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TM4C1237H6PGEIR

Texas Instruments

TM4C1237H6PGEIR by Texas Instruments

TM4C1237H6PGEIR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 24-Ch 12-Bit ADC channels and 32 DMA channels. It operates at a max clock frequency of 25 MHz and features various peripherals like PWM, RTC, and USB connectivity. Ideal for industrial applications requiring high-speed data processing in compact designs.

Median Price

$8.990

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 450 parts In-Stock

1+ parts

$8.990

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450

$8.990

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Distributors (In-Stock)

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Digiode

USA . 547 parts In-Stock

1+ parts

$8.540

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547

$8.540

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Vyrian

USA . 7,767 parts In-Stock

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7,767

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,444 parts In-Stock

1+ parts

$8.091

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4,444

$8.091

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Microchip USA

USA . 3,418 parts In-Stock

1+ parts

$21.230

100+ parts

$20.920

1k+ parts

$20.770

10k+ parts

$20.620

3,418

$21.230

$20.920

$20.770

$20.620

AZTECH Wire

Italy . 497 parts In-Stock

1+ parts

$21.840

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497

$21.840

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Parana Technologies

USA . 1,177 parts In-Stock

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$57.904

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1,177

$57.904

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DigiPath Technology Company

USA . 303 parts In-Stock

1+ parts

$63.760

100+ parts

$58.659

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303

$63.760

$58.659

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ChromeModa Solutions

Germany . 4,825 parts In-Stock

1+ parts

$65.061

100+ parts

$53.350

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4,825

$65.061

$53.350

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IDEA Electronic Components Group

UK . 349 parts In-Stock

1+ parts

$65.061

100+ parts

$61.808

1k+ parts

$58.555

10k+ parts

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349

$65.061

$61.808

$58.555

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Overview

Experience the unmatched performance and reliability of the TM4C1237H6PGEIR microcontroller by Texas Instruments. With cutting-edge technology and a wide range of applications, this product offers exceptional value to customers looking for top-tier quality and innovation. From industrial automation to consumer electronics, this microcontroller delivers seamless connectivity and advanced functionality. Trust in Texas Instruments, a leading manufacturer in the industry, and elevate your projects with the TM4C1237H6PGEIR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for package body ensures long-term reliability of the microcontroller.

Maximum Supply Voltage: 1.32 V

Allows for flexibility in powering the microcontroller with a higher supply voltage.

CPU Family: CORTEX-M4F

Utilizing the Cortex-M4F CPU family ensures high performance and efficiency in processing tasks.

ROM Words: 262144

Large ROM size allows for storing a significant amount of program data, enabling complex functions to be executed.

Analog To Digital Convertors: 24-Ch 12-Bit

Multiple ADC channels with high bit resolution enable precise analog-to-digital conversion for accurate sensor readings.

Connectivity: CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Wide range of connectivity options ensure compatibility with various communication protocols and peripherals.

Technical Specifications

Microcontrollers TM4C1237H6PGEIR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

105

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C1237H6PGEIR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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