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TM4C123GE6PZI7

Texas Instruments

TM4C123GE6PZI7 by Texas Instruments

TM4C123GE6PZI7 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 131072 ROM words, and 32768 RAM bytes. It features 22-Ch 12-Bit ADCs, 32 DMA channels, and connectivity options like CAN, I2C, SPI. Ideal for industrial applications requiring low power mode and high-speed processing up to 25 MHz.

Median Price

$10.764

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,320 parts In-Stock

1+ parts

$10.764

100+ parts

$8.775

1k+ parts

$5.850

10k+ parts

-

5,320

$10.764

$8.775

$5.850

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$7.931

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$7.931

-

-

-

Digiode

USA . 2,674 parts In-Stock

1+ parts

$10.226

100+ parts

-

1k+ parts

-

10k+ parts

-

2,674

$10.226

-

-

-

Vyrian

USA . 5,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,518

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$7.772

100+ parts

-

1k+ parts

$7.462

10k+ parts

-

100

$7.772

-

$7.462

-

Ampacity Inc.

Singapore . 5,123 parts In-Stock

1+ parts

$9.150

100+ parts

-

1k+ parts

-

10k+ parts

-

5,123

$9.150

-

-

-

Corphita

USA . 1,002 parts In-Stock

1+ parts

$9.688

100+ parts

-

1k+ parts

-

10k+ parts

-

1,002

$9.688

-

-

-

AZTECH Wire

Italy . 943 parts In-Stock

1+ parts

$15.260

100+ parts

-

1k+ parts

-

10k+ parts

-

943

$15.260

-

-

-

Microchip USA

USA . 1,799 parts In-Stock

1+ parts

$26.970

100+ parts

$26.580

1k+ parts

$26.390

10k+ parts

$26.200

1,799

$26.970

$26.580

$26.390

$26.200

Parana Technologies

USA . 859 parts In-Stock

1+ parts

$45.652

100+ parts

-

1k+ parts

-

10k+ parts

-

859

$45.652

-

-

-

DigiPath Technology Company

USA . 1,773 parts In-Stock

1+ parts

$50.268

100+ parts

$46.247

1k+ parts

-

10k+ parts

-

1,773

$50.268

$46.247

-

-

ChromeModa Solutions

Germany . 5,362 parts In-Stock

1+ parts

$51.294

100+ parts

$42.061

1k+ parts

-

10k+ parts

-

5,362

$51.294

$42.061

-

-

IDEA Electronic Components Group

UK . 1,027 parts In-Stock

1+ parts

$51.294

100+ parts

$48.729

1k+ parts

$46.165

10k+ parts

-

1,027

$51.294

$48.729

$46.165

-

Overview

Experience the power of innovation with the TM4C123GE6PZI7 microcontroller by Texas Instruments. Built with cutting-edge technology and a commitment to quality, this device offers seamless performance across a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers unparalleled value, efficiency, and reliability. Trust in Texas Instruments to elevate your projects to new heights with the TM4C123GE6PZI7.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good thermal and electrical insulation, making the product more durable and reliable.

Integrated Cache: YES

Integrated cache helps in improving the overall performance of the microcontroller by reducing memory access time.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for flexibility in power supply design and compatibility with a variety of systems.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers high-performance processing capabilities, making the microcontroller suitable for a wide range of applications.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and input devices, expanding its versatility.

Maximum Clock Frequency: 25 MHz

High clock frequency enables fast data processing and quick response times, making the microcontroller suitable for demanding applications.

Connectivity: CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Multiple connectivity options provide flexibility in communication protocols, allowing the microcontroller to interface with a variety of devices and systems.

Technical Specifications

Microcontrollers TM4C123GE6PZI7 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

69

No. of Serial I/Os:

21

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

54.9 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Trade Compliance

TM4C123GE6PZI7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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