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TM4C123GE6PMI

Texas Instruments

TM4C123GE6PMI by Texas Instruments

TM4C123GE6PMI by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 131072 ROM words and 32768 RAM bytes. It features 12-Ch 12-Bit ADC channels, 16 PWM channels, and connectivity options like CAN, I2C, SPI, UART. Ideal for industrial applications requiring high-speed processing up to 25 MHz in temperatures ranging from -40°C to 85°C.

Median Price

$13.475

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,768 parts In-Stock

1+ parts

$10.350

100+ parts

$8.438

1k+ parts

$5.625

10k+ parts

-

10,768

$10.350

$8.438

$5.625

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Mouser Electronics

USA . 435 parts In-Stock

1+ parts

$16.600

100+ parts

$10.650

1k+ parts

-

10k+ parts

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435

$16.600

$10.650

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 266 parts In-Stock

1+ parts

$9.225

100+ parts

-

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266

$9.225

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$9.780

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650

$9.780

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Digiode

USA . 4,110 parts In-Stock

1+ parts

$9.832

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4,110

$9.832

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Chip Stock

USA . 21,357 parts In-Stock

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21,357

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Vyrian

USA . 6,777 parts In-Stock

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6,777

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NAC Semi

USA . 266 parts In-Stock

1+ parts

-

100+ parts

$22.910

1k+ parts

$21.150

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266

-

$22.910

$21.150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 671 parts In-Stock

1+ parts

$9.315

100+ parts

-

1k+ parts

-

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671

$9.315

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$9.584

100+ parts

-

1k+ parts

$9.201

10k+ parts

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1,000

$9.584

-

$9.201

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Continental Prestige Electronics

USA . 3,605 parts In-Stock

1+ parts

$9.780

100+ parts

-

1k+ parts

-

10k+ parts

$9.584

3,605

$9.780

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-

$9.584

Ampacity Inc.

Singapore . 5,822 parts In-Stock

1+ parts

$19.150

100+ parts

-

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-

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5,822

$19.150

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Microchip USA

USA . 2,189 parts In-Stock

1+ parts

$25.930

100+ parts

$25.560

1k+ parts

$25.370

10k+ parts

$25.190

2,189

$25.930

$25.560

$25.370

$25.190

Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

$41.275

100+ parts

-

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1,380

$41.275

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DigiPath Technology Company

USA . 726 parts In-Stock

1+ parts

$45.448

100+ parts

$41.813

1k+ parts

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726

$45.448

$41.813

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ChromeModa Solutions

Germany . 3,728 parts In-Stock

1+ parts

$46.376

100+ parts

$38.028

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-

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3,728

$46.376

$38.028

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IDEA Electronic Components Group

UK . 5 parts In-Stock

1+ parts

$46.376

100+ parts

$44.057

1k+ parts

$41.738

10k+ parts

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5

$46.376

$44.057

$41.738

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Corohmni

South Africa . 80 parts In-Stock

1+ parts

$48.180

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80

$48.180

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Argo Parts USA

USA . 4,506 parts In-Stock

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4,506

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Authorized Procurement Solutions

USA . 275 parts In-Stock

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275

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GreenTree Electronics

Israel . 266 parts In-Stock

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266

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Overview

Unleash the power of innovation with the TM4C123GE6PMI microcontroller by Texas Instruments. Designed with precision and quality in mind, this cutting-edge device offers unparalleled performance for a wide range of applications. With advanced features like high-speed connectivity options, versatile peripherals, and extensive ROM programmability, this microcontroller is the perfect solution for your next project. Trust in Texas Instruments to deliver top-notch technology that will take your creations to the next level. Experience the difference with the TM4C123GE6PMI microcontroller - where quality meets innovation.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the microcontroller, making it a reliable choice.

Surface Mount

YES - Allows for easy installation and integration into circuit boards, simplifying the production process.

