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TM4C1237H6PZIR

Texas Instruments

TM4C1237H6PZIR by Texas Instruments

TM4C1237H6PZIR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 32768 bytes RAM, and 262144 ROM words. It features 22-Ch 12-Bit ADC channels, CAN connectivity, and operates at a max clock frequency of 25 MHz. Ideal for industrial applications requiring high-speed data processing and extensive peripheral support.

Median Price

$9.246

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,776 parts In-Stock

1+ parts

$9.246

100+ parts

$7.538

1k+ parts

$5.025

10k+ parts

-

2,776

$9.246

$7.538

$5.025

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$7.035

100+ parts

-

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500

$7.035

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Digiode

USA . 191 parts In-Stock

1+ parts

$8.784

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191

$8.784

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Vyrian

USA . 4,333 parts In-Stock

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4,333

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Distributors (Availability)

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Netroflash

USA . 500 parts In-Stock

1+ parts

$7.035

100+ parts

-

1k+ parts

$6.683

10k+ parts

$6.543

500

$7.035

-

$6.683

$6.543

Ampacity Inc.

Singapore . 2,601 parts In-Stock

1+ parts

$7.860

100+ parts

-

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2,601

$7.860

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Corphita

USA . 3,561 parts In-Stock

1+ parts

$8.321

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3,561

$8.321

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Microchip USA

USA . 2,682 parts In-Stock

1+ parts

$19.700

100+ parts

$19.420

1k+ parts

$19.280

10k+ parts

$19.140

2,682

$19.700

$19.420

$19.280

$19.140

AZTECH Wire

Italy . 694 parts In-Stock

1+ parts

$20.390

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-

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694

$20.390

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Parana Technologies

USA . 2,120 parts In-Stock

1+ parts

$33.055

100+ parts

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$118.109

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2,120

$33.055

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$118.109

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DigiPath Technology Company

USA . 50 parts In-Stock

1+ parts

$36.398

100+ parts

$33.486

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50

$36.398

$33.486

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ChromeModa Solutions

Germany . 2,810 parts In-Stock

1+ parts

$37.141

100+ parts

$30.456

1k+ parts

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2,810

$37.141

$30.456

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IDEA Electronic Components Group

UK . 2,138 parts In-Stock

1+ parts

$37.141

100+ parts

$35.284

1k+ parts

$33.427

10k+ parts

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2,138

$37.141

$35.284

$33.427

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Corohmni

South Africa . 49 parts In-Stock

1+ parts

$43.476

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$43.476

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QUARKTWIN TECHNOLOGY LTD

USA . 21,116 parts In-Stock

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Continental Prestige Electronics

USA . 3,844 parts In-Stock

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Argo Parts USA

USA . 3,090 parts In-Stock

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3,090

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Component Stockers USA

USA . 2,786 parts In-Stock

1+ parts

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$5.460

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2,786

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$5.460

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Infinite Electronics LLP (Excess)

. 1,005 parts In-Stock

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1,005

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Overview

Elevate your projects with the TM4C1237H6PZIR microcontroller from Texas Instruments, a leader in innovative technology solutions. Designed with precision and reliability in mind, this versatile device offers unparalleled performance in a compact package. Whether you're working on IoT applications, robotics, or industrial control systems, this microcontroller delivers unmatched value, efficiency, and connectivity. Trust Texas Instruments to power your next breakthrough with the TM4C1237H6PZIR.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the microcontroller, making it a reliable choice.

Surface Mount

YES - The surface mount design allows for easy installation and integration into electronic devices.

Maximum Supply Voltage

1.32 V - With a high maximum supply voltage, this microcontroller can handle various power requirements.

Package Shape

SQUARE - The square shape of the package ensures compatibility with standard mounting configurations.

Bit Size

32 - A 32-bit microcontroller offers high performance and processing capabilities.

Power Supplies (V)

1.2,3.3 - The availability of multiple power supply options provides flexibility in design and application.

