts

$20.200

10k+ parts

$20.050

2,437

$20.640

$20.340

$20.200

$20.050

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$34.664

100+ parts

$34.317

1k+ parts

$32.931

10k+ parts

-

50

$34.664

$34.317

$32.931

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Parana Technologies

USA . 413 parts In-Stock

1+ parts

$39.302

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413

$39.302

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DigiPath Technology Company

USA . 2,315 parts In-Stock

1+ parts

$43.277

100+ parts

$39.815

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2,315

$43.277

$39.815

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ChromeModa Solutions

Germany . 4,472 parts In-Stock

1+ parts

$44.160

100+ parts

$36.211

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4,472

$44.160

$36.211

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IDEA Electronic Components Group

UK . 684 parts In-Stock

1+ parts

$44.160

100+ parts

$41.952

1k+ parts

$39.744

10k+ parts

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684

$44.160

$41.952

$39.744

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Overview

Unlock the endless possibilities of innovation with the TM4C123GE6PZTR microcontroller by Texas Instruments. Crafted with precision and expertise, this powerful device offers a seamless blend of performance and reliability. Ideal for a wide range of applications, this microcontroller boasts an array of features that cater to your specific needs. From its robust build to its cutting-edge technology, this product is designed to deliver value and efficiency. Join the league of visionaries and elevate your projects with the TM4C123GE6PZTR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for a wide range of applications.

Maximum Supply Voltage: 1.32 V

Allows for efficient power usage and protection against overvoltage.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and low power consumption, ideal for embedded systems.

PWM Channels: YES

Ability to generate Pulse Width Modulation signals for precise control and communication.

Connectivity: CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Support for multiple communication interfaces for versatile connectivity options.

Technical Specifications

Microcontrollers TM4C123GE6PZTR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

69

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Trade Compliance

TM4C123GE6PZTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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