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TM4C123BH6PZI

Texas Instruments

TM4C123BH6PZI by Texas Instruments

TM4C123BH6PZI by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 32768 bytes of RAM, and 65536 ROM words. It operates at up to 25 MHz clock frequency and has 69 I/O lines for industrial applications requiring high-speed processing and efficient memory usage.

Median Price

$11.032

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 42,662 parts In-Stock

1+ parts

$9.263

100+ parts

$7.551

1k+ parts

$5.034

10k+ parts

-

42,662

$9.263

$7.551

$5.034

-

Mouser Electronics

USA . 233 parts In-Stock

1+ parts

$12.800

100+ parts

$8.680

1k+ parts

$7.880

10k+ parts

-

233

$12.800

$8.680

$7.880

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DigiKey

USA . 157 parts In-Stock

1+ parts

$12.800

100+ parts

$8.685

1k+ parts

$7.889

10k+ parts

-

157

$12.800

$8.685

$7.889

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Rochester

USA . 9 parts In-Stock

1+ parts

-

100+ parts

$7.230

1k+ parts

$6.470

10k+ parts

$6.090

9

-

$7.230

$6.470

$6.090

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,497 parts In-Stock

1+ parts

$6.640

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-

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2,497

$6.640

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Nova Conductors

Japan . 96 parts In-Stock

1+ parts

$8.034

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-

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96

$8.034

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Vyrian

USA . 4,705 parts In-Stock

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-

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4,705

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Chip Stock

USA . 4,300 parts In-Stock

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4,300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,735 parts In-Stock

1+ parts

$5.940

100+ parts

-

1k+ parts

-

10k+ parts

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10,735

$5.940

-

-

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Semicontronic

India . 10,546 parts In-Stock

1+ parts

$5.940

100+ parts

$5.792

1k+ parts

$5.762

10k+ parts

-

10,546

$5.940

$5.792

$5.762

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Corphita

USA . 2,407 parts In-Stock

1+ parts

$6.291

100+ parts

-

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2,407

$6.291

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-

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$7.874

100+ parts

-

1k+ parts

$7.559

10k+ parts

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100

$7.874

-

$7.559

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Continental Prestige Electronics

USA . 431 parts In-Stock

1+ parts

$8.034

100+ parts

-

1k+ parts

-

10k+ parts

$7.874

431

$8.034

-

-

$7.874

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$18.370

100+ parts

$17.452

1k+ parts

$17.452

10k+ parts

-

100

$18.370

$17.452

$17.452

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Microchip USA

USA . 2,201 parts In-Stock

1+ parts

$29.900

100+ parts

$29.480

1k+ parts

$29.260

10k+ parts

$29.050

2,201

$29.900

$29.480

$29.260

$29.050

Corohmni

South Africa . 17 parts In-Stock

1+ parts

$41.557

100+ parts

-

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17

$41.557

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Parana Technologies

USA . 2,111 parts In-Stock

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$47.101

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2,111

$47.101

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DigiPath Technology Company

USA . 2,071 parts In-Stock

1+ parts

$51.864

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2,071

$51.864

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ChromeModa Solutions

Germany . 5,651 parts In-Stock

1+ parts

$52.922

100+ parts

$43.396

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-

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5,651

$52.922

$43.396

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IDEA Electronic Components Group

UK . 1,954 parts In-Stock

1+ parts

$52.922

100+ parts

$50.276

1k+ parts

$47.630

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1,954

$52.922

$50.276

$47.630

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Lixinc

USA . 13,382 parts In-Stock

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13,382

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Argo Parts USA

USA . 1,602 parts In-Stock

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Perfect Parts

USA . 1,191 parts In-Stock

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1,191

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Overview

Elevate your projects with the TM4C123BH6PZI by Texas Instruments, a top-tier microcontroller that embodies quality and innovation. Crafted by industry leader Texas Instruments, this microcontroller boasts unmatched reliability and performance in various applications. With cutting-edge technology and a multitude of features like ADC channels and DMA channels, this microcontroller offers unparalleled value to customers seeking efficiency and precision. Experience seamless integration and exceptional results with the TM4C123BH6PZI, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage allows for versatile power options and compatibility with different systems.

Bit Size: 32

A 32-bit processor provides fast performance and efficient processing capabilities for complex tasks.

Power Supplies (V): 1.2,3.3

Multiple power supply options allow for flexibility in design and compatibility with various voltage requirements.

No. of Terminals: 100

A high number of terminals enable connection to multiple external devices and peripherals for enhanced functionality.

Minimum Supply Voltage: 3.15 V

The low minimum supply voltage ensures reliable operation even under low power conditions.

CPU Family: CORTEX-M4F

The Cortex-M4F architecture offers high performance and energy efficiency, making it a suitable choice for a wide range of applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures operation in extreme cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides corrosion resistance and reliable electrical connections for long-lasting performance.

ADC Channels: YES

Analog-to-digital converter channels enable accurate and efficient analog signal processing.

DMA Channels: YES

Direct memory access channels improve data transfer speeds and reduce CPU load, enhancing overall system performance.

ROM Words: 65536

The large ROM capacity allows for storing a significant amount of program data for complex applications.

Width: 14 mm

The compact width of the microcontroller enables integration into small form factor devices and systems.

Maximum Clock Frequency: 25 MHz

A high clock frequency allows for fast data processing and efficient operation in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures proper soldering and component reliability during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature ensures proper soldering and component reliability during manufacturing.

Length: 14 mm

The compact length of the microcontroller enables integration into small form factor devices and systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture provides efficient processing capabilities for a wide range of applications.

RAM Bytes: 32768

The large RAM capacity enables temporary data storage for efficient multitasking and data processing.

Technology: CMOS

Complementary metal-oxide semiconductor technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and reliable electrical connections during installation.

Nominal Supply Voltage: 3.3 V

The stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

Pulse-width modulation channels enable precise control of connected devices, making it suitable for applications requiring variable speed or intensity control.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and reprogramming of the microcontroller's firmware, enhancing flexibility for future enhancements.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting and compact design, making it suitable for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates a moderate level of sensitivity to moisture during storage and handling, requiring appropriate precautions during assembly.

Speed: 80 rpm

The 80 revolutions per minute speed specification indicates the performance capability of the motor control features of the microcontroller.

No. of I/O Lines: 69

The high number of I/O lines enables connection to multiple external devices and peripherals, providing versatility for various application requirements.

Technical Specifications

Microcontrollers TM4C123BH6PZI attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

69

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TM4C123BH6PZI Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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