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TM4C123FH6PMTR

Texas Instruments

TM4C123FH6PMTR by Texas Instruments

TM4C123FH6PMTR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 262144 ROM words, 32768 RAM bytes, and 12-Ch 12-Bit ADC channels. Ideal for industrial applications requiring CAN, I2C, SPI connectivity and up to 25 MHz clock frequency.

Median Price

$8.362

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,525 parts In-Stock

1+ parts

$9.745

100+ parts

$7.944

1k+ parts

$5.296

10k+ parts

-

4,525

$9.745

$7.944

$5.296

-

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.979

10k+ parts

-

2,000

-

-

$6.979

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$8.452

100+ parts

-

1k+ parts

-

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10

$8.452

-

-

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Digiode

USA . 1,650 parts In-Stock

1+ parts

$9.258

100+ parts

-

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1,650

$9.258

-

-

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Vyrian

USA . 8,015 parts In-Stock

1+ parts

-

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-

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8,015

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,161 parts In-Stock

1+ parts

$5.930

100+ parts

-

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-

10k+ parts

-

3,161

$5.930

-

-

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Semicontronic

India . 3,117 parts In-Stock

1+ parts

$5.930

100+ parts

$5.782

1k+ parts

$5.752

10k+ parts

-

3,117

$5.930

$5.782

$5.752

-

Continental Prestige Electronics

USA . 4,789 parts In-Stock

1+ parts

$8.452

100+ parts

-

1k+ parts

-

10k+ parts

$8.283

4,789

$8.452

-

-

$8.283

Netroflash

USA . 50 parts In-Stock

1+ parts

$8.452

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$8.452

-

-

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Corphita

USA . 3,942 parts In-Stock

1+ parts

$8.770

100+ parts

-

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-

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3,942

$8.770

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-

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AZTECH Wire

Italy . 1,092 parts In-Stock

1+ parts

$9.130

100+ parts

-

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1,092

$9.130

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Microchip USA

USA . 1,945 parts In-Stock

1+ parts

$20.760

100+ parts

$20.460

1k+ parts

$20.320

10k+ parts

$20.170

1,945

$20.760

$20.460

$20.320

$20.170

Advanced Electronics

New Zealand . 90 parts In-Stock

1+ parts

$25.584

100+ parts

$24.305

1k+ parts

$24.305

10k+ parts

-

90

$25.584

$24.305

$24.305

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Parana Technologies

USA . 1,423 parts In-Stock

1+ parts

$62.953

100+ parts

-

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1,423

$62.953

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DigiPath Technology Company

USA . 1,453 parts In-Stock

1+ parts

$69.319

100+ parts

$63.774

1k+ parts

-

10k+ parts

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1,453

$69.319

$63.774

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IDEA Electronic Components Group

UK . 1,372 parts In-Stock

1+ parts

$70.734

100+ parts

$67.197

1k+ parts

$63.661

10k+ parts

-

1,372

$70.734

$67.197

$63.661

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ChromeModa Solutions

Germany . 366 parts In-Stock

1+ parts

$70.734

100+ parts

$58.002

1k+ parts

-

10k+ parts

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366

$70.734

$58.002

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Corohmni

South Africa . 39 parts In-Stock

1+ parts

$82.167

100+ parts

-

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-

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39

$82.167

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Argo Parts USA

USA . 4,505 parts In-Stock

1+ parts

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4,505

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Robosynatics

Brazil . 350 parts In-Stock

1+ parts

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350

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Lucentia Tech

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$2.166

1k+ parts

$2.166

10k+ parts

$2.166

350

-

$2.166

$2.166

$2.166

Overview

Unlock endless possibilities with the TM4C123FH6PMTR microcontroller by Texas Instruments. Manufactured with unwavering quality and precision, this device offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers reliability and efficiency like no other. Experience the value of seamless connectivity, advanced peripherals, and cutting-edge technology all in one compact package. Trust in Texas Instruments to take your projects to the next level with the TM4C123FH6PMTR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the product.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards.

Maximum Supply Voltage: 1.32 V

Provides a safe operating range for the microcontroller.

Package Shape: SQUARE

Compact shape enables space-efficient design.

Bit Size: 32

Offers high computational capabilities for complex tasks.

Power Supplies (V): 1.2,3.3

Supports different voltage requirements for flexibility in design.

No. of Terminals: 64

Provides ample connectivity options for various external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables versatility in mounting options for different applications.

Minimum Supply Voltage: 1.08 V

Ensures stable operation even at lower voltages.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with higher operating temperatures.

CPU Family: CORTEX-M4F

Features a powerful processor for efficient performance.

Minimum Operating Temperature: -40 °C

Allows operation in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides corrosion resistance for long-term reliability.

ADC Channels: YES

Enables analog to digital conversion for sensor interfacing.

DMA Channels: YES

Facilitates efficient data transfer without CPU intervention.

Terminal Position: QUAD

Easy for soldering and connection in a compact layout.

ROM Words: 262144

Ample memory for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 10 mm

Compact form factor for integration in small devices.

Data EEPROM Size: 2K

Additional non-volatile memory for data storage.

Peripherals: BOD, COMPARATOR(2), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Offers a wide range of peripherals for versatile functionality.

Maximum Clock Frequency: 25 MHz

Provides high-speed processing capability.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes.

Length: 10 mm

Compact size for space-saving designs.

Temperature Grade: INDUSTRIAL

Suitable for harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Designed for embedded control applications.

RAM Bytes: 32768

Sufficient random access memory for data storage and operations.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: GULL WING

Ensures reliable solder joints for stable connections.

Analog To Digital Convertors: 12-Ch 12-Bit

Provides multiple ADC channels for analog signal processing.

Nominal Supply Voltage: 1.2 V

Standard voltage level for stable operation.

PWM Channels: YES

Supports pulse-width modulation for exact control of outputs.

Connectivity: CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Offers various communication interfaces for connectivity with external devices.

ROM Programmability: FLASH

Allows for easy reprogramming of the memory.

Terminal Pitch: 0.5 mm

Fine pitch for dense PCB layouts and easy routing.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with moderate moisture sensitivity.

Speed: 80 rpm

Processing speed suitable for real-time applications.

On Chip Program ROM Width: 8

Efficient use of memory for program storage.

No. of I/O Lines: 49

Sufficient input/output lines for interfacing with external components.

Technical Specifications

Microcontrollers TM4C123FH6PMTR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TM4C123FH6PMTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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