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TM4C1237H6PMIR

Texas Instruments

TM4C1237H6PMIR by Texas Instruments

TM4C1237H6PMIR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 262144 ROM words, 32768 RAM bytes, and 12-Ch 12-Bit ADC channels. Ideal for industrial applications requiring CAN, I2C, SPI connectivity at max clock frequency of 25 MHz.

Median Price

$8.849

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,000 parts In-Stock

1+ parts

$8.849

100+ parts

$7.214

1k+ parts

$4.809

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3,000

$8.849

$7.214

$4.809

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Distributors (In-Stock)

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Digiode

USA . 268 parts In-Stock

1+ parts

$8.407

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268

$8.407

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Chip Stock

USA . 17,500 parts In-Stock

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17,500

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Vyrian

USA . 4,167 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,624 parts In-Stock

1+ parts

$7.520

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-

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$7.520

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Corphita

USA . 1,123 parts In-Stock

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$7.964

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$7.964

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AZTECH Wire

Italy . 385 parts In-Stock

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$8.250

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385

$8.250

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Microchip USA

USA . 1,863 parts In-Stock

1+ parts

$18.360

100+ parts

$18.100

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$17.970

10k+ parts

$17.840

1,863

$18.360

$18.100

$17.970

$17.840

Corohmni

South Africa . 469 parts In-Stock

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$53.373

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469

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Parana Technologies

USA . 829 parts In-Stock

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$55.637

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DigiPath Technology Company

USA . 1,817 parts In-Stock

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$61.263

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$56.362

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$61.263

$56.362

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ChromeModa Solutions

Germany . 5,214 parts In-Stock

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$62.513

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$51.261

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$62.513

$51.261

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IDEA Electronic Components Group

UK . 426 parts In-Stock

1+ parts

$62.513

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$59.387

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$56.262

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426

$62.513

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$56.262

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Continental Prestige Electronics

USA . 2,034 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,796 parts In-Stock

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Argo Parts USA

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Netroflash

USA . 500 parts In-Stock

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Overview

Unlock the endless possibilities of innovation with the TM4C1237H6PMIR by Texas Instruments. As a trusted leader in microcontroller technology, Texas Instruments offers unmatched quality and reliability in every product. Ideal for a wide range of applications, this microcontroller provides seamless connectivity and advanced features to bring your projects to life. With its powerful performance and cost-effective design, the TM4C1237H6PMIR delivers exceptional value and benefits to customers looking to elevate their creations to the next level. Experience the difference with Texas Instruments and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing processes.

Maximum Supply Voltage: 1.32 V

Supports low voltage operation, making it suitable for energy-efficient applications.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board.

Bit Size: 32

Offers high processing power and capability for complex operations.

Power Supplies (V): 1.2,3.3

Provides flexibility in power requirements for different applications.

No. of Terminals: 64

Offers a sufficient number of connections for various input/output functions.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Provides different options for packaging, allowing for versatility in design and integration.

Minimum Supply Voltage: 1.08 V

Supports low voltage operation, enabling energy-efficient performance.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments, increasing its usability.

CPU Family: CORTEX-M4F

Belongs to a powerful and efficient processor family for high-performance applications.

Minimum Operating Temperature: -40 °C

Can operate in extremely low-temperature conditions, expanding its range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Allows for analog-to-digital conversion, a critical function in many applications.

DMA Channels: YES

Supports direct memory access for efficient data transfer and processing.

Terminal Position: QUAD

Quad terminal position allows for easy mounting and soldering onto the circuit board.

ROM Words: 262144

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design saves space and allows for compact device design.

Width: 10 mm

Compact width for fitting into small spaces or devices.

Data EEPROM Size: 2K

Provides non-volatile memory storage for critical data retention.

Peripherals: BOD, COMPARATOR(2), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

A variety of peripheral functions for added functionalities and versatility in applications.

Maximum Clock Frequency: 25 MHz

High clock frequency for fast and efficient processing speeds.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during assembly processes.

Length: 10 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with extended temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses RISC architecture for efficient and high-performance operations.

RAM Bytes: 32768

Large RAM capacity for data storage and manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for easy and secure soldering onto the PCB.

Analog To Digital Convertors: 12-Ch 12-Bit

Multiple ADC channels with high resolution for accurate analog signal conversion.

Nominal Supply Voltage: 1.2 V

Stable and standard supply voltage for consistent performance.

PWM Channels: YES

Pulse-width modulation channels for precise control over analog outputs.

Connectivity: CAN, I2C(4), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Various connectivity options for communication and interfacing with other devices.

ROM Programmability: FLASH

Flash ROM for easy and efficient programming and updating of firmware.

Terminal Pitch: 0.5 mm

Fine pitch terminals for compact PCB layout and integration.

Moisture Sensitivity Level (MSL): 3

Withstands moderate moisture exposure during storage and operation.

Speed: 80 rpm

Suitable for applications with rotational speed control requirements.

On Chip Program ROM Width: 8

On-chip ROM for storing program instructions for efficient execution.

No. of I/O Lines: 43

Provides a sufficient number of input/output pins for external connections and interfacing.

Technical Specifications

Microcontrollers TM4C1237H6PMIR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C(4), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TM4C1237H6PMIR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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