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TM4C123BH6PMI7R

Texas Instruments

TM4C123BH6PMI7R by Texas Instruments

TM4C123BH6PMI7R by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 262144 ROM words, and 32768 RAM bytes. It features 12 ADC channels, 32 DMA channels, and peripherals like PWM(16) and UART(8). Ideal for industrial applications requiring low power consumption and high-speed processing up to 25 MHz.

Median Price

$7.584

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,495 parts In-Stock

1+ parts

$7.584

100+ parts

$6.183

1k+ parts

$4.122

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7,495

$7.584

$6.183

$4.122

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Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

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$6.678

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150

$6.678

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Digiode

USA . 1,093 parts In-Stock

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$7.205

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1,093

$7.205

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Vyrian

USA . 8,871 parts In-Stock

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8,871

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Distributors (Availability)

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Ampacity Inc.

Singapore . 7,230 parts In-Stock

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$6.450

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7,230

$6.450

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Semicontronic

India . 7,156 parts In-Stock

1+ parts

$6.450

100+ parts

$6.289

1k+ parts

$6.256

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7,156

$6.450

$6.289

$6.256

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Continental Prestige Electronics

USA . 6,802 parts In-Stock

1+ parts

$6.678

100+ parts

-

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$6.544

6,802

$6.678

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$6.544

Netroflash

USA . 500 parts In-Stock

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$6.678

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500

$6.678

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Corphita

USA . 4,690 parts In-Stock

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$6.826

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4,690

$6.826

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AZTECH Wire

Italy . 1,088 parts In-Stock

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$10.380

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Microchip USA

USA . 2,153 parts In-Stock

1+ parts

$15.740

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$15.510

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$15.400

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$15.290

2,153

$15.740

$15.510

$15.400

$15.290

Corohmni

South Africa . 102 parts In-Stock

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$19.294

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102

$19.294

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Parana Technologies

USA . 1,664 parts In-Stock

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$72.357

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1,664

$72.357

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DigiPath Technology Company

USA . 762 parts In-Stock

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$79.674

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$73.300

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762

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$73.300

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ChromeModa Solutions

Germany . 5,793 parts In-Stock

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$81.300

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$66.666

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5,793

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IDEA Electronic Components Group

UK . 948 parts In-Stock

1+ parts

$81.300

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$77.235

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$73.170

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948

$81.300

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$73.170

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Argo Parts USA

USA . 3,602 parts In-Stock

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3,602

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Overview

Unlock the possibilities with the TM4C123BH6PMI7R microcontroller from Texas Instruments, a trusted name in quality electronics. Ideal for a wide range of applications, this powerful device offers integrated cache, multiple ADC and DMA channels, and a variety of peripherals to streamline your projects. With a low profile package and industrial temperature grade, this microcontroller is designed for reliability and performance. Experience the value of advanced technology and seamless connectivity with the TM4C123BH6PMI7R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection, making the microcontroller suitable for a variety of environments.

Integrated Cache: YES

The integrated cache enhances the processing speed and efficiency of the microcontroller, allowing for faster data access and execution.

Surface Mount: YES

The surface mount capability simplifies the installation and mounting process, making it easier to integrate the microcontroller into different electronic systems.

Maximum Supply Voltage: 1.32 V

The ability to operate at a maximum supply voltage of 1.32V provides flexibility in power supply options and helps optimize power consumption.

On Chip Data RAM Width: 8

The 8-bit width of on-chip data RAM allows for efficient data storage and processing, enhancing the performance of the microcontroller.

Package Shape: SQUARE

The square package shape offers a compact and space-efficient design, making it ideal for applications where size and form factor are critical considerations.

Bit Size: 32

The 32-bit architecture offers improved processing capacity and data handling capabilities, enabling the microcontroller to perform complex tasks with speed and accuracy.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options and flexibility for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers easy assembly, space-saving design, and compatibility with modern mounting techniques.

Minimum Supply Voltage: 1.08 V

The microcontroller's ability to operate at a low minimum supply voltage of 1.08V enables energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the microcontroller can withstand high-temperature environments and is suitable for industrial and automotive applications.

CPU Family: CORTEX-M4F

Being part of the CORTEX-M4F CPU family, this microcontroller offers advanced processing capabilities, energy efficiency, and a wide range of features suitable for various applications.

Minimum Operating Temperature: -40 °C

The microcontroller's ability to operate at temperatures as low as -40°C makes it suitable for use in extreme cold environments or industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent connectivity, corrosion resistance, and longevity to ensure reliable operation and performance over time.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors and signals, making it versatile and suitable for applications requiring analog-to-digital conversion.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer and processing, reducing the CPU workload and improving overall system performance.

Terminal Position: QUAD

The quad terminal position offers a secure and stable connection, minimizing signal interference and ensuring reliable operation in various electronic systems.

ROM Words: 262144

With a ROM size of 262144 words, the microcontroller can store a large amount of program data and instructions, enabling the execution of complex algorithms and applications.

Maximum Seated Height: 1.6 mm

The maximum seated height of 1.6mm allows for a low-profile design, making the microcontroller suitable for compact electronic devices and space-constrained applications.

RAM Words: 32

The 32 RAM words provide sufficient memory capacity for data storage and processing, enhancing the microcontroller's performance in handling multiple tasks simultaneously.

Width: 10 mm

With a width of 10mm, the microcontroller offers a compact form factor, making it suitable for applications where space is limited and size constraints exist.

Data EEPROM Size: 2K

The 2K data EEPROM size allows for non-volatile data storage, enabling the microcontroller to retain critical information even when power is removed or interrupted.

Technical Specifications

Microcontrollers TM4C123BH6PMI7R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

43

No. of Serial I/Os:

20

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

54.9 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(4), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TM4C123BH6PMI7R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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