No. of Terminals

100 - With a high number of terminals, this microcontroller can support a wide range of connections.

Package Style (Meter)

FLATPACK, LOW PROFILE, FINE PITCH - The various package styles offer versatility in mounting options for different devices.

Minimum Supply Voltage

1.08 V - The low minimum supply voltage allows for efficient power consumption in operation.

Maximum Operating Temperature

85 °C - The high maximum operating temperature ensures reliability in various environmental conditions.

CPU Family

CORTEX-M4F - Being part of the Cortex-M4F family, this microcontroller offers advanced processing capabilities.

Minimum Operating Temperature

40 °C - The low minimum operating temperature allows for use in extreme cold environments.

Terminal Finish

NICKEL PALLADIUM GOLD - This terminal finish provides high conductivity and corrosion resistance for reliable connections.

ADC Channels

YES - The presence of analog-to-digital converter channels enables the microcontroller to interface with analog sensors and devices.

DMA Channels

YES - Direct Memory Access channels improve data transfer speed and efficiency in multitasking applications.

Terminal Position

QUAD - The quad terminal position ensures secure and stable connections in various applications.

ROM Words

262144 - With a large ROM capacity, this microcontroller can store a significant amount of program code.

Maximum Seated Height

1.6 mm - The low profile design with a maximum seated height of 1.6mm allows for compact device assembly.

Width

14 mm - The 14mm width offers compatibility with standard spacing requirements in electronic circuits.

Data EEPROM Size

2K - The EEPROM size of 2K allows for non-volatile data storage in the microcontroller.

Peripherals

BOD, COMPARATOR(19), DMA(32), POR, PWM, RTC, TIMER(13), WDT(2) - The numerous peripherals enhance functionality and versatility in different applications.

Maximum Clock Frequency

25 MHz - A high maximum clock frequency of 25 MHz enables fast processing speeds in real-time applications.

Maximum Time At Peak Reflow Temperature (s)

30 - With a reflow time of 30 seconds at peak temperature, this microcontroller ensures reliable soldering.

Peak Reflow Temperature °C

260 - The high peak reflow temperature of 260°C ensures proper soldering and component stability.

Length

14 mm - The 14mm length offers compatibility with standard electronic device dimensions.

Temperature Grade

INDUSTRIAL - This microcontroller is designed to withstand industrial temperature requirements for reliable performance.

Peripheral IC Type

MICROCONTROLLER, RISC - The RISC architecture of this microcontroller enhances processing efficiency and speed.

RAM Bytes

32768 - The 32768 bytes of RAM provide ample memory for storage and data manipulation.

Technology

CMOS - Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity.

Terminal Form

GULL WING - The gull-wing terminal form factor allows for easy surface mounting and reliable connections.

Analog To Digital Convertors

22-Ch 12-Bit - The 22 analog-to-digital converter channels with 12-bit resolution enable precise analog signal conversion.

Nominal Supply Voltage

1.2 V - The nominal supply voltage of 1.2V ensures stable and efficient power delivery to the microcontroller.

Connectivity

CAN, I2C(6), SSI(4), UART(8), USB - Multiple connectivity options allow for versatile communication interfaces in different applications.

ROM Programmability

FLASH - The flash ROM programmability enables easy and flexible firmware updates in the microcontroller.

Terminal Pitch

0.5 mm - The fine terminal pitch of 0.5mm allows for high-density mounting and compact circuit design.

Moisture Sensitivity Level (MSL)

3 - With an MSL level of 3, this microcontroller can withstand moderate exposure to moisture during handling and storage.

Speed

80 rpm - The 80 rpm speed capability ensures timely and efficient processing of data and instructions.

On Chip Program ROM Width

8 - The 8-bit on-chip program ROM width enables efficient program execution and storage.

No. of I/O Lines

69 - With 69 I/O lines, this microcontroller offers ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers TM4C1237H6PZIR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

69

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C(6), SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(19), DMA(32), POR, PWM, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Trade Compliance

TM4C1237H6PZIR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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