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TM4C123FH6PMI7

Texas Instruments

TM4C123FH6PMI7 by Texas Instruments

TM4C123FH6PMI7 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 12 ADC channels, 32 DMA channels, and 16 PWM channels. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$13.970

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,426 parts In-Stock

1+ parts

$9.759

100+ parts

$8.525

1k+ parts

$5.879

10k+ parts

-

2,426

$9.759

$8.525

$5.879

-

Mouser Electronics

USA . 103 parts In-Stock

1+ parts

$18.180

100+ parts

$11.010

1k+ parts

$10.720

10k+ parts

-

103

$18.180

$11.010

$10.720

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,427 parts In-Stock

1+ parts

$9.271

100+ parts

-

1k+ parts

-

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-

2,427

$9.271

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$10.930

100+ parts

-

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-

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10

$10.930

-

-

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Vyrian

USA . 4,082 parts In-Stock

1+ parts

-

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-

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4,082

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Chip Stock

USA . 2,650 parts In-Stock

1+ parts

-

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2,650

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,171 parts In-Stock

1+ parts

$8.300

100+ parts

$8.092

1k+ parts

$8.051

10k+ parts

-

1,171

$8.300

$8.092

$8.051

-

Ampacity Inc.

Singapore . 881 parts In-Stock

1+ parts

$8.300

100+ parts

-

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-

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881

$8.300

-

-

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Corphita

USA . 946 parts In-Stock

1+ parts

$8.783

100+ parts

-

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-

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946

$8.783

-

-

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Continental Prestige Electronics

USA . 6,753 parts In-Stock

1+ parts

$10.930

100+ parts

-

1k+ parts

-

10k+ parts

$10.711

6,753

$10.930

-

-

$10.711

Microchip USA

USA . 1,261 parts In-Stock

1+ parts

$27.100

100+ parts

$26.710

1k+ parts

$26.520

10k+ parts

$26.330

1,261

$27.100

$26.710

$26.520

$26.330

Parana Technologies

USA . 1,865 parts In-Stock

1+ parts

$52.299

100+ parts

-

1k+ parts

-

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1,865

$52.299

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ChromeModa Solutions

Germany . 5,801 parts In-Stock

1+ parts

$58.763

100+ parts

$48.186

1k+ parts

-

10k+ parts

-

5,801

$58.763

$48.186

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-

IDEA Electronic Components Group

UK . 340 parts In-Stock

1+ parts

$58.763

100+ parts

$55.825

1k+ parts

$52.887

10k+ parts

-

340

$58.763

$55.825

$52.887

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Corohmni

South Africa . 108 parts In-Stock

1+ parts

$78.719

100+ parts

-

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-

10k+ parts

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108

$78.719

-

-

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$88.668

100+ parts

$84.234

1k+ parts

$84.234

10k+ parts

-

1,000

$88.668

$84.234

$84.234

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

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3,000

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DigiPath Technology Company

USA . 2,096 parts In-Stock

1+ parts

-

100+ parts

$52.981

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-

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2,096

-

$52.981

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$10.711

1k+ parts

$10.384

10k+ parts

$10.165

2,000

-

$10.711

$10.384

$10.165

Argo Parts USA

USA . 1,073 parts In-Stock

1+ parts

-

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1,073

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Robosynatics

Brazil . 500 parts In-Stock

1+ parts

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500

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Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$7.957

1k+ parts

$7.957

10k+ parts

$7.957

500

-

$7.957

$7.957

$7.957

Overview

Unlock endless possibilities with the TM4C123FH6PMI7 by Texas Instruments. This high-quality microcontroller offers cutting-edge technology and a wide range of applications, from industrial automation to consumer electronics. With its superior performance and versatile features, this product provides value, efficiency, and reliability to customers looking to innovate and succeed in today's competitive market. Experience the advantages of Texas Instrument's expertise and invest in a product that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Easy to mount on PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 3.63 V

Supports a wide range of voltage inputs, increasing flexibility in design.

On Chip Data RAM Width: 8

Efficient data processing capabilities, enhancing overall performance.

Package Shape: SQUARE

Compact shape, ideal for space-constrained designs.

Bit Size: 32

High processing power, suitable for complex algorithms and tasks.

No. of Terminals: 64

Sufficient terminals for connectivity options, allowing for versatile integration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Sleek and modern design, suitable for advanced electronics.

Minimum Supply Voltage: 3.15 V

Ensures stable operation even at low voltage levels, improving reliability.

Maximum Operating Temperature: 85 °C

Suitable for harsh environments with high temperature variations.

CPU Family: CORTEX-M4F

High-performance CPU architecture, enabling fast and efficient computations.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making it versatile.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Corrosion-resistant finish for long-term reliability.

ADC Channels: YES

Integrated ADC for analog input processing, expanding functionality.

DMA Channels: YES

DMA support for efficient data transfer, improving overall system performance.

Terminal Position: QUAD

Organized terminal layout for easy PCB connectivity.

ROM Words: 262144

Large ROM capacity for storing program code and data.

Maximum Seated Height: 1.6 mm

Low profile design, suitable for compact electronic devices.

RAM Words: 32

Sufficient RAM capacity for temporary data storage, aiding in multitasking.

Width: 10 mm

Compact width, suitable for small form factor applications.

Data EEPROM Size: 2048

EEPROM for non-volatile data storage, preserving information even when power is off.

Boundary Scan: YES

Boundary scan capability for debugging and testing during production.

Peripherals: BOD, COMPARATOR(2), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Versatile set of peripherals for various control and monitoring tasks.

Maximum Clock Frequency: 25 MHz

High clock frequency for fast data processing and response times.

Peak Reflow Temperature °C: 260

Can withstand high temperature reflow soldering process.

Length: 10 mm

Compact length, suitable for small and portable devices.

Temperature Grade: INDUSTRIAL

Industrial temperature range for robust operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Advanced microcontroller architecture for efficient processing.

No. of Timers: 12

Multiple timers for precise timekeeping and scheduling.

RAM Bytes: 32768

Large RAM capacity for storing data during operation.

Technology: CMOS

CMOS technology for low power consumption and high speed operation.

Terminal Form: GULL WING

Gull wing terminals for secure and reliable PCB mounting.

Analog To Digital Convertors: 12-Ch 12-Bit

Multiple ADC channels with high resolution for accurate analog-to-digital conversion.

Maximum Supply Current: 54.9 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with common power sources.

No. of Serial I/Os: 5

Serial I/O ports for communication with external devices.

PWM Channels: YES

Integrated PWM channels for precise control of analog signals.

Connectivity: CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Multiple connectivity options for versatile communication.

ROM Programmability: FLASH

Flash ROM for fast and easy program updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB designs.

Format: FLOATING POINT

Floating-point format for accurate mathematical computations.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering process with moderate moisture sensitivity.

Speed: 80 rpm

High speed capabilities for quick data processing and response.

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life.

On Chip Program ROM Width: 8

Wide ROM width for storing program instructions.

No. of I/O Lines: 49

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers TM4C123FH6PMI7 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

49

No. of Serial I/Os:

5

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

54.9 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TM4C123FH6PMI7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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