Maximum Supply Voltage

1.32 V - Provides a safe operating range for the microcontroller, ensuring stable performance.

Package Shape

SQUARE - Compact design saves space and allows for efficient placement on PCBs.

Bit Size

32 - Offers high processing power and capability for handling complex tasks.

Power Supplies (V)

1.2,3.3 - Compatible with common voltage standards, making it versatile for various applications.

No. of Terminals

64 - Provides ample connectivity options for interfacing with other components.

Package Style (Meter)

FLATPACK, LOW PROFILE, FINE PITCH - Enhances thermal dissipation and allows for close component placement, optimizing PCB layout.

Minimum Supply Voltage

1.08 V - Capable of operating at low voltages, allowing for energy-efficient performance.

Maximum Operating Temperature

85 °C - Can withstand high temperatures, suitable for industrial applications.

CPU Family

CORTEX-M4F - High-performance processor architecture for swift and efficient data processing.

Minimum Operating Temperature

40 °C - Operates reliably in cold environments, ensuring functionality in various conditions.

Terminal Finish

NICKEL PALLADIUM GOLD - Provides corrosion resistance and improves signal conductivity for reliable connections.

ADC Channels

YES - Integrated analog-to-digital converters enable precise measurement and control capabilities.

DMA Channels

YES - Supports efficient data transfer between peripherals, enhancing overall system performance.

Terminal Position

QUAD - Facilitates easy PCB mounting and soldering, streamlining assembly processes.

ROM Words

131072 - Offers ample memory storage for program code and data, accommodating complex algorithms.

Maximum Seated Height

1.6 mm - Low profile design saves space and allows for compact device designs.

Width

10 mm - Compact form factor enables versatile placement in constrained spaces.

Data EEPROM Size

2K - Provides non-volatile memory for storing critical system information, ensuring data integrity.

Peripherals

BOD, COMPARATOR(2), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2) - Versatile peripheral options for diverse functionality and system integration.

Maximum Clock Frequency

25 MHz - High clock speed enables fast data processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s)

30 - Ensures proper solder reflow during manufacturing, preventing component damage.

Peak Reflow Temperature °C

260 - Compatible with standard reflow processes, ensuring reliable solder joints.

Length

10 mm - Compact size enables flexible PCB layout and space-saving designs.

Temperature Grade

INDUSTRIAL - Built to withstand harsh industrial environments, ensuring reliability and longevity.

Peripheral IC Type

MICROCONTROLLER, RISC - RISC architecture for efficient data processing and reduced power consumption.

RAM Bytes

32768 - Ample RAM capacity for data storage and manipulation, supporting multitasking applications.

Technology

CMOS - Low power consumption and high noise immunity for reliable operation.

Terminal Form

GULL WING - Facilitates easy soldering and robust mechanical connections for stable performance.

Analog To Digital Convertors

12-Ch 12-Bit - Provides multiple ADC channels with high resolution for accurate analog signal conversion.

Nominal Supply Voltage

1.2 V - Standard voltage level for consistent operation and compatibility with common power sources.

PWM Channels

YES - Integrated pulse-width modulation channels for precise control of analog signals.

Connectivity

CAN(2), I2C(4), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB - Diverse communication interfaces for seamless connectivity with external devices.

ROM Programmability

FLASH - Flash memory technology enables fast and reliable program storage and execution.

Terminal Pitch

0.5 mm - Fine pitch spacing allows for high-density board integration and miniaturization.

Moisture Sensitivity Level (MSL)

3 - Designed to withstand exposure to moderate moisture levels, ensuring reliability in various environments.

Speed

80 rpm - Capable of handling high-speed data processing and control tasks with efficiency.

On Chip Program ROM Width

8 - Wide ROM data bus for fast program execution and data transfer.

No. of I/O Lines

43 - Sufficient input/output options for versatile connectivity and interfacing with external components.

Technical Specifications

Microcontrollers TM4C123GE6PMI attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(4), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TM4C123GE6PMI Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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