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TM4C123BH6ZRBI7

Texas Instruments

TM4C123BH6ZRBI7 by Texas Instruments

TM4C123BH6ZRBI7 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, 32768 bytes of RAM, and 24-Ch 12-Bit ADC channels. It features 32 DMA channels, 16 PWM peripherals, and connectivity options like CAN, I2C, SPI. Ideal for industrial applications requiring low power mode and high-speed processing up to 25 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,306 parts In-Stock

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9,306

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Digiode

USA . 4,851 parts In-Stock

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4,851

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Chip Stock

USA . 940 parts In-Stock

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940

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Distributors (Availability)

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One Stop Electronics

USA . 466 parts In-Stock

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$12.000

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466

$12.000

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AZTECH Wire

Italy . 643 parts In-Stock

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$18.726

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643

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Parana Technologies

USA . 2,359 parts In-Stock

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$44.008

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2,359

$44.008

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DigiPath Technology Company

USA . 183 parts In-Stock

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$48.458

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$44.581

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183

$48.458

$44.581

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ChromeModa Solutions

Germany . 6,469 parts In-Stock

1+ parts

$49.447

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$40.547

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6,469

$49.447

$40.547

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IDEA Electronic Components Group

UK . 1,201 parts In-Stock

1+ parts

$49.447

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$46.975

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$44.502

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1,201

$49.447

$46.975

$44.502

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Component Stockers USA

USA . 424 parts In-Stock

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$99.990

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424

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Corphita

USA . 4,875 parts In-Stock

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4,875

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Overview

Unlock limitless possibilities with the TM4C123BH6ZRBI7 microcontroller by Texas Instruments. Crafted with precision and reliability, this innovative device boasts advanced features and a wide range of applications in various industries. From enhanced performance to seamless connectivity, this microcontroller offers unparalleled value and benefits to customers looking for cutting-edge technology. Elevate your projects to new heights with the TM4C123BH6ZRBI7 and experience the power of Texas Instruments quality at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the microcontroller, making it suitable for a variety of environments.

Integrated Cache: YES

The integrated cache helps improve processing speed and efficiency by storing frequently accessed data, resulting in faster operations.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage allows for flexibility in power supply options, ensuring compatibility with different systems.

On Chip Data RAM Width: 8

The wide data RAM width allows for efficient data processing and storage, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

The square package shape makes it easier to handle and mount the microcontroller onto circuit boards, simplifying the assembly process.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle larger data sets and perform more complex calculations, making it suitable for advanced applications.

No. of Terminals: 157

The high number of terminals allows for versatile connectivity options, enabling the microcontroller to interface with a wide range of external devices and peripherals.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making this microcontroller suitable for industrial and automotive applications.

Analog To Digital Convertors: 24-Ch 12-Bit

The multiple analog to digital converters with 12-bit resolution provide accurate and precise conversion of analog signals, making this microcontroller ideal for sensor interfacing.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient instruction execution and lower power consumption, making it a suitable choice for battery-powered devices.

Technical Specifications

Microcontrollers TM4C123BH6ZRBI7 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B157

JESD-609 Code:

e1

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

120

No. of Serial I/Os:

20

No. of Terminals:

157

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

80 rpm

Maximum Supply Current:

54.9 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8)

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C123BH6ZRBI7